JPH02294057A - Fine pattern structure body and its manufacture - Google Patents

Abstract

PURPOSE:To manufacture a fine pattern structure body at low cost which body has a size of aspect ratio larger than or equal to 1, by boring each through-hole, of a transparent pattern, penetrating in the thickness direction of a base sheet, in an oblique manner with respect to the thickness direction. CONSTITUTION:Through holes 4 are bored obliquely to the thickness direction of a base sheet 1, and the aspect ratio is controlled so as to be larger than or equal to 1. That is, resist patterns 3 divided on the surface and the rear of the base sheet 1 by aperture parts 2 are formed so as to be mutually shifted in the manner in which narrow width parts 3b of the resist pattern on the rear are positioned just under wide width parts 3a of the resist pattern 3 on the surface; etching liquid is sprayed from the surface and the rear of the base sheet 1; the through-holes 4 oblique to the thickness direction are formed. As a result, viewing from the direction vertical to the surface of the base sheet 1, the hole diameter of the through-hole 4 of slit width becomes small apparently, and the aspect ratio can be increased. Thereby the aspect ratio can be controlled to be a high value larger than or equal to 1, and a fine pattern structure body of low manufacturing cost can be obtained.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is based on the ratio of the thickness of the base sheet (plate thickness) to the hole diameter or slit width, that is, the ratio of the thickness of the base sheet to the hole diameter or slit width, that is, the ratio of the thickness of the base sheet to the hole diameter or the slit width (hereinafter referred to as aspect ratio). This invention relates to a fine/multi-turn structure having fine through-hole no-turns with a ratio of 1 or more, and a method for manufacturing the same. [Prior technology] Micro-no-turn structure beams are used for frames, various metal masks, shower masks, circuit boards, connectors, two-layer coders, slit plates, various filters, etc., but the manufacturing method is generally This is done using IR press processing or etching. Other methods include ion milling to form holes and slits with large aspect ratios, processing methods using laser t-
A method has also been proposed, as in Japanese Patent No. 40869, in which a plurality of plates processed into the same shape with reduced thickness are stacked on top of each other.

[Problem to be solved by the invention]

However, conventional press working or etching methods produce through-holes with an aspect ratio of 1 or more! It is difficult to form a turn, and the method of stacking multiple plates makes it extremely difficult to accurately determine the relative positions of the plates. It is difficult to obtain high accuracy.

Further, the above-mentioned methods using ion/milling processing or laser processing have a slow processing speed, and there is a risk of damage to parts that are not desired to be processed, as well as an increase in the cost of processing equipment.

Therefore, an object of the present invention is to provide a fine 9-turn structure and a method for fabricating the same, which can easily control the aspect ratio to a high value of 1 or more and are advantageous in terms of manufacturing cost and production efficiency. .

Means for Solving the Ca Problem] In order to solve the above problems, the present invention provides a means of forming through holes in a diagonal direction with respect to the thickness direction of the base sheet, thereby controlling the aspect ratio to 1 or more. Lectured.

That is, the present invention provides a micro-turn structure in which a pattern of fine holes penetrating through the thickness of a base sheet is formed, and each core hole and each nine-turn hole are formed in the base sheet. Penetrates diagonally to the thickness direction and has an aspect ratio of 1
The present invention provides a fine pattern structure characterized by the above features.

Furthermore, the present invention forms a first resist seta partitioned by an opening on the front surface of the base sheet, and also forms a second resist seta partitioned by an opening corresponding to the first resist seta on the back surface. A resist pattern is formed, and an etching solution is sprayed from the front and back surfaces of the base sheet to etch the base sheet in the thickness direction through the openings of the first and second resist layers to form fine through holes.・In the method for manufacturing a fine pattern structure in which a flat turn is formed, the positional relationship between the opening of the first resist pattern and the corresponding opening of the second resist pattern is oblique to each other. The present invention provides a manufacturing method characterized in that these resists } z4 turns are formed at positions offset from each other so as to face each other, and then the above-mentioned etching is performed. [Function] In the micro-turn structure of the present invention, each of the through holes and the main turns penetrates diagonally with respect to the thickness direction of the base sheet, so that the holes perpendicular to the surface of the base sheet The diameter of the through hole or the slit width when viewed from the same direction is apparently smaller, making it possible to significantly increase the aspect ratio.

In addition, in the manufacturing method of the present invention, in order to form the above-mentioned diagonal through holes, the resist I-turns formed on the front and back surfaces of the base sheet are slightly shifted so that the openings are diagonally opposed to each other. By etching through these openings in step 18, naturally oblique through holes are formed, thereby forming through holes IJ? It becomes possible to easily control Yuichi's aspect ratio to 1 or more. [Examples] The present invention will be described below with reference to illustrated embodiments.

First, as shown in the IF diagram (4), a base sheet 10 made of a thin h metal plate used, for example, in a p-frame, has a resist film partitioned by openings 2 on the front and back surfaces. 73 are respectively formed. In this resist pattern 3, wide parts 3a and narrow parts 3b are alternately formed through openings 2, and the resist pattern 30 on the surface of the base sheet 1 has wide parts 3
They are formed so that they are shifted from each other so that the narrow part 3b of the resist pattern on the back side is located directly below the pattern a. Therefore, each opening 2 of the resist pattern 3 on the front side of the base sheet 1 faces diagonally to each opening 2 of the corresponding resist pattern 3 on the back side as shown by the broken line a. In this state, a color etching solution is sprayed on the front and back surfaces of the base sheet 1 in the same manner as before. As a result, the base sheet 1 is etched isotropically from each opening 2 of the nof turn 3, and as shown in FIG. is formed. By dissolving and removing the resist film 73 at a high temperature, the
A fine, thin-turn structure 5 as shown in FIG. 1 can be obtained.

In this case, the hole diameter or slit width of the through hole is the width in the direction perpendicular to the surface of the base sheet 1, as shown in the figure, and is represented by @W#, and the aspect ratio is It can be kept to a small value of 1 or more.

FIG. 2 shows another embodiment of the present invention, in which the method of forming resist lean on the base sheet is basically exactly the same as the embodiment shown in FIG. This is because the narrow portion 3b of the resist pattern is formed as halftone dots. Therefore, the etching progresses on this narrow portion 3b as well, albeit at a slow speed, and the shape after the etching process is as shown in FIG. 2(B), with the front and back surfaces of the base sheet 1 having an uneven shape. However, the aspect ratio (T7W
) Vi can be controlled to 1 or more as in the embodiment shown in FIG.

FIG. 3 shows still another example of the present invention, in which resist turns 3 with openings 2 partitioned at equal intervals are formed on both the front and back surfaces of the base sheet 1. However, in this case as well, the resist on the front surface and the middle resistor 73 are the resists on the back surface.
As a result, the openings 2 on the front and back surfaces are diagonally opposed to each other as shown by the broken line @a''. By etching from the front and back sides,
As in the case of the embodiment shown in FIG.
It is formed obliquely with respect to the thickness direction, and as a result,
As shown in FIG. 3(B), the aspect ratio CTA can be controlled to 1 or more.

Note that the size of the aspect ratio can be appropriately determined by taking into account the size of the opening in the resist pattern, the size of the positional shift between the openings in the resist pattern on the front and back sides of the base sheet, and the like.

〔Effect of the invention〕

As detailed above, in the present invention, each of the transparent 9-turn through holes penetrating the base sheet in the thickness direction is perforated diagonally with respect to the thickness direction. It is now possible to manufacture fine-sized, 9-terrestrial structures at low cost and with high precision, and there is no need to paste two base sheets together as in the past, and it is possible to produce fine-sized structures using conventional ion milling or laser processing. It has remarkable effects such as h, which has the risk of damaging the processed part.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view illustrating the method of manufacturing a microstructure/fine structure according to the present invention step by step, and FIGS. 2 and 3 are cross-sectional views showing other embodiments of the present invention. 1... Base material sheet, 2... Opening, . 3... Resist pattern, 4... Through hole, 5... Fine/mother turn structure. Figure 1

Claims (1)

[Scope of Claims] 1. A fine pattern structure in which a fine hole pattern penetrating in the thickness direction of a base sheet is formed, wherein each hole of the hole pattern extends through the thickness of the base sheet. 1. A fine pattern structure that penetrates diagonally with respect to the direction and has an aspect ratio of 1 or more. 2. Form a first resist pattern partitioned by openings on the front surface of the base sheet, and also form the first resist pattern on the back surface.
A second resist pattern separated by an opening corresponding to the resist pattern of
A resist pattern is formed, and an etching solution is sprayed from the front and back surfaces of the base sheet to etch the base sheet in the thickness direction through the openings of the first and second resist patterns to form a fine through-hole pattern. In the method for manufacturing a fine pattern structure, the openings of the first resist pattern and the corresponding openings of the second resist pattern are offset from each other so that they diagonally face each other. A manufacturing method characterized by forming these resist patterns and then performing the above etching.