JPH02285635A - Semiconductor wafer carrier cleaning device - Google Patents
Semiconductor wafer carrier cleaning deviceInfo
- Publication number
- JPH02285635A JPH02285635A JP1108636A JP10863689A JPH02285635A JP H02285635 A JPH02285635 A JP H02285635A JP 1108636 A JP1108636 A JP 1108636A JP 10863689 A JP10863689 A JP 10863689A JP H02285635 A JPH02285635 A JP H02285635A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- carrier
- pure water
- semiconductor wafer
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 40
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000008213 purified water Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract 3
- 238000001035 drying Methods 0.000 abstract 1
- 239000000969 carrier Substances 0.000 description 4
- 239000010985 leather Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は 半導体ウェハキャリアに関し 特に半導体ウ
ェハキャリア洗浄装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to semiconductor wafer carriers, and more particularly to a semiconductor wafer carrier cleaning apparatus.
従来の技術
従来 この種の半導体ウェハキャリア洗浄装置は キャ
リア洗浄槽のみから成ってい九 そして、半導体ウェハ
キャリアをキャリア洗浄槽で洗浄する時は ジェット洗
浄で一定時肌 例えば５分間洗浄するのみであっｔら
発明が解決しようとする課題
上述した従来の半導体ウェハキャリア洗浄装置は、 半
導体ウェハキャリアの洗浄時間を一定にしているた取
パーティクルの多いキャリアとか一定時皿 例えば５分
間では取れにくいパーティクルのついたキャリアへ パ
ーティクルを取り切らずに洗浄を終了してしまうという
欠点がある。本発明は上述の課題に鑑みてなされたもの
で、半導体ウェハキャリアに付着しているパーティクル
を常に一定値以下にできる半導体ウェハキャリア洗浄装
置を提供することを目的としている。Conventional Technology Conventionally, this type of semiconductor wafer carrier cleaning equipment consists only of a carrier cleaning tank9.And when a semiconductor wafer carrier is cleaned in the carrier cleaning tank, the skin is only cleaned for a certain period of time, for example, for 5 minutes, using jet cleaning. Problems to be Solved by the Invention The above-mentioned conventional semiconductor wafer carrier cleaning apparatus has a fixed cleaning time for the semiconductor wafer carrier.
For carriers with a lot of particles, or carriers with particles that are difficult to remove within a certain period of time, such as carriers with particles that are difficult to remove within 5 minutes, there is a drawback that cleaning ends without removing the particles. The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a semiconductor wafer carrier cleaning device that can always keep particles attached to a semiconductor wafer carrier below a certain value.
課題を解決するための手段
本発明の半導体ウェハキャリア洗浄装置（戴 ジェット
洗浄後、キャリア洗浄槽下部にたまった純水のパーティ
クルをカウントするパーティクルカウンターとカウント
されたパーティクルの数が指定値以下かどうかを判定す
る比較器を備えたものである。Means for Solving the Problems Semiconductor wafer carrier cleaning apparatus of the present invention (Dai) A particle counter that counts particles of pure water accumulated at the bottom of a carrier cleaning tank after jet cleaning, and whether the number of counted particles is less than a specified value. It is equipped with a comparator that determines the
作用
上述した本発明の半導体ウェハキャリア洗浄装置は、
キャリアをジェット洗浄した後、キャリア洗浄槽の下部
にたまった純水に含まれるパーティクルをパーティクル
カウンターでカウントし 数値が指定値以下になった時
に比較器で判定し 洗浄を終了する。以上より半導体ウ
ェハキャリアに付着しているパーティクルを常に一定値
以下にできる。Function The semiconductor wafer carrier cleaning apparatus of the present invention described above has the following features:
After jet cleaning the carrier, a particle counter counts the particles contained in the pure water that has accumulated at the bottom of the carrier cleaning tank, and when the number falls below a specified value, a comparator determines and the cleaning ends. As described above, the number of particles attached to the semiconductor wafer carrier can always be kept below a certain value.
実施例
本発明について図面を参照して説明する。第１図は本発
明の一実施例を横からみた断面図である。Embodiments The present invention will be described with reference to the drawings. FIG. 1 is a sectional view of an embodiment of the present invention viewed from the side.
搬送用アームでキャリア３をキャリア洗浄槽１中のキャ
リア受は台２に入れて、ジェットノズル５により、ジェ
ット洗浄を開始する。洗浄開始と同時にＵ１水ポンプ１
０により、ジェット洗浄後たまった純水４を配管６を通
してレーザーパーティクルカウンター９に注入し 純水
４中のパーティクルをカウントする。純水４中のパーテ
ィクルの数が一定レベル以下、例えば１０個以下になれ
ば 比較器１１にて判定し キャリア３の洗浄を終了し
、キャリア３を乾燥する。ここで、純水４は常１賑 排
水管７、８により排水されている。The carrier 3 is placed into the carrier tray 2 in the carrier cleaning tank 1 using the transfer arm, and jet cleaning is started using the jet nozzle 5. U1 water pump 1 at the same time as cleaning starts
0, the pure water 4 accumulated after jet cleaning is injected into the laser particle counter 9 through the pipe 6, and the particles in the pure water 4 are counted. If the number of particles in the pure water 4 is below a certain level, for example 10 or less, it is determined by the comparator 11, the cleaning of the carrier 3 is completed, and the carrier 3 is dried. Here, the pure water 4 is always drained through drain pipes 7 and 8.
発明の詳細
な説明したように本発明は 半導体ウェハキャリアを洗
浄中にパーティクルをカウントシ 判定する機構を有
することによって、洗浄直後、キャリアに付着している
パーティクルを常に一定値以下にできるという効果があ
る。As described in detail, the present invention has the effect of having a mechanism for counting particles while cleaning a semiconductor wafer carrier, so that the number of particles attached to the carrier can always be kept below a certain value immediately after cleaning. .
第１図は本発明の半導体ウェハキャリア洗浄装置を横か
らみた断面図である。
１・・・・キャリア洗浄抱 ２・・・・キャリア受は念
３・・・・キャリア、 ４・・・・純ｙｋ、 ５−・
・ジェットノズルｋ ６・・・・配管、 ７．８・・・
・排水管、 ９・・・・レザーパーティクルカウンター
１０・・・・排水ポンプ、１１・・・・比較２嵩FIG. 1 is a cross-sectional side view of the semiconductor wafer carrier cleaning apparatus of the present invention. 1... Carrier cleaning hold 2... Career support 3... Carrier 4... Pure yk 5-...
・Jet nozzle k 6...Piping, 7.8...
・Drain pipe, 9... Leather particle counter 10... Drain pump, 11... Comparison 2 volume
Claims (2)
る装置を有する半導体ウェハキャリア洗浄装置。(1) A semiconductor wafer carrier cleaning device having a device for measuring particles in pure water in a carrier cleaning tank.
浄された純水のたまる部分を有していることを特徴とす
る特許請求の範囲第１項記載の半導体ウェハキャリア洗
浄装置。(2) The semiconductor wafer carrier cleaning apparatus according to claim 1, wherein the carrier cleaning tank has a part for cleaning with a jet and a part for collecting purified water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1108636A JPH02285635A (en) | 1989-04-26 | 1989-04-26 | Semiconductor wafer carrier cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1108636A JPH02285635A (en) | 1989-04-26 | 1989-04-26 | Semiconductor wafer carrier cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02285635A true JPH02285635A (en) | 1990-11-22 |
Family
ID=14489822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1108636A Pending JPH02285635A (en) | 1989-04-26 | 1989-04-26 | Semiconductor wafer carrier cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02285635A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5511569A (en) * | 1993-07-20 | 1996-04-30 | Mitsubishi Denki Kabushiki Kaisha | Cleaning apparatus |
| WO2002009859A3 (en) * | 2000-07-31 | 2002-06-13 | Kinetics Chempure Systems Inc | Method and apparatus for blending process materials |
| KR100504642B1 (en) * | 1999-06-03 | 2005-08-03 | 가부시끼가이샤 한도따이 센단 테크놀로지스 | Valuating device for particle weight and dip cleaning system and valuating method for particle adhesive weight |
| US7066191B2 (en) | 2002-04-12 | 2006-06-27 | Kinetics Germany Gmbh | Installation for making available highly pure fine chemicals |
| US7344298B2 (en) | 2002-07-19 | 2008-03-18 | Celerity, Inc. | Method and apparatus for blending process materials |
| US7597012B2 (en) | 2006-06-15 | 2009-10-06 | Hitachi Global Storage Technologies Netherlands B.V. | System and method for using a spray/liquid particle count (LPC) to measure particulate contamination |
| US7905653B2 (en) | 2001-07-31 | 2011-03-15 | Mega Fluid Systems, Inc. | Method and apparatus for blending process materials |
| JP2017176945A (en) * | 2016-03-28 | 2017-10-05 | 三菱マテリアル株式会社 | Electrode plate for plasma treatment apparatus, and manufacturing method and washing device of the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63153825A (en) * | 1986-10-06 | 1988-06-27 | アシンズ コーポレイション | Method and apparatus for continuous recycling of extra-pure liquid for washing semiconductor wafer |
| JPS63308321A (en) * | 1987-06-10 | 1988-12-15 | Nec Corp | Device for washing semiconductor wafer |
| JPS6471133A (en) * | 1987-09-11 | 1989-03-16 | Toshiba Corp | Device for manufacturing semiconductor |
-
1989
- 1989-04-26 JP JP1108636A patent/JPH02285635A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63153825A (en) * | 1986-10-06 | 1988-06-27 | アシンズ コーポレイション | Method and apparatus for continuous recycling of extra-pure liquid for washing semiconductor wafer |
| JPS63308321A (en) * | 1987-06-10 | 1988-12-15 | Nec Corp | Device for washing semiconductor wafer |
| JPS6471133A (en) * | 1987-09-11 | 1989-03-16 | Toshiba Corp | Device for manufacturing semiconductor |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5511569A (en) * | 1993-07-20 | 1996-04-30 | Mitsubishi Denki Kabushiki Kaisha | Cleaning apparatus |
| KR100504642B1 (en) * | 1999-06-03 | 2005-08-03 | 가부시끼가이샤 한도따이 센단 테크놀로지스 | Valuating device for particle weight and dip cleaning system and valuating method for particle adhesive weight |
| WO2002009859A3 (en) * | 2000-07-31 | 2002-06-13 | Kinetics Chempure Systems Inc | Method and apparatus for blending process materials |
| US6923568B2 (en) | 2000-07-31 | 2005-08-02 | Celerity, Inc. | Method and apparatus for blending process materials |
| CN100374189C (en) * | 2000-07-31 | 2008-03-12 | 迅捷公司 | Method and apparatus for blending process materials |
| US7905653B2 (en) | 2001-07-31 | 2011-03-15 | Mega Fluid Systems, Inc. | Method and apparatus for blending process materials |
| US7066191B2 (en) | 2002-04-12 | 2006-06-27 | Kinetics Germany Gmbh | Installation for making available highly pure fine chemicals |
| US7344298B2 (en) | 2002-07-19 | 2008-03-18 | Celerity, Inc. | Method and apparatus for blending process materials |
| US7597012B2 (en) | 2006-06-15 | 2009-10-06 | Hitachi Global Storage Technologies Netherlands B.V. | System and method for using a spray/liquid particle count (LPC) to measure particulate contamination |
| JP2017176945A (en) * | 2016-03-28 | 2017-10-05 | 三菱マテリアル株式会社 | Electrode plate for plasma treatment apparatus, and manufacturing method and washing device of the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02285635A (en) | Semiconductor wafer carrier cleaning device | |
| KR950005347A (en) | Exhaust Treatment System in Polishing Equipment | |
| JPS5730341A (en) | Substrate processing device | |
| GB2318075A (en) | Method and apparatus for washing silicon ingot with water to remove particulate matter | |
| CA2047943A1 (en) | Leucocyte depleting filter device and method of use | |
| SE9801343L (en) | Methods and equipment for a dishwasher | |
| JPS57194016A (en) | Rinsing equipment by ultrafiltration | |
| JP3068404B2 (en) | Semiconductor substrate cleaning equipment | |
| JPS62156659A (en) | Method and apparatus for cleaning | |
| JPH0474420A (en) | Apparatus and method for cleaning | |
| CN219401366U (en) | Device for storing semiconductor silicon wafers to be cleaned | |
| JPS62195130A (en) | Wet type semiconductor manufacturing equipment | |
| JPS6457721A (en) | Wafer cleaning equipment | |
| JPS5714196A (en) | Cleaning ball | |
| JPH05217988A (en) | Washing device | |
| JPH03233930A (en) | Cleaning method for semiconductor device | |
| JPS5599727A (en) | Continuous surface treatment device | |
| JP3330966B2 (en) | Bath equipment with circulation cleaning device | |
| JPS52145066A (en) | Water level measuring device | |
| JPH0446875Y2 (en) | ||
| JPS5342442A (en) | Cleaner for aerating ejector | |
| JPH04290432A (en) | Semiconductor manufacturing device | |
| KR920003813B1 (en) | Apparatus for treating useless photosensitive material | |
| RU2070544C1 (en) | Arrangement for purifying water from impurities and gases | |
| JPS6060441A (en) | Smoke exhauster |