JPH02285054A - Fe-ni alloy for lead frame excellent in etching workability - Google Patents
Fe-ni alloy for lead frame excellent in etching workabilityInfo
- Publication number
- JPH02285054A JPH02285054A JP10651389A JP10651389A JPH02285054A JP H02285054 A JPH02285054 A JP H02285054A JP 10651389 A JP10651389 A JP 10651389A JP 10651389 A JP10651389 A JP 10651389A JP H02285054 A JPH02285054 A JP H02285054A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- weight
- less
- etching
- grain size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 43
- 229910000990 Ni alloy Inorganic materials 0.000 title claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 20
- 239000012535 impurity Substances 0.000 claims abstract description 19
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims abstract description 11
- 239000013078 crystal Substances 0.000 claims description 7
- 238000000137 annealing Methods 0.000 abstract description 6
- 238000005096 rolling process Methods 0.000 abstract description 5
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- 229910052748 manganese Inorganic materials 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 2
- 229910052717 sulfur Inorganic materials 0.000 abstract description 2
- 230000001105 regulatory effect Effects 0.000 abstract 6
- 239000000203 mixture Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Heat Treatment Of Steel (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、エツチング加工性に優れた集積回路素子のリ
ードフレーム用Ｆｅ−Ｎｉ系合金に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an Fe--Ni alloy for use in lead frames of integrated circuit devices that has excellent etching processability.
集積回路用素子のリードフレーム用材料としては、Ｆｅ
−４２％Ｎｉ、 Ｆｅ−５０％Ｎｉをはじめとして、
Ｆｅ−２９Ｎ １−１７Ｃｏ合金（コバール）等のＦｅ
−Ｎｉ系合金が使用されている。Fe is a material for lead frames of integrated circuit elements.
-42%Ni, Fe-50%Ni, etc.
Fe-29N 1-17Co alloy (Kovar) etc.
-Ni alloy is used.
近年、集積回路素子の高集積化に伴ってリードは非常に
多ビン（リード）となり、複雑化して来ており、従来６
４ビンクラスが主体であったエツチング加工も１６０〜
２４０ビン、さらには２４０ビン以上のクラスの超多ビ
ンのものまで手がけられるようになってきている。In recent years, as integrated circuit devices have become highly integrated, leads have become extremely multi-bin (lead) and have become more complex.
The etching process, which was mainly used for the 4-bin class, is also available from 160~
It has become possible to manufacture products with 240 bins and even super large numbers of bins with more than 240 bins.
これに伴ってリードフレームの特にインナーリ−ドの間
隔は非常に狭くならざるを得ず、従来のリード間隔では
何ら問題にならなかったエツチング加工も、こうした多
ビンのリードフレームではエツチング性に問題を生ずる
ようになってきている。As a result, the spacing between lead frames, especially the inner leads, has to become extremely narrow, and etching processing, which did not pose any problems with conventional lead spacing, is now having problems with etching performance in lead frames with such a large number of bins. It is starting to occur.
このため、従来に比べ数段エツチング加工性に優れたリ
ードフレーム材料が必要になっている。Therefore, there is a need for a lead frame material that is superior in etching processability by several steps compared to conventional materials.
従来のＦｅ−Ｎｉ系合金では、前述の２４０ピンクラス
の多ビンリードフレームにおいて、エツチング加工性が
十分満足できるものではなく、インナーリード同志のく
っつき等を生じたり、リードフレームの寸法形状規格を
満足できない等の問題があった。Conventional Fe-Ni alloys do not have sufficient etching processability in the aforementioned 240-pin class multi-bin lead frames, causing inner leads to stick to each other, or failing to meet lead frame size and shape standards. There were problems such as not being able to do so.
本発明は以上の点に鑑み、超多ビンリードフレームのエ
ツチング加工が十分可能なエツチング加工性の優れたリ
ードフレーム用Ｆ ｅ−Ｎ ｉ系合金を提供することを
目的とするものである。In view of the above points, it is an object of the present invention to provide an Fe--Ni alloy for lead frames which has excellent etching processability and is capable of sufficiently etching ultra-bin lead frames.
〔課題を解決するための手段〕
本発明者は、エツチング加工性を向上させる要因として
、炭素含有量、材料の結晶粒度、非金属介在物の量、お
よび圧延と焼鈍条件に着目して実験を行なった。その結
果、エツチング加工性を改善する顕著な効果が発揮でき
るのは、特定の結晶粒度以上に細粒にすること、および
Ｃ含有量を特定の値以下に低く抑える複合効果の場合で
あることをつきとめたものである。さらに非金属介在物
を低減する効果も複合すると、よりエツチング断面の面
粗度が滑らかになるという効果もあることもわかった。[Means for Solving the Problem] The present inventor conducted experiments focusing on carbon content, crystal grain size of material, amount of nonmetallic inclusions, and rolling and annealing conditions as factors that improve etching processability. I did it. As a result, it was found that the remarkable effect of improving etching processability can be achieved by making the grains finer than a specific grain size and by suppressing the C content below a specific value. This is what I found out. It was also found that when the effect of reducing nonmetallic inclusions is combined, the surface roughness of the etched cross section becomes smoother.
Ｃ含有量や非金属介在物の量を単に低減するだけでは不
十分であり、本発明の合金は結晶粒度をＪＩＳの結晶粒
度番号でＮ ｏ、８以上にし、Ｃ含有量を０．００７重
量％以下にした時に最もエツチング加工性向上の効果が
発揮できるものである。It is not enough to simply reduce the C content or the amount of nonmetallic inclusions, and the alloy of the present invention has a grain size of No. 8 or higher in the JIS grain size number, and a C content of 0.007% by weight. % or less, the effect of improving etching processability can be exhibited most effectively.
すなわち本発明は、Ｃ含有量が０．００７重量％以下で
、かつ結晶粒度がＮｏ、８．０以上であることを特徴と
するエツチング加工性に優れたリードフレーム用Ｆｅ−
Ｎｉ系合金である。前記Ｆｅ−Ｎｉ系合金は、Ｎｉ ３
０−６０重量％、Ｓｉ０．２５重量％以下、Ｍｎ０．５
０重量％以下、残部Ｆｅおよび不純物がらなり、不純物
のうちＰ ０．００５重量％以下、Ｓ ０．００５重量
％以下、その他の不純物の元素の全含有量が０．１０重
量％以下であるか、またはＮｉ２５〜４０重量％、Ｃｏ
５〜２０重量％、Ｓｉ０．２５重量％以下、Ｍｎ ０
．５０重量％以下、残部Ｆｅおよび不純物からなり、不
純物のうちＰ ０．００５重量％以下、Ｓ ０．００５
重量％以下、その他の不純物元素の全含有量が０．１０
重量％以下であることが望ましい。That is, the present invention provides a Fe-lead frame material with excellent etching processability, which has a C content of 0.007% by weight or less and a crystal grain size of No. 8.0 or more.
It is a Ni-based alloy. The Fe-Ni alloy is Ni 3
0-60% by weight, Si 0.25% by weight or less, Mn 0.5
0% by weight or less, the balance consists of Fe and impurities, and of the impurities, P is 0.005% by weight or less, S is 0.005% by weight or less, and the total content of other impurity elements is 0.10% by weight or less , or 25-40% by weight of Ni, Co
5 to 20% by weight, Si 0.25% by weight or less, Mn 0
．． 50% by weight or less, balance consisting of Fe and impurities, of which P 0.005% by weight or less, S 0.005
Weight% or less, total content of other impurity elements is 0.10
It is desirable that it is less than % by weight.
第１図にＦ ｅ−４２％ＮＬ合金におけるＣ含有量とエ
ツチング速度との関係を示すが、Ｃ含有量が０．００７
重量％以下におＩＩ＼て急激にエツチング速度が向上し
、エツチング加工性が向上することが明らかである。Ｃ
含有量のより望ましい範囲は０．００５重量％以下であ
る。Figure 1 shows the relationship between C content and etching rate in Fe-42% NL alloy.
It is clear that the etching rate increases rapidly below II\, and the etching processability improves. C
A more desirable content range is 0.005% by weight or less.
次に結晶粒度については、ＪＩＳの結晶粒度番号がＮｏ
、８．０以下においてはエツチング断面の表面粗さが大
となり、エツチング加工時の０寸法精度が超多ビンリー
ドフレームにおいては十分満足できなくなる。また、Ｎ
ｏ、８．０以上においてはエツチング速度が増大し、エ
ツチング加工性が向上する。Next, regarding the grain size, the JIS grain size number is No.
, 8.0 or less, the surface roughness of the etched cross section becomes large, and the zero dimensional accuracy during etching becomes insufficient in a super-multi-bin lead frame. Also, N
o, 8.0 or more, the etching speed increases and the etching processability improves.
以上の点より結晶粒度をＮｏ、８．０以上に規定した。Based on the above points, the crystal grain size was determined to be No. 8.0 or more.
より望ましくはＮｏ、９．０以上である。More preferably No, 9.0 or more.
本発明は、こうした結晶粒度ならびにＣ含有量とエツチ
ング加工性との関係について詳細な検討を行ない、結晶
粒度とＣ含有量を共に制御することにより、エツチング
加工性に極めて優れたＦｅ−Ｎｉ系合金が得られること
を見出したものである。The present invention has developed a Fe-Ni alloy that has extremely excellent etching processability by conducting detailed studies on the relationship between the crystal grain size, C content, and etching processability, and by controlling both the crystal grain size and C content. It was discovered that this can be obtained.
すなわち、Ｃ含有量が０．００７重量％以下とし、結晶
粒度がＮｏ、８．０以上としたＦｅ−Ｎｉ系合金は優れ
たエツチング加工性が得られることを見出したものであ
る。またこの場合、不純物元素を次のように制御するこ
とにより、さらにエツチング性が改善される。That is, it has been found that an Fe--Ni alloy with a C content of 0.007% by weight or less and a grain size of No. 8.0 or more can provide excellent etching processability. In this case, the etching properties can be further improved by controlling the impurity elements as follows.
Ｓｉ：０．２５重量％以下
Ｍｎ ： ０．５０重量％以下
Ｐ ： ０．００５重量％以下
Ｓ ： ０．００５重量％以下
その他の不純物元素： ｏ、ｉｏ重量％以下不純物元素
については、Ｓｉ、Ｍｎ、Ｐ、Ｓおよびその他の不純物
元素の全含有量が前記の値を越えると、特にエツチング
速度の均一な進行の妨げとなる。Si: 0.25% by weight or less Mn: 0.50% by weight or less P: 0.005% by weight or less S: 0.005% by weight or less Other impurity elements: o, io or less by weight Impurity elements include Si, If the total content of Mn, P, S and other impurity elements exceeds the above-mentioned value, it will particularly hinder the uniform etching rate.
なお、より望ましい不純物の範囲は次の通りである。Note that the more desirable range of impurities is as follows.
Ｓ Ｌ ： ０．１５重量％以下
Ｍｎ： ０．３０重量％以下
Ｐ ： ０．００３重量％以下
Ｓ ： ０．００３重量％以下
その他の不純物元素： ０．Ｏａ重量％以下〔実施例〕
以下、本発明を実施例に基づき説明する。リードフレー
ム用Ｆｅ−Ｎｉ系合金としてＦ ｅ−４２％Ｎ４合金、
Ｆ ｅ−５０％Ｎｉ合金およびＦｅ−２９Ｎ １−１７
Ｇｏ金合金選び、第１表に示すようなＣ含有量ならび
に結晶粒度の材料を作製した。結晶粒度Ｎｏ、８．０以
上の材料は、最終圧延の圧下率を６０％以上とし、連続
焼鈍の焼なまし温度を８５０〜９００℃の範囲で調整す
ることにより製造した。結晶粒度がＮｏ、８．０未満の
材料は最終圧延の圧下率が４５〜５０％で、焼なまし温
度が９５０℃のものである。SL: 0.15% by weight or less Mn: 0.30% by weight or less P: 0.003% by weight or less S: 0.003% by weight or less Other impurity elements: 0. Oa weight % or less [Examples] The present invention will be described below based on Examples. Fe-42%N4 alloy as Fe-Ni alloy for lead frame,
Fe-50%Ni alloy and Fe-29N 1-17
A Go gold alloy was selected and materials having the C content and crystal grain size shown in Table 1 were prepared. The material having a grain size No. of 8.0 or more was manufactured by setting the reduction ratio in the final rolling to 60% or more and adjusting the annealing temperature in continuous annealing in the range of 850 to 900°C. Materials with a grain size of No. less than 8.0 have a final rolling reduction of 45 to 50% and an annealing temperature of 950°C.
次にエツチング加工性を評価するために第２図に示すよ
うに試験片にφ０．８ｍｍの円を塩化第二鉄溶液（Ｆｅ
Ｃ１，： ３０％、Ｈ，Ｏ：残）を用いて片面より１０
分間エツチング加工し、第２図に示す基準によりエツチ
ング深さ（ｈ）を光学顕微鏡の焦点の移動距離により測
定し、エツチング速度を求めた。Next, in order to evaluate the etching processability, a circle with a diameter of 0.8 mm was placed on the test piece as shown in Figure 2 using a ferric chloride solution (Fe
C1: 30%, H, O: remainder) from one side to 10%
Etching was performed for a minute, and the etching depth (h) was measured by the distance traveled by the focal point of an optical microscope according to the criteria shown in FIG. 2 to determine the etching rate.
この結果を第１表にまとめて示した。The results are summarized in Table 1.
また、第３図に示す形状に試験片をフォトエツチングに
より加工し、エツチング断面の粗さを測定した。この粗
さは光学顕微鏡の焦点の移動距離により最大深さを表わ
したものである。これ等の結果を第１表に付記した。Further, a test piece was processed into the shape shown in FIG. 3 by photoetching, and the roughness of the etched cross section was measured. This roughness represents the maximum depth by the moving distance of the focal point of the optical microscope. These results are added to Table 1.
第１表に示すように、本発明の範囲にあるＣ含有量が０
．００７重量％以下で且つ結晶粒度がＮｏ、８．０以上
の本発明合金において、エツチング断面粗さおよびエツ
チング速度が顕著に向上し、優れたエツチング加工性が
得られている。As shown in Table 1, the C content within the range of the present invention is 0.
．． In the alloy of the present invention having a grain size of No. 007% by weight or less and a grain size of No. 8.0 or more, the etching cross-sectional roughness and etching speed are significantly improved, and excellent etching processability is obtained.
エツチング加工性は、エツチング面粗さ（μｌ１１）と
エツチング速度（ｍｍ／ｍ１ｎ）で評価し、良いものを
Ｑ印、やや不十分なものをΔ印、不十分なものをＸ印で
第１表に表わした。Etching processability is evaluated by etching surface roughness (μl11) and etching speed (mm/m1n), and good results are marked with a Q mark, slightly unsatisfactory ones with a Δ mark, and unsatisfactory ones with an X mark in Table 1. It was expressed in
本発明によれば、エツチング加工性に優れたＦｅ−Ｎｉ
系合金が得られ、集積回路素子の多ビンあるいは起炎ビ
ンリードフレームの高精度エツチング加工が可能となり
、品質の向上、歩留り向上および加工効率の向上等が達
成できる。According to the present invention, Fe-Ni has excellent etching processability.
This makes it possible to perform high-precision etching of multi-bin or flame-flaming lead frames of integrated circuit devices, thereby achieving improvements in quality, yield, and processing efficiency.
第１図は、Ｆ ｅ−４２Ｎ Ｌ合金におけるエツチング
速度とＣ含有量との関係を示した図、第２図および第３
図は本実施例で採用したエツチング加工性の試験の説明
図である。
１：試験片、２：エツチング断面Figure 1 is a diagram showing the relationship between etching rate and C content in Fe-42N L alloy, Figures 2 and 3 are
The figure is an explanatory diagram of the etching processability test adopted in this example. 1: Test piece, 2: Etched cross section
Claims (1)
Ｎｏ．８．０以上であることを特徴とするエッチング加
工性に優れたリードフレーム用Ｆｅ−Ｎｉ系合金。 ２Ｆｅ−Ｎｉ系合金は、Ｎｉ３０〜６０重量％、Ｓｉ０
．２５重量％以下、Ｍｎ０．５０重量％以下、残部Ｆｅ
および不純物からなり、不純物のうちＰ０．００５重量
％以下、Ｓ０．００５重量％以下、その他の不純物元素
の全含有量が０．１０重量％以下である請求項１に記載
のエッチング加工性に優れたリードフレーム用Ｆｅ−Ｎ
ｉ系合金。 ３Ｆｅ−Ｎｉ系合金は、Ｎｉ２５〜４０重量％、Ｃｏ５
〜２０重量％、Ｓｉ０．２５重量％以下、Ｍｎ０．５０
重量％以下、残部Ｆｅおよび不純物からなり、不純物の
うちＰ０．００５重量％以下、Ｓ０．００５重量％以下
、その他の不純物元素の全含有量が０．１０重量％以下
である請求項１に記載のエッチング加工性に優れたリー
ドフレーム用Ｆｅ−Ｎｉ系合金。[Claims] The 1C content is 0.007% by weight or less, and the crystal grain size is No. An Fe-Ni alloy for lead frames, which has excellent etching processability, characterized in that it has a hardness of 8.0 or more. 2Fe-Ni alloy contains 30 to 60% by weight of Ni, Si0
．． 25% by weight or less, Mn 0.50% by weight or less, balance Fe
and impurities, and the total content of P0.005% by weight or less, S0.005% by weight or less, and other impurity elements is 0.10% by weight or less. Fe-N for lead frame
i-based alloy. 3Fe-Ni alloy contains 25 to 40% by weight of Ni, Co5
~20% by weight, Si0.25% by weight or less, Mn0.50
% or less by weight, the balance being Fe and impurities, and the total content of the impurities is 0.005% by weight or less of P, 0.005% by weight or less of S, and 0.10% by weight or less of other impurity elements. Fe-Ni alloy for lead frames with excellent etching processability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1106513A JP3023112B2 (en) | 1989-04-26 | 1989-04-26 | Fe-Ni alloy for lead frames with excellent etching processability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1106513A JP3023112B2 (en) | 1989-04-26 | 1989-04-26 | Fe-Ni alloy for lead frames with excellent etching processability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02285054A true JPH02285054A (en) | 1990-11-22 |
| JP3023112B2 JP3023112B2 (en) | 2000-03-21 |
Family
ID=14435500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1106513A Expired - Fee Related JP3023112B2 (en) | 1989-04-26 | 1989-04-26 | Fe-Ni alloy for lead frames with excellent etching processability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3023112B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0586441A (en) * | 1991-09-27 | 1993-04-06 | Yamaha Corp | Fi-ni-co alloy for shadow mask |
| EP0768808A1 (en) * | 1995-09-28 | 1997-04-16 | Star Micronics Co., Ltd. | Lead frame material for electro acoustic transducer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102261333B1 (en) * | 2019-11-08 | 2021-06-08 | 엔피씨(주) | Cooling box |
-
1989
- 1989-04-26 JP JP1106513A patent/JP3023112B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0586441A (en) * | 1991-09-27 | 1993-04-06 | Yamaha Corp | Fi-ni-co alloy for shadow mask |
| EP0768808A1 (en) * | 1995-09-28 | 1997-04-16 | Star Micronics Co., Ltd. | Lead frame material for electro acoustic transducer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3023112B2 (en) | 2000-03-21 |
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