JPH022846U - - Google Patents

Info

Publication number
JPH022846U
JPH022846U JP7987988U JP7987988U JPH022846U JP H022846 U JPH022846 U JP H022846U JP 7987988 U JP7987988 U JP 7987988U JP 7987988 U JP7987988 U JP 7987988U JP H022846 U JPH022846 U JP H022846U
Authority
JP
Japan
Prior art keywords
film
semiconductor device
carrier type
type semiconductor
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7987988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7987988U priority Critical patent/JPH022846U/ja
Publication of JPH022846U publication Critical patent/JPH022846U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の1実施例を示すフイルムキヤ
リア半導体モジユールの平面図である。第2図は
従来のフイルムキヤリア半導体モジユールの平面
図である。 1……パターン基板、2……半導体装置、3…
…リード配線、4……入出力線、5……電極パツ
ド、6……出力端子。
FIG. 1 is a plan view of a film carrier semiconductor module showing one embodiment of the present invention. FIG. 2 is a plan view of a conventional film carrier semiconductor module. 1...Patterned substrate, 2...Semiconductor device, 3...
...Lead wiring, 4...Input/output line, 5...Electrode pad, 6...Output terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フイルム上に半導体装置が載置され、該半導体
装置の電極端子が前記フイルム上に配列されたリ
ード配線に適宜接続されて成るフイルムキヤリア
型半導体モジユールにおいて、プルアツプ及び/
又はプルダウン用外付端子が前記リード配線の電
源ライン及び/又はアースライン上に重畳して前
記電極端子と並設されていることを特徴とするフ
イルムキヤリア型半導体モジユール。
In a film carrier type semiconductor module in which a semiconductor device is placed on a film and electrode terminals of the semiconductor device are appropriately connected to lead wires arranged on the film, pull-up and/or
Alternatively, a film carrier type semiconductor module characterized in that an external pull-down terminal is arranged in parallel with the electrode terminal so as to overlap the power supply line and/or the ground line of the lead wiring.
JP7987988U 1988-06-15 1988-06-15 Pending JPH022846U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7987988U JPH022846U (en) 1988-06-15 1988-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7987988U JPH022846U (en) 1988-06-15 1988-06-15

Publications (1)

Publication Number Publication Date
JPH022846U true JPH022846U (en) 1990-01-10

Family

ID=31304725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7987988U Pending JPH022846U (en) 1988-06-15 1988-06-15

Country Status (1)

Country Link
JP (1) JPH022846U (en)

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