JPH022835U - - Google Patents
Info
- Publication number
- JPH022835U JPH022835U JP1988081264U JP8126488U JPH022835U JP H022835 U JPH022835 U JP H022835U JP 1988081264 U JP1988081264 U JP 1988081264U JP 8126488 U JP8126488 U JP 8126488U JP H022835 U JPH022835 U JP H022835U
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- component
- chip component
- component body
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/851—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
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- H10W72/5363—
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- H10W72/581—
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- H10W72/884—
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- H10W74/00—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988081264U JPH022835U (cg-RX-API-DMAC10.html) | 1988-06-20 | 1988-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988081264U JPH022835U (cg-RX-API-DMAC10.html) | 1988-06-20 | 1988-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022835U true JPH022835U (cg-RX-API-DMAC10.html) | 1990-01-10 |
Family
ID=31306051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988081264U Pending JPH022835U (cg-RX-API-DMAC10.html) | 1988-06-20 | 1988-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022835U (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330344A (ja) * | 1995-05-31 | 1996-12-13 | Nec Yamagata Ltd | 半導体装置 |
| JP2016192513A (ja) * | 2015-03-31 | 2016-11-10 | 株式会社沖データ | 半導体装置、半導体素子アレイ装置、及び画像形成装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54112167A (en) * | 1978-02-22 | 1979-09-01 | Nec Corp | Manufacture of semiconductor device |
| JPS6218050A (ja) * | 1985-07-16 | 1987-01-27 | Nec Corp | 半導体集積回路装置 |
| JPS62256440A (ja) * | 1986-04-28 | 1987-11-09 | Nec Corp | 半導体装置 |
-
1988
- 1988-06-20 JP JP1988081264U patent/JPH022835U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54112167A (en) * | 1978-02-22 | 1979-09-01 | Nec Corp | Manufacture of semiconductor device |
| JPS6218050A (ja) * | 1985-07-16 | 1987-01-27 | Nec Corp | 半導体集積回路装置 |
| JPS62256440A (ja) * | 1986-04-28 | 1987-11-09 | Nec Corp | 半導体装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330344A (ja) * | 1995-05-31 | 1996-12-13 | Nec Yamagata Ltd | 半導体装置 |
| JP2016192513A (ja) * | 2015-03-31 | 2016-11-10 | 株式会社沖データ | 半導体装置、半導体素子アレイ装置、及び画像形成装置 |