JPH02281707A - Polymer ptc element - Google Patents
Polymer ptc elementInfo
- Publication number
- JPH02281707A JPH02281707A JP10433489A JP10433489A JPH02281707A JP H02281707 A JPH02281707 A JP H02281707A JP 10433489 A JP10433489 A JP 10433489A JP 10433489 A JP10433489 A JP 10433489A JP H02281707 A JPH02281707 A JP H02281707A
- Authority
- JP
- Japan
- Prior art keywords
- element body
- electrode
- polymer
- polymer ptc
- ptc element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 32
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 239000003822 epoxy resin Substances 0.000 claims abstract description 3
- 229910052737 gold Inorganic materials 0.000 claims abstract description 3
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 3
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 3
- 229920001721 polyimide Polymers 0.000 claims abstract description 3
- 239000009719 polyimide resin Substances 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims abstract description 3
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 abstract description 2
- 230000001680 brushing effect Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229920001940 conductive polymer Polymers 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Resistance Heating (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、例えば温度制御技術の分野で広く用いられて
いる抵抗素子、特に、昇温時に特定の温度領域において
急激に抵抗が増大する特性（以下、ＰＴＣ特性という）
を有するポリマーＰＴＣ素子の改良に関するものである
。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a resistance element widely used in the field of temperature control technology, in particular, a resistive element that rapidly increases in a specific temperature range during temperature rise. Characteristics where resistance increases (hereinafter referred to as PTC characteristics)
The present invention relates to an improvement of a polymer PTC element having the following characteristics.
（従来の技術）
例えば、ポリエチレン、ポリプロピレン等の結晶性ポリ
マーにカーボン等の導電性粉末を分散的に混入し、ある
特定の温度に達するとその抵抗が増大する正の抵抗温度
特性を有する導電性重合体組成物（以下「ポリマーＰＴ
Ｃ素子」という）は、例えば米国特許第３．５９１．５
２６号明細書や米国特許第３．６７３．１２１号明細書
等により従来から知られているが、このようなポリマー
ＰＴＣ素子においては、素子本体に網状金属を埋込んで
これを電極として用いるものや、例えばステンレス等の
金属板を素子本体の表面に接合しこれを電極として利用
するものがある。また、スパッタリング法によって電極
を形成しているもの（特開昭６２−８５４０１号）等が
ある。(Prior art) For example, by dispersing conductive powder such as carbon into a crystalline polymer such as polyethylene or polypropylene, a conductive material having a positive resistance-temperature characteristic in which the resistance increases when a certain temperature is reached. Polymer composition (hereinafter referred to as "polymer PT")
C element) is disclosed in, for example, U.S. Patent No. 3.591.5.
26 and U.S. Patent No. 3.673.121, etc., in such polymer PTC elements, a mesh metal is embedded in the element body and used as an electrode. In addition, there is a method in which a metal plate, such as stainless steel, is bonded to the surface of the element body and used as an electrode. Further, there is a method in which electrodes are formed by a sputtering method (Japanese Patent Application Laid-open No. 85401/1983).
（発明が解決しようとする課題）
しかしながら、第１の電極方式にあっては、素子本体の
比抵抗のわりには抵抗素子全体としての抵抗が高くなる
ということが欠点となり、第２の方法の場合には、電極
としての金属板と素子本体との密着性が悪くなり、その
結果、繰返し試験を行うとその抵抗値が大幅に増大し、
また、僅かな熱的応力によっても金属板が剥離するとい
うことが欠点として指摘されている。また、第３の方法
でも、何も処理していない素子本体にスバ・シタリング
法によって電極を形成しても熱的剥離などが起こるとい
う問題がある。また、金属板を素子本体に接合する例で
は、前述の金属板または重子本体のいずれか一方の接合
面を予め粗面に形成することによって接着性の向上を図
ろうとする方法も用いられているが、この方法でも未だ
万全を期し難いものがあった。そのため、これらの改善
策の実現が強（望まれている。(Problem to be Solved by the Invention) However, in the first electrode method, the disadvantage is that the resistance of the resistive element as a whole becomes high compared to the specific resistance of the element body, and in the case of the second method, In this case, the adhesion between the metal plate as an electrode and the element body deteriorates, and as a result, the resistance value increases significantly when repeated tests are performed.
Furthermore, it has been pointed out that a drawback is that the metal plate may peel off even under slight thermal stress. Further, even in the third method, there is a problem that thermal peeling occurs even if electrodes are formed by the suba-shittering method on an untreated element body. In addition, in cases where a metal plate is bonded to an element body, a method is also used in which the bonding surface of either the metal plate or the weight element body is previously formed into a rough surface to improve adhesion. However, even with this method, there were still some things that were difficult to ensure. Therefore, the implementation of these improvement measures is strongly desired.
本発明は、上記問題点を解決し、素子本体と電極との接
合が極めて強固なポリマーＰＴＣ素子の提供を目的とす
るものである。The present invention aims to solve the above-mentioned problems and provide a polymer PTC element in which the bond between the element body and the electrodes is extremely strong.
［発明の構成］
（課題を解決するための手段）
本発明の構成は、ポリマーとこのポリマーに分散的に混
入された導電性物質とから成る正の抵抗温度特性を有す
る素子本体と、前記素子本体に結合され外部より電圧を
印加される電極部材とから成るポリマーＰＴＣ素子にお
いて、前記素子本体と電極部材との間に導電性接着部材
を有することを特徴とするものである。[Structure of the Invention] (Means for Solving the Problems) The structure of the present invention includes an element body having a positive resistance temperature characteristic made of a polymer and a conductive substance dispersedly mixed in the polymer, and the element body having a positive resistance temperature characteristic. A polymer PTC element comprising an electrode member coupled to a main body and to which a voltage is applied from the outside, characterized in that a conductive adhesive member is provided between the element main body and the electrode member.
（作 用）
素子本体と、電極部材とを導電性接着部材を用いて接合
したことにより、素子本体と電極部材との接合が極めて
強固になる。(Function) By bonding the element body and the electrode member using the conductive adhesive member, the bond between the element body and the electrode member becomes extremely strong.
（実施例） 本発明の実施例を図面を参照して説明する。(Example) Embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例によるポリマーＰＴＣ素子を
示す側面図、第２図はポリマーＰＴＣ素子の内部構造を
説明するための部分拡大断面図である。FIG. 1 is a side view showing a polymer PTC element according to an embodiment of the present invention, and FIG. 2 is a partially enlarged sectional view for explaining the internal structure of the polymer PTC element.
第１図に示すポリマーＰＴＣ素子１は、ポリマーに導電
性物質である例えばカーボンブラック等を分散させ板状
に成形した素子本体２と、この素子本体２の両面に接合
した例えばＮｉ製の電極３ａ、３ｂと、この画電極３ａ
、３ｂに半田４を用いて取付けたリード線５ａ、５ｂと
を形成している。The polymer PTC element 1 shown in FIG. 1 includes an element body 2 formed into a plate shape by dispersing a conductive substance such as carbon black into a polymer, and electrodes 3a made of, for example, Ni bonded to both sides of the element body 2. , 3b, and this picture electrode 3a
, 3b are formed with lead wires 5a and 5b attached using solder 4.
前記Ｎｉ製の電極３ａは第２図に示すように素子本体２
と導電性接着部材３Ｃにより接合され素子本体２との接
合を強固にしている。尚、電極３ｂについても上記と同
様であることは言うまでもないことである。The Ni electrode 3a is connected to the element body 2 as shown in FIG.
and is bonded to the element body 2 by a conductive adhesive member 3C to strengthen the bond to the element body 2. It goes without saying that the electrode 3b is also similar to the above.
前記導電性接着部材３Ｃは、マ） ＩＪソックスエポキ
シ樹脂またはポリイミド樹脂などを用い、それにフィラ
ーとしてＡｕ、Ａｇ、Ｎｉ、Ｃを含有して成り、かつ導
電性の低下には影響しない。The conductive adhesive member 3C is made of IJ sock epoxy resin or polyimide resin, and contains Au, Ag, Ni, and C as fillers, and does not affect the decrease in conductivity.
また現存しているものであれば、例えば２液エポキシ系
エコボンド５６Ｃ（商品名ニゲレースジャパン■製）、
２液エポキシ系エコボンド８３Ｃ（商品名ニゲレースジ
ャパン■製）、２液エポキシ系Ｈ２Ｏ３（商品名：エポ
テック■製）などを用いてもよい。この場合であっても
導電性の低下には影響しない。In addition, if there are existing ones, for example, two-component epoxy Ecobond 56C (product name: Nigelase Japan ■),
Two-component epoxy system Ecobond 83C (trade name: manufactured by Nigelase Japan ■), two-component epoxy system H2O3 (trade name: manufactured by Epotec ■), etc. may be used. Even in this case, it does not affect the decrease in conductivity.
次に図面を参照してポリマーＰＴＣ素子の製造工程を説
明する。第４図はポリマーＰＴＣ素子の製造工程図であ
る。Next, the manufacturing process of the polymer PTC element will be explained with reference to the drawings. FIG. 4 is a manufacturing process diagram of a polymer PTC element.
同図に示すように、まず例えばポリフッ化ビニリデンポ
リマーと、カーボンブラックと、架橋剤等を準備し分散
させ（ステップＳ１）、適宜装置により混練しくステッ
プＳ２）、押し出し機などによりシート化しくステップ
Ｓ３）、水槽において架橋させ（ステップＳ４）、真空
乾燥機により乾燥（ステップＳ５）して得られた素子本
体上下面に、上述した導電性接着部材３Ｃを刷毛塗り。As shown in the figure, first, for example, polyvinylidene fluoride polymer, carbon black, a crosslinking agent, etc. are prepared and dispersed (step S1), kneaded using an appropriate device (step S2), and formed into a sheet using an extruder or the like (step S3). ), cross-linked in a water tank (step S4), and dried in a vacuum dryer (step S5), and the above-mentioned conductive adhesive member 3C was applied with a brush to the upper and lower surfaces of the element body.
吹付けなどの適宜方法で塗布された電極部材３を配置し
熱プレス等により熱圧着し電極を形成しくステップＳａ
）前記第２図のような構成とした後、プレス等により打
ち抜き小片化しくステップＳ７）、半田付けによりリー
ド線付け（ステップｓｇ）等の各工程を経て前記第１図
に示すポリマーＰＴＣ素子１を製造する。Step Sa: Arrange the electrode member 3 coated by an appropriate method such as spraying, and bond by heat pressing or the like to form an electrode.
) After forming the structure shown in FIG. 2, the polymer PTC element 1 shown in FIG. Manufacture.
次に、上述したポリマーＰＴＣ素子の電極剥離試験結果
を表−１を参照して説明する。Next, the electrode peel test results of the polymer PTC element described above will be explained with reference to Table 1.
尚、試験方法はＪＩＳ（日本工業規格） Ｋ６８５４（
剥離接着強さ試験方法、Ｔ型剥離）に準拠して行なった
。また比較試料は熱圧着のみにより電極を形成した物で
ある。また電極は双方とも表面を粗面化しないＮｉ箔を
用いた。The test method is JIS (Japanese Industrial Standard) K6854 (
The test was conducted in accordance with the peel adhesion strength test method (T-type peel). In addition, the comparative sample had electrodes formed only by thermocompression bonding. Further, both electrodes were made of Ni foil whose surface was not roughened.
表−１（Ｋｇｆ／２５ｍｍ）
表−１に示すように、本発明実施例によれば素子本体と
電極との接合が極めて強固になる。Table 1 (Kgf/25mm) As shown in Table 1, according to the embodiments of the present invention, the bond between the element body and the electrode becomes extremely strong.
以上詳述した実施例によれば素子本体と電極との接合が
極めて強固なポリマーＰＴＣ素子が提供できる。According to the embodiments detailed above, it is possible to provide a polymer PTC element in which the bond between the element body and the electrodes is extremely strong.
本発明は上記実施例に限定されず種々の変形実施が可能
である。The present invention is not limited to the above-mentioned embodiments, and various modifications can be made.
例えば、導電性接着部材は本発明の要旨の範囲内におい
て種々の変形実施が可能であり、上記実施例では導電性
接着部材を電極部材にのみに塗布したように説明したが
、素子本体のみあるいは電極部材と素子本体の両方に塗
布しても良い、これらの場合であっても上記同様の効果
を得ることができる。For example, the conductive adhesive member can be modified in various ways within the scope of the gist of the present invention, and in the above embodiment it was explained that the conductive adhesive member was applied only to the electrode member. It may be applied to both the electrode member and the element body, and even in these cases, the same effect as described above can be obtained.
［発明の効果］
以上詳述したように本発明によれば、素子本体と電極と
の接合が極めて強固な新規なポリマーＰＴＣ素子が提供
できる。[Effects of the Invention] As detailed above, according to the present invention, a novel polymer PTC element in which the bond between the element body and the electrode is extremely strong can be provided.
第１図は本発明の一実施例によるポリマーＰＴＣ素子を
示す側面図、第２図はポリマーＰＴＣ素子の内部構造を
説明するための部分拡大断面図、第３図はポリマーＰＴ
Ｃ素子の製造工程図である。
１・・・ポリマーＰＴＣ素子、FIG. 1 is a side view showing a polymer PTC element according to an embodiment of the present invention, FIG. 2 is a partially enlarged sectional view for explaining the internal structure of the polymer PTC element, and FIG.
It is a manufacturing process diagram of a C element. 1...polymer PTC element,
Claims (2)
電性物質とから成る正の抵抗温度特性を有する素子本体
と、前記素子本体に接合され外部より電圧を印加される
電極部材とから成るポリマーＰＴＣ素子において、前記
素子本体と電極部材との間に導電性接着部材を有するこ
とを特徴とするポリマーＰＴＣ素子。(1) A polymer consisting of an element body having a positive resistance-temperature characteristic made of a polymer and a conductive substance dispersedly mixed into the polymer, and an electrode member connected to the element body and to which a voltage is applied from the outside. A polymer PTC element comprising a conductive adhesive member between the element body and the electrode member.
ミド樹脂と、Ａｕ、Ａｇ、Ｎｉ、Ｃからなる群より選ば
れた一種とから成ることを特徴とする請求項１記載のポ
リマーＰＴＣ素子。(2) The polymer PTC element according to claim 1, wherein the conductive adhesive member is made of epoxy resin or polyimide resin and one type selected from the group consisting of Au, Ag, Ni, and C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10433489A JPH02281707A (en) | 1989-04-24 | 1989-04-24 | Polymer ptc element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10433489A JPH02281707A (en) | 1989-04-24 | 1989-04-24 | Polymer ptc element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02281707A true JPH02281707A (en) | 1990-11-19 |
Family
ID=14378039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10433489A Pending JPH02281707A (en) | 1989-04-24 | 1989-04-24 | Polymer ptc element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02281707A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5358793A (en) * | 1991-05-07 | 1994-10-25 | Daito Communication Apparatus Co., Ltd. | PTC device |
| EP0896344A2 (en) * | 1997-07-21 | 1999-02-10 | General Electric Company | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite |
| US5940958A (en) * | 1995-05-10 | 1999-08-24 | Littlefuse, Inc. | Method of manufacturing a PTC circuit protection device |
| KR20030019999A (en) * | 2001-08-28 | 2003-03-08 | (주)포엘텍 | The manufacturing process of high molecular heating element using by DC & AC power supply. |
| US20130233475A1 (en) * | 2009-02-24 | 2013-09-12 | Hon Hai Precision Industry Co., Ltd. | Method for making electrostrictive composite |
-
1989
- 1989-04-24 JP JP10433489A patent/JPH02281707A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5358793A (en) * | 1991-05-07 | 1994-10-25 | Daito Communication Apparatus Co., Ltd. | PTC device |
| US5940958A (en) * | 1995-05-10 | 1999-08-24 | Littlefuse, Inc. | Method of manufacturing a PTC circuit protection device |
| EP0896344A2 (en) * | 1997-07-21 | 1999-02-10 | General Electric Company | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite |
| EP0896344A3 (en) * | 1997-07-21 | 1999-07-07 | General Electric Company | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite |
| KR20030019999A (en) * | 2001-08-28 | 2003-03-08 | (주)포엘텍 | The manufacturing process of high molecular heating element using by DC & AC power supply. |
| US20130233475A1 (en) * | 2009-02-24 | 2013-09-12 | Hon Hai Precision Industry Co., Ltd. | Method for making electrostrictive composite |
| US9054312B2 (en) * | 2009-02-24 | 2015-06-09 | Tsinghua University | Method for making electrostrictive composite |
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