JP3522092B2 - Method for producing polymer PTC element - Google Patents
Method for producing polymer PTC elementInfo
- Publication number
- JP3522092B2 JP3522092B2 JP27919797A JP27919797A JP3522092B2 JP 3522092 B2 JP3522092 B2 JP 3522092B2 JP 27919797 A JP27919797 A JP 27919797A JP 27919797 A JP27919797 A JP 27919797A JP 3522092 B2 JP3522092 B2 JP 3522092B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- ptc element
- kgf
- polymer ptc
- minutes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【0001】[0001]
【発明の属する技術分野】本発明は、熱可塑性ポリマー
を用いたPTC素子の製造方法に関する。TECHNICAL FIELD The present invention relates to a method of manufacturing a PTC element using a thermoplastic polymer.
【0002】[0002]
【従来の技術】ポリマーに導電性物質を分散混合した部
材を素体として、ある特定の温度に昇温すると、その抵
抗が急激に増大する正の抵抗温度特性を有するポリマー
PTC素子が知られている。2. Description of the Related Art A polymer PTC element having a positive resistance-temperature characteristic is known in which a member obtained by dispersing and mixing a conductive substance in a polymer is used as an element body and its resistance rapidly increases when the temperature is raised to a certain temperature. There is.
【0003】このポリマーPTC素子は、図2(A)に
示すように、素体1の両面に電極2を固着した構造を有
している。このポリマーPTC素子を製造する方法とし
て、ポリマーと導電性物質を分散混合して長尺板状等板
状に成形し、その両面に電極部材としての金属板を熱圧
着するか、または、金属板の代わりに、該素体1の両面
に無電解メッキおよび電気メッキにより電極を形成して
素材とし、該電極を形成した素材を、特定の形状に打ち
抜いてポリマーPTC素子とする方法が知られている。As shown in FIG. 2 (A), this polymer PTC element has a structure in which electrodes 2 are fixed to both surfaces of an element body 1. As a method for producing this polymer PTC element, a polymer and a conductive substance are dispersed and mixed to be formed into a plate shape such as a long plate shape, and a metal plate as an electrode member is thermocompression bonded to both surfaces thereof, or a metal plate is formed. Instead of the above, a method is known in which electrodes are formed on both surfaces of the element body 1 by electroless plating and electroplating to form a material, and the material on which the electrodes are formed is punched into a specific shape to form a polymer PTC element. There is.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、板状の
素材を特定の形状にするために打ち抜いてポリマーPT
C素子にする製造方法では、図2(B)に示すように、
打ち抜き時に端部にかかるストレスにより、熱接着した
電極2が9で示すように素子の端部で剥離するという問
題点がある。このように、電極2が素子端部で剥離した
場合には、初期抵抗値のバラツキを生じ、断続負荷を加
えることにより、抵抗値が増大する上、熱エージングや
熱衝撃等でも抵抗値が増大するという問題点があった。However, in order to obtain a specific shape of a plate-shaped material, the polymer PT is punched out.
In the method of manufacturing the C element, as shown in FIG.
There is a problem that the heat-bonded electrode 2 peels off at the end of the element as indicated by 9 due to the stress applied to the end during punching. As described above, when the electrode 2 peels off at the end of the element, the initial resistance value varies, and the intermittent load is applied to increase the resistance value, and the resistance value also increases due to thermal aging or thermal shock. There was a problem to do.
【0005】なお、ポリマーPTC素子を製造する他の
方法として、金属板でなる電極2または素体1のいずれ
かの接合面を粗面に形成し、熱プレス等により熱圧着さ
せる方法が知られているが、この方法においても、電極
を付けた板状の素材の打ち抜き時における素子端部の電
極2の剥離の問題は解決できず、初期抵抗値のバラツキ
が大きいという問題が残る。As another method for producing a polymer PTC element, there is known a method in which a joint surface of either the electrode 2 or the element body 1 made of a metal plate is formed into a rough surface and thermocompression bonding is performed by hot pressing or the like. However, even with this method, the problem of peeling of the electrode 2 at the element end portion at the time of punching a plate-shaped material with an electrode cannot be solved, and there remains a problem that there is a large variation in the initial resistance value.
【0006】本発明は、上記問題点に鑑み、ポリマーP
TC素子端部における電極の剥離を無くし、もって初期
抵抗値の増大やバラツキ、並びに熱エージングあるいは
熱衝撃による抵抗値の増大を低減することが可能となる
ポリマーPTC素子の製造方法を提供することを目的と
する。In view of the above problems, the present invention provides a polymer P
To provide a method for producing a polymer PTC element capable of eliminating peeling of an electrode at an end portion of a TC element, thereby reducing an increase or variation in initial resistance value and an increase in resistance value due to thermal aging or thermal shock. To aim.
【0007】[0007]
【課題を解決するための手段】この目的を達成するた
め、本発明によるポリマーPTC素子の製造方法は、熱
可塑性ポリマーと該ポリマーに導電性物質を分散混合さ
せた組成物からなる板状をなす正の抵抗温度特性を有す
る素体の表裏面に、金属板もしくはメッキにより電極を
形成して素材とし、該素材を所定の素子形状に打ち抜い
た後、打ち抜いた素材を熱プレスして素体と電極の熱圧
着を行うことを特徴とする(請求項1)。In order to achieve this object, a method for producing a polymer PTC element according to the present invention has a plate-like shape made of a thermoplastic polymer and a composition in which a conductive substance is dispersed and mixed in the polymer. Electrodes are formed on the front and back surfaces of an element body having a positive resistance temperature characteristic by a metal plate or plating to make a material, and the material is punched into a predetermined element shape, and the punched material is hot pressed to form an element body. It is characterized in that the electrodes are thermocompression bonded (Claim 1).
【0008】本発明によるポリマーPTC素子の製造方
法において、好ましくは、前記熱プレス圧着条件が、プ
レス圧力:25.5kgf/cm2〜63.5kgf/
cm2、温度:150℃〜300℃、保持時間:5分〜
20分である(請求項2)。In the method for producing a polymer PTC element according to the present invention, preferably, the hot press-compression bonding conditions are: press pressure: 25.5 kgf / cm 2 to 63.5 kgf /
cm 2 , temperature: 150 ° C to 300 ° C, holding time: 5 minutes to
20 minutes (claim 2).
【0009】[0009]
【作用】本発明においては、ポリマーPTC素子を所定
の形状に打ち抜いた後に再度熱プレスにより電極を素体
に熱圧着するが、この加熱により樹脂が多少軟化する
上、打ち抜きにより素子端部の電極に変形が生じていた
場合でも、平面に矯正されるため、素体と電極との間に
剥離が生じていた場合であっても、電極が素体に再度密
着し、その端部剥離が修復される。In the present invention, the polymer PTC element is punched into a predetermined shape and then the electrode is thermocompression-bonded to the element body by hot pressing again. This heating softens the resin to some extent, and the electrode at the end of the element is punched out. Even if any deformation occurs, it is corrected to a flat surface, so even if peeling occurs between the element body and the electrode, the electrode will re-adhere to the element body and the edge peeling will be repaired. To be done.
【0010】[0010]
【発明の実施の形態】図1は本発明によるポリマーPT
C素子の製造方法の一実施例を示す工程図である。3は
熱可塑性ポリマーに導電性物質を分散混合させてなる素
体1の表裏面に電極2を、金属板の熱接着やメッキ(無
電解メッキ後電解メッキを施す)により形成した長尺板
状等板状に形成された素材である。なお、ポリマーとし
ては、例えばポリフッ化ビニリデン、ポリエチレン等の
熱可塑性樹脂が用いられる。また、導電性物質として
は、カーボンブラック、タングステンカーバイト等が用
いられる。また、電極2としては、金属板による場合
は、銅、ニッケルが用いられ、メッキによる場合は、錫
メッキ、ニッケルメッキ等が用いられる。なお、本発明
において用いられるポリマー、導電性物質および電極の
材質は、上記例に限定されない。FIG. 1 shows a polymer PT according to the invention.
It is a flowchart showing an example of a manufacturing method of a C element. Reference numeral 3 is a long plate shape in which an electrode 2 is formed on the front and back surfaces of an element body 1 in which a conductive substance is dispersed and mixed in a thermoplastic polymer, by heat-bonding or plating (electroless plating after electroless plating) of a metal plate. It is a material that is formed into an equal plate. As the polymer, for example, a thermoplastic resin such as polyvinylidene fluoride or polyethylene is used. Further, carbon black, tungsten carbide or the like is used as the conductive material. Further, as the electrode 2, copper or nickel is used when using a metal plate, and tin plating, nickel plating, or the like is used when using plating. The polymers, conductive materials and electrodes used in the present invention are not limited to the above examples.
【0011】このように形成された長尺板状の素材3か
ら、打ち抜き装置4により、例えば円形や多角形等所定
の形状、寸法に打ち抜いてチップ状のポリマーPTC素
子7を得る。その後、上部装置5aと下部装置5bとか
らなる熱プレス装置5により前記ポリマーPTC素子7
を上下面より挾んで熱プレスを行う。なお、熱プレス装
置5の対向する上下のプレス面には平滑化されたプレス
板6a、6bをそれぞれ設けて熱圧着作業を行う。この
熱圧着作業を行うことにより、ポリマーPTC素子7の
端部の剥離が解消されたポリマーPTC素子8を得る。A chip-shaped polymer PTC element 7 is obtained by punching the long plate-shaped material 3 thus formed into a predetermined shape and size such as a circle or a polygon by a punching device 4. Thereafter, the polymer PTC element 7 is heated by the hot press device 5 including the upper device 5a and the lower device 5b.
And press from above and below. It should be noted that smoothed press plates 6a and 6b are respectively provided on the upper and lower pressing surfaces of the hot pressing device 5 which face each other, and the thermocompression bonding work is performed. By performing this thermocompression bonding work, a polymer PTC element 8 in which peeling of the end portion of the polymer PTC element 7 is eliminated is obtained.
【0012】本発明による効果を確認するため、ポリマ
ーとしてポリフッ化ビニリデン、導電性物質としてタン
グステンカーバイト、電極2として無電解および電解メ
ッキにより形成したニッケルを用い、ポリマーPTC素
子8の形状を直径が10mm、素体1の厚み0.24mm、
電極2の厚みを0.03mmとし、熱プレス条件(プレス
圧力、温度、保持時間)を種々に変化させて初期抵抗
値、抵抗バラツキ(R値)およびヒートショックサイク
ル試験(−40℃の温度雰囲気に30分放置と、+85
℃の温度雰囲気に30分放置を繰り返す試験)500回
における抵抗値変化を評価した。その結果を表1に示
す。各試料についてそれぞれ10個ずつ試験、測定を行
い、抵抗のバラツキを示すR値は下記の演算により算出
した。R=RnMAX−RnMIN(ただしRnMAX、RnMINはそ
れぞれ測定された10個の試料の抵抗値の最大、最小
値)In order to confirm the effect of the present invention, polyvinylidene fluoride is used as the polymer, tungsten carbide is used as the conductive material, and nickel formed by electroless and electrolytic plating is used as the electrode 2. 10 mm, the thickness of the body 1 is 0.24 mm,
The thickness of the electrode 2 is 0.03 mm, and the hot pressing conditions (pressing pressure, temperature, holding time) are variously changed, and the initial resistance value, the resistance variation (R value) and the heat shock cycle test (temperature atmosphere of −40 ° C. Left for 30 minutes, +85
A test in which the test piece was left standing for 30 minutes in a temperature atmosphere of ° C.) The change in resistance value was evaluated 500 times. The results are shown in Table 1. Ten samples were tested and measured for each sample, and the R value indicating the variation in resistance was calculated by the following calculation. R = R nMAX -R nMIN (provided that R nMAX, R Nmin is the maximum resistance of 10 samples measured, respectively, the minimum value)
【0013】表1において、試料No.1〜5は、温度
を200℃、保持時間を10分とし、熱プレス装置5の
プレス荷重(以下これをFとする)を10kgf(ポリ
マーPTC素子7に作用する単位面積当たりのプレス圧
力(以下これをPとする)=12.7kgf/cm2)
からプレス荷重F=60kgf(P=76.4kgf/
cm2)に変化させた場合の各試験結果を示す。(以下
余白)In Table 1, the sample No. 1 to 5 have a temperature of 200 ° C., a holding time of 10 minutes, and a pressing load of the hot pressing device 5 (hereinafter referred to as F) of 10 kgf (pressing pressure per unit area acting on the polymer PTC element 7 (hereinafter referred to as “pressing pressure”). Let P be this) = 12.7 kgf / cm 2 )
To press load F = 60 kgf (P = 76.4 kgf /
Each test result when changed to cm 2 ) is shown. (Below margin)
【0014】[0014]
【表1】 [Table 1]
【0015】この試料No.1〜5の試験結果から分か
るように、前記プレス荷重F=20kgf(プレス圧力
P=25.5kgf/cm2)からプレス荷重F=50
kgf(プレス圧力P=63.5kgf/cm2)まで
の範囲においては、初期抵抗値も低く、かつ抵抗バラツ
キも小さく、ヒートショック試験による抵抗値の変化も
小さいが、プレス荷重Fが10kgf(プレス圧力P=
12.7 kgf/cm2)と低すぎると、初期抵抗
値、抵抗バラツキ、ヒートショック試験後の抵抗値変化
も大きくなる。また、プレス荷重Fが60kgf(プレ
ス圧力P=76.4kgf/cm2)と高すぎると、電
極2から素体1がはみ出し、測定不能となる。したがっ
て、ポリマーPTC素子7に作用させるプレス圧力P
は、好ましくは、25.5kgf/cm2〜63.5k
gf/cm2である。This sample No. As can be seen from the test results of 1 to 5, the press load F = 20 kgf (press pressure P = 25.5 kgf / cm 2 ) to the press load F = 50.
In the range up to kgf (pressing pressure P = 63.5 kgf / cm 2 ), the initial resistance value is low, the resistance variation is small, and the resistance value change by the heat shock test is small, but the pressing load F is 10 kgf (pressing force). Pressure P =
If it is too low (12.7 kgf / cm 2 ), the initial resistance value, the resistance variation, and the resistance value change after the heat shock test become large. If the pressing load F is as high as 60 kgf (pressing pressure P = 76.4 kgf / cm 2 ), the element body 1 protrudes from the electrode 2 and measurement becomes impossible. Therefore, the pressing pressure P applied to the polymer PTC element 7
Is preferably 25.5 kgf / cm 2 to 63.5 k
It is gf / cm 2 .
【0016】試料No.6〜9は、プレス荷重Fとして
35kgf、熱プレス保持時間を10分とし、温度を1
00℃、150℃、300℃、350℃に変化させた場
合の各値の測定結果である。熱プレス温度が100℃の
場合は、150℃、300℃の場合に比較して初期抵抗
値、抵抗バラツキ、ヒートショック試験後の抵抗値変化
も大きくなる。また、熱プレス温度が350℃になる
と、素体のはみ出しを生じて測定不能となる。したがっ
て、熱プレス温度は、好ましくは、150℃〜300℃
である。Sample No. In Nos. 6 to 9, the press load F was 35 kgf, the heat press holding time was 10 minutes, and the temperature was 1
It is a measurement result of each value when changing to 00 ° C, 150 ° C, 300 ° C, and 350 ° C. When the heat pressing temperature is 100 ° C., the initial resistance value, the resistance variation, and the resistance value change after the heat shock test are larger than those at 150 ° C. and 300 ° C. Further, when the hot press temperature reaches 350 ° C., the element body protrudes and measurement becomes impossible. Therefore, the hot pressing temperature is preferably 150 ° C to 300 ° C.
Is.
【0017】試料No.10〜13は、プレス荷重Fと
して35kgf、熱プレス温度を200℃とし、熱プレ
ス保持時間を3分、5分、20分、25分に変化させた
場合の各値の測定結果である。熱プレス時間が3分の場
合は、5分、20分の場合に比較して初期抵抗値、抵抗
バラツキ、ヒートショック試験後の抵抗値変化も大きく
なる。また、保持時間が25分になると、素体のはみ出
しを生じて測定不能となる。したがって、熱プレス温度
は、好ましくは、5分〜20分である。Sample No. 10 to 13 are measurement results of respective values when the press load F was 35 kgf, the hot press temperature was 200 ° C., and the hot press holding time was changed to 3 minutes, 5 minutes, 20 minutes, and 25 minutes. When the heat pressing time is 3 minutes, the initial resistance value, the resistance variation, and the resistance value change after the heat shock test are larger than those when the heat pressing time is 5 minutes or 20 minutes. Further, when the holding time reaches 25 minutes, the element body protrudes and measurement becomes impossible. Therefore, the hot pressing temperature is preferably 5 minutes to 20 minutes.
【0018】試料No.14は、本発明のように熱プレ
スを行わない従来例である。*マークを付加してない前
記好適範囲の試料No.2〜4、7〜9、11、12の
ものは、熱プレスを行わない従来例のNo.14の試料
に比較し、抵抗値は約1/5程度低くなり、抵抗バラツ
キは約40%以下(約3/5以下)となり、ヒートショ
ック試験後の抵抗値変化も、従来例に比較し、約1/3
に小さくなった。Sample No. 14 is a conventional example which does not perform hot pressing as in the present invention. * Sample No. within the above-mentioned suitable range without the mark. Nos. 2 to 4, 7 to 9, 11, and 12 are Nos. Compared with the sample of No. 14, the resistance value is about 1/5 lower, the resistance variation is about 40% or less (about 3/5 or less), and the resistance value change after the heat shock test is also compared with the conventional example, About 1/3
Became smaller.
【0019】[0019]
【発明の効果】本発明によれば、初期抵抗値が低く、か
つ抵抗値のバラツキが小さく、熱衝撃等による抵抗値変
化の少ないポリマーPTC素子を製造することができ
る。According to the present invention, it is possible to manufacture a polymer PTC element having a low initial resistance value, a small resistance value variation, and a small resistance value change due to thermal shock or the like.
【図1】本発明によるポリマーPTC素子の製造方法の
一実施例を示す工程図である。FIG. 1 is a process drawing showing an embodiment of a method for producing a polymer PTC element according to the present invention.
【図2】(A)は従来のポリマーPTC素子の側面図、
(B)はその問題点を説明する部分拡大断面図である。FIG. 2A is a side view of a conventional polymer PTC element,
(B) is a partially enlarged sectional view for explaining the problem.
1:素体、2:電極、3:素材、4:打ち抜き装置、
5:熱プレス装置、6a,6b:プレス板、7:打ち抜
き後のポリマーPTC素子、8:熱プレス後のポリマー
PTC素子1: body, 2: electrode, 3: material, 4: punching device,
5: hot press machine, 6a, 6b: press plate, 7: polymer PTC element after punching, 8: polymer PTC element after hot pressing
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平9−153402(JP,A) 特開 平9−69416(JP,A) 特開 平8−298201(JP,A) 特開 平8−148305(JP,A) 特開 昭63−29901(JP,A) 特開 昭62−106602(JP,A) 特開 昭61−260606(JP,A) 特開 昭61−59701(JP,A) (58)調査した分野(Int.Cl.7,DB名) H01C 7/02 - 7/22 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-9-153402 (JP, A) JP-A-9-69416 (JP, A) JP-A-8-298201 (JP, A) JP-A-8- 148305 (JP, A) JP 63-29901 (JP, A) JP 62-106602 (JP, A) JP 61-260606 (JP, A) JP 61-59701 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01C 7/ 02-7/22
Claims (2)
質を分散混合させた組成物からなる板状をなす正の抵抗
温度特性を有する素体の表裏面に、金属板もしくはメッ
キにより電極を形成して素材とし、 該素材を所定の素子形状に打ち抜いた後、 打ち抜いた素子を熱プレスして素体と電極の熱圧着を行
うことを特徴とするポリマーPTC素子の製造方法。1. An electrode is formed by a metal plate or plating on the front and back surfaces of a plate-shaped element body having a positive resistance temperature characteristic which is made of a thermoplastic polymer and a composition in which a conductive substance is dispersed and mixed in the polymer. A method for producing a polymer PTC element, characterized in that the material is punched out into a predetermined element shape, and then the punched element is hot pressed to thermocompress the element body and the electrodes.
/cm2〜63.5kgf/cm2、温度:150℃〜3
00℃、保持時間:5分〜20分であることを特徴とす
るポリマーPTC素子の製造方法。2. The hot press bonding condition according to claim 1, wherein the press pressure is 25.5 kgf.
/ Cm 2 to 63.5 kgf / cm 2 , temperature: 150 ° C. to 3
A method for producing a polymer PTC element, wherein the temperature is 00 ° C. and the holding time is 5 minutes to 20 minutes.
Priority Applications (1)
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JP27919797A JP3522092B2 (en) | 1997-10-13 | 1997-10-13 | Method for producing polymer PTC element |
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---|---|---|---|
JP27919797A JP3522092B2 (en) | 1997-10-13 | 1997-10-13 | Method for producing polymer PTC element |
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Publication Number | Publication Date |
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JPH11121201A JPH11121201A (en) | 1999-04-30 |
JP3522092B2 true JP3522092B2 (en) | 2004-04-26 |
Family
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TW487272U (en) * | 2001-03-20 | 2002-05-11 | Polytronics Technology Corp | Multilayer circuit boards |
CN101466530A (en) * | 2006-05-26 | 2009-06-24 | 史蒂芬·扬 | A device for improving the consistency of an internal bond strength test on glued bio-based panel products |
JP5287211B2 (en) | 2008-12-17 | 2013-09-11 | 株式会社村田製作所 | Manufacturing method and manufacturing apparatus for ceramic electronic component |
JP7017127B2 (en) * | 2018-07-27 | 2022-02-08 | トヨタ自動車株式会社 | Manufacturing method of electrodes for solid-state batteries |
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