JP2000340402A - Ptc element - Google Patents

Ptc element

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Publication number
JP2000340402A
JP2000340402A JP14723199A JP14723199A JP2000340402A JP 2000340402 A JP2000340402 A JP 2000340402A JP 14723199 A JP14723199 A JP 14723199A JP 14723199 A JP14723199 A JP 14723199A JP 2000340402 A JP2000340402 A JP 2000340402A
Authority
JP
Japan
Prior art keywords
ptc
ptc element
metal plate
electrode
conductive powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP14723199A
Other languages
Japanese (ja)
Inventor
Haruki Hoshi
晴輝 保志
Mitsumune Kataoka
光宗 片岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP14723199A priority Critical patent/JP2000340402A/en
Publication of JP2000340402A publication Critical patent/JP2000340402A/en
Withdrawn legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To improve adhesion with PTC compositions and to make a contact resistance with the PTC compositions low, by junctioning a metallic plate having through holes on the PTC composition surface made of conductive powder dispersed into polymer components and by making the plate an electrode. SOLUTION: Polymer kneaded material is obtained by kneading crystalline high density polyethylene with conductive powder on a heating roller. TiC, WC, W2C and ZrC is mixed as the conductive powder whose particle diameter is about 0.01 to 100 μm by 45 to 55 vol.% of PTC(positive temperature coefficient). Next, the obtained kneaded material is powdered, and after that, an electrode is formed by making a sheet by press molding and by junctioning a metallic plate having through holes of 0.01 to 1 mm and through hole area ratio to the metallic plate area being 1:9 to 9:1 by thermal pressing on both the surfaces of the kneaded material sheet. After that the PTC element is obtained by blanking.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ある特定の温度
(スイッチング温度とする)領域に達したときに急激に
抵抗が上昇する正温度特性、いわゆるPTC(Positive
Temperature Coefficient)特性を有するPTC素子に
関し、特にこのPTC素子の電極となる金属板との接触
抵抗を低減したPTC素子に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called PTC (Positive Temperature Characteristics) in which the resistance rises abruptly when a certain temperature (switching temperature) is reached.
More particularly, the present invention relates to a PTC element having reduced contact resistance with a metal plate serving as an electrode of the PTC element.

【0002】[0002]

【従来の技術】PTC素子は、結晶性高分子に導電性粉
末を混練して得られるPTC組成物からなり、ある特定
の温度で急激な抵抗上昇を示す。PTC組成物は、材料
固有の抵抗値Rと素子に流された電流値Iとで、いわゆ
るジュール熱加熱(I2 R加熱)により発熱する。その
ためPTC組成物に比較的大きな電流が流れると発熱が
起こり、抵抗率が上昇する。
2. Description of the Related Art A PTC element is made of a PTC composition obtained by kneading a conductive powder with a crystalline polymer, and shows a sharp increase in resistance at a specific temperature. The PTC composition generates heat by so-called Joule heating (I 2 R heating) with a resistance value R inherent to the material and a current value I passed through the element. Therefore, when a relatively large current flows through the PTC composition, heat is generated and the resistivity increases.

【0003】PTC素子は、前述のジュール熱加熱を利
用した面状発熱体や、抵抗率の上昇を利用した過電流保
護素子等に用いられる。このようなPTC素子には、ス
テンレス、ニッケル等の金属板表面をPTC組成物表面
に接合し、これを電極としたものがある。
A PTC element is used for a sheet heating element utilizing the above-described Joule heating, an overcurrent protection element utilizing an increase in resistivity, and the like. As such a PTC element, there is an element in which a metal plate surface made of stainless steel, nickel or the like is joined to a PTC composition surface, and this is used as an electrode.

【0004】また、PTC組成物と電極との密着性向上
を目的とし、PTC組成物表面に接する面を物理的、化
学的に粗面化した金属板を接合しこれを電極としたもの
がある。
In order to improve the adhesion between the PTC composition and the electrode, a metal plate whose surface in contact with the surface of the PTC composition is physically and chemically roughened is used as an electrode. .

【0005】[0005]

【発明が解決しようとする課題】しかしながら、金属板
表面をPTC組成物表面に接合して電極とした場合、良
好なオーミック接触が得られず、またPTC組成物と電
極間の密着性が悪いため、繰り返し動作により抵抗値の
大幅な抵抗増加がある等、実用上の問題が残る。
However, when the metal plate surface is joined to the PTC composition surface to form an electrode, good ohmic contact cannot be obtained, and the adhesion between the PTC composition and the electrode is poor. Practical problems remain, such as a large increase in resistance due to repeated operation.

【0006】また、PTC組成物表面に接する面を物理
的、化学的に粗面化した金属板を接合して電極とした場
合、比較的良好なオーミック接触が得られ、PTC組成
物と電極間の密着性も良好であるが、PTC組成物と金
属板との間の接触抵抗が高い問題が残る。
Further, when a metal plate whose surface in contact with the surface of the PTC composition is physically and chemically roughened is joined to form an electrode, relatively good ohmic contact is obtained, and the PTC composition and the electrode Has good adhesion, but the problem remains that the contact resistance between the PTC composition and the metal plate is high.

【0007】そこで、本発明の技術的課題は、PTC組
成物との間の密着性が良好であり、またPTC組成物と
の接触抵抗が低い電極を有するPTC素子を提供するこ
とにある。
Accordingly, it is an object of the present invention to provide a PTC element having an electrode having good adhesion to a PTC composition and having low contact resistance with the PTC composition.

【0008】[0008]

【課題を解決するための手段】この課題を解決するた
め、本発明者等は種々検討を行った結果、ポリマー成分
とこのポリマー成分に分散された導電性粉末からなるP
TC組成物表面に孔径が0.01〜1mmであり、孔面
積:金属板面積=1:9〜9:1である貫通孔を有する
金属板を接合し、これを電極とすることによつて、貫通
孔にPTC組成物が介在することでPTC組成物との間
の密着性が良好であり、またPTC組成物との間の接触
抵抗が低い電極を有するPTC素子が得られることが判
明し、本発明をなすに至ったものである。
Means for Solving the Problems In order to solve this problem, the present inventors have made various studies, and as a result, have found that a polymer component and a conductive powder dispersed in the polymer component are used.
A metal plate having a through hole having a hole diameter of 0.01 to 1 mm and a hole area: metal plate area of 1: 9 to 9: 1 is joined to the surface of the TC composition, and this is used as an electrode. It has been found that the presence of the PTC composition in the through-hole results in good adhesion between the PTC composition and the PTC element having an electrode having low contact resistance with the PTC composition. The present invention has been accomplished.

【0009】本発明によれば、ポリマー成分とこのポリ
マー成分に分散された導電性粉末からなるPTC組成物
表面に、貫通孔を有する金属板を接合し、これを電極と
したことを特徴とするPTC素子が得られる。
According to the present invention, a metal plate having through holes is joined to the surface of a PTC composition comprising a polymer component and a conductive powder dispersed in the polymer component, and this is used as an electrode. A PTC element is obtained.

【0010】また、本発明によれば、前記PTC素子に
おいて、このPTC素子に接合された金属板の貫通孔径
は、0.01〜1mmであることを特徴とするPTC素
子が得られる。
According to the present invention, in the PTC element, a PTC element characterized in that a metal plate joined to the PTC element has a through hole diameter of 0.01 to 1 mm.

【0011】また、本発明によれば、前記PTC素子に
おいて、このPTC素子に接合された金属板の貫通孔径
トータル面積と前記金属板の面積との比は、貫通孔面
積:金属板面積=1:9〜9:1であることを特徴とす
るPTC素子が得られる。
Further, according to the present invention, in the PTC element, the ratio between the total area of the through-hole diameter of the metal plate joined to the PTC element and the area of the metal plate is as follows: through-hole area: metal plate area = 1. : 9 to 9: 1.

【0012】また、本発明によれば、前記PTC素子に
おいて、このPTC素子に分散された導電性粉末は、T
iC、WC、W2 C、及びZrCからなる群から選択さ
れた少なくとも一種であることを特徴とするPTC素子
が得られる。
Further, according to the present invention, in the PTC element, the conductive powder dispersed in the PTC element is
A PTC element characterized by being at least one selected from the group consisting of iC, WC, W 2 C and ZrC is obtained.

【0013】さらに、本発明によれば、前記PTC素子
において、このPTC素子に分散された導電性粉末は、
前記PTC組成物に対して45〜55vol%で分散し
ていることを特徴とするPTC素子が得られる。
Further, according to the present invention, in the PTC element, the conductive powder dispersed in the PTC element includes:
A PTC element characterized by being dispersed at 45 to 55 vol% with respect to the PTC composition is obtained.

【0014】[0014]

【発明の実施の形態】以下、本発明の実施の形態につい
て説明する。
Embodiments of the present invention will be described below.

【0015】(第1の実施の形態)まず、ポリマー成分
として軟化点128℃の結晶性高密度ポリエチレンと導
電性粉末を140〜200℃程度の温度での加熱ロール
上で混練し高分子混練物を得た。導電性粉末としては、
粒径が0.01〜100μmのTiC,WC,W2C、
ZrCを用い、それぞれ50vol%混合した。
First Embodiment First, as a polymer component, a crystalline high-density polyethylene having a softening point of 128 ° C. and conductive powder are kneaded on a heating roll at a temperature of about 140 to 200 ° C. to obtain a polymer kneaded product. I got As the conductive powder,
TiC, WC, W 2 C having a particle size of 0.01 to 100 μm,
Each was mixed at 50 vol% using ZrC.

【0016】次に、得られた混練物を粉末化した後、1
40〜200℃程度の温度でプレス成型しシート化し
た。得られた混練物シート両面に、0.1mmの貫通孔
を貫通孔面積:金属板面積が1:1で有する金属板を1
40〜200℃程度の温度の熱プレスにより接合し電極
を形成した。その後、1cm2 の大きさに打ち抜き加工
し、PTC素子を得た。同時に同様の方法で1mmの貫
通孔を貫通孔面積:金属板面積が1:1で有する金属板
を電極とするPTC素子(本発明例1)を得た。
Next, after the obtained kneaded material is powdered,
The sheet was formed by press molding at a temperature of about 40 to 200 ° C. A metal plate having a through hole area of 0.1 mm and a metal plate area of 1: 1 was formed on both sides of the obtained kneaded material sheet.
The electrodes were formed by bonding by hot pressing at a temperature of about 40 to 200 ° C. Then, it was punched to a size of 1 cm 2 to obtain a PTC element. At the same time, a PTC element (Example 1 of the present invention) using a metal plate having a through-hole area of 1 mm and a metal plate area of 1: 1 as an electrode was obtained by the same method.

【0017】また、比較のために、混練物のシート化ま
では、第1の実施の形態によるものと同様に行った。そ
の後混練物シート両面に、金属板を140〜200℃程
度の温度の熱プレスにより接合し電極を形成した。その
後、1cm2 の大きさに打ち抜き加工し、PTC素子
(比較例1)を得た。
For comparison, the steps up to sheet formation of the kneaded material were performed in the same manner as in the first embodiment. Thereafter, a metal plate was bonded to both surfaces of the kneaded material sheet by hot pressing at a temperature of about 140 to 200 ° C. to form electrodes. Then, it was stamped out to a size of 1 cm 2 to obtain a PTC element (Comparative Example 1).

【0018】更に、比較のために、混練物のシート化ま
では第1の実施の形態によるものと同様に行った。その
後、混練物シート両面に、混練物シートに接する片面を
電解質で粗面化した金属板を140〜200℃程度の温
度の熱プレスによって、接合し電極を形成した。その
後、1cm2 の大きさに打ち抜き加工し、PTC素子
(比較例2)を得た。
Further, for comparison, the kneaded material was formed into a sheet in the same manner as in the first embodiment. Thereafter, a metal plate having one surface in contact with the kneaded material sheet roughened with an electrolyte was bonded to both surfaces of the kneaded material sheet by hot pressing at a temperature of about 140 to 200 ° C. to form an electrode. Then, it was punched to a size of 1 cm 2 to obtain a PTC element (Comparative Example 2).

【0019】(第2の実施の形態)混練物のシート化ま
では、第1の実施の形態と同様に行った。その後、混練
物シート両面に、0.1mmの貫通孔を貫通孔面積と金
属板面積の比率が100:0から5:95の範囲の金属
板を140〜200℃程度の温度の熱プレスによって、
それぞれ接合し電極を形成した。その後、1cm2 の大
きさに打ち抜き加工し、PTC素子(本発明例2)を得
た。
(Second Embodiment) The process up to sheet formation of the kneaded material was performed in the same manner as in the first embodiment. Then, on both surfaces of the kneaded material sheet, a 0.1 mm through hole was formed by hot pressing a metal plate having a ratio of the through hole area to the metal plate area of 100: 0 to 5:95 in a range of about 140 to 200 ° C.
Each was joined to form an electrode. Then, it was punched to a size of 1 cm 2 to obtain a PTC element (Example 2 of the present invention).

【0020】また、比較のために、混練物のシート化ま
では、第1の実施の形態によるものと同様に行った。そ
の後、混練物シート両面に、2mmの貫通孔を貫通孔面
積:金属板面積が1:1で有する金属板を140〜20
0℃程度の温度の熱プレスにより接合し電極を形成し
た。その後、1cm2 の大きさに打ち抜き加工し、PT
C素子(比較例3)を得た。
For comparison, the process up to sheeting the kneaded material was performed in the same manner as in the first embodiment. After that, a metal plate having a through-hole area of 2 mm and a metal plate area of 1: 1 on both surfaces of the kneaded material sheet at 140 to 20 was formed.
The electrodes were formed by bonding by hot pressing at a temperature of about 0 ° C. After that, it is punched to 1cm 2
C element (Comparative Example 3) was obtained.

【0021】(第3の実施の形態)第1の実施の形態と
同様に、ポリマー成分として軟化点128℃の結晶性高
密度ポリエチレンと導電性粉末を140〜200℃程度
の温度での加熱ロール上で混練し高分子混練物を得た。
導電性粉末としては、粒径が0.01〜100μm、T
iC、WC、W2 C、ZrCを用い、それぞれ40〜6
0vol%それぞれ混合した。次に得られた混練物を粉
末化した後、140〜200℃程度の温度でプレス成型
しシート化した。得られた混練物シート両面に、0.1
mmの貫通孔を貫通孔面積:金属板面積が1:1で有す
る金属板を140〜200℃程度の温度の熱プレスによ
り接合し電極を形成した。その後、1cm2 の大きさに
打ち抜き加工し、PTC素子を得た。
(Third Embodiment) As in the first embodiment, a crystalline high-density polyethylene having a softening point of 128 ° C. and a conductive powder as a polymer component are heated at a temperature of about 140 to 200 ° C. The above mixture was kneaded to obtain a kneaded polymer.
As the conductive powder, a particle size of 0.01 to 100 μm, T
Using iC, WC, W 2 C, and ZrC, 40 to 6
0 vol% each was mixed. Next, after the obtained kneaded material was powdered, it was press-molded at a temperature of about 140 to 200 ° C to form a sheet. 0.1% on both sides of the obtained kneaded material sheet
An electrode was formed by bonding a metal plate having a through-hole of 1 mm with a through-hole area: metal plate area of 1: 1 by hot pressing at a temperature of about 140 to 200 ° C. Then, it was punched to a size of 1 cm 2 to obtain a PTC element.

【0022】以上のようにして得られたPTC素子電極
表面に、リード線を半田付けにより接続した。更に、周
囲をエポキシ樹脂で被覆して電極接合強度測定用試料を
作製した。得られた電極按合強度測定用試料のリード線
を引っ張り、電極と素子との接合強度を測定した結果を
下記表1に示した。
A lead wire was connected to the surface of the PTC element electrode obtained as described above by soldering. Further, the periphery was covered with an epoxy resin to prepare a sample for measuring electrode bonding strength. Table 1 below shows the results of measuring the bonding strength between the electrode and the element by pulling the lead wire of the sample for measuring the electrode mating strength.

【0023】下記表1から明らかなように、本発明によ
るPTC素子電極の接合強度は、金属板を粗面化してい
ない比較例1と比較して大きく、金属板を粗面化した比
較例2と同等である。また、2mmの貫通孔を有する金
属板を電極とする比較例3よりも大きい。比較例3のも
のは貫通孔を有しない比較例1よりは接合強度が大きい
ことがわかる。また、貫通孔が0.01mmより小さい
ものは加工性が悪いためこれも本発明の範囲から除外さ
れる。
As apparent from Table 1 below, the bonding strength of the PTC element electrode according to the present invention is larger than that of Comparative Example 1 in which the metal plate is not roughened, and Comparative Example 2 in which the metal plate is roughened. Is equivalent to Also, it is larger than Comparative Example 3 in which a metal plate having a 2 mm through hole is used as an electrode. It can be seen that Comparative Example 3 has a higher bonding strength than Comparative Example 1 having no through hole. In addition, those having a through hole smaller than 0.01 mm have poor workability, and are also excluded from the scope of the present invention.

【0024】[0024]

【表1】 [Table 1]

【0025】ここで、高分子PTC素子の目標特性は、
室温抵抗が前述のように2Ω・cm以下であること、抵
抗率が急激に上昇した後(スイッチング後)の抵抗率と
室温での抵抗率の比(スイッチング後R/室温R)が、
過電流保護素子として十分動作しかつ面状発熱体として
十分使用可能である104 以上であることとした。
Here, the target characteristics of the polymer PTC element are as follows:
As described above, the room temperature resistance is 2 Ω · cm or less, and the ratio of the resistivity after the rapid rise in the resistivity (after switching) to the resistivity at room temperature (R after switching / R at room temperature) is:
The number is set to 10 4 or more, which sufficiently operates as an overcurrent protection element and can be sufficiently used as a sheet heating element.

【0026】また、高分子PTC素子を繰り返しスイッ
チングさせた際の室温抵抗率目標値は、500回スイッ
チング後にも2Ω・cmを上回らないこととした。
The target value of the room temperature resistivity when the polymer PTC element is repeatedly switched does not exceed 2 Ω · cm even after switching 500 times.

【0027】下記表2に、第1の実施の形態で得られた
PTC素子の各導電性粉末と特性の関係を示した。いず
れの導電性粉末を用いても、目標を連成した高分子PT
C組成物が得られることが判明した。
Table 2 below shows the relationship between the respective conductive powders and the properties of the PTC element obtained in the first embodiment. Regardless of which conductive powder is used, the polymer PT
It was found that a C composition was obtained.

【0028】[0028]

【表2】 [Table 2]

【0029】下記表3に第3の実施の形態で得られた素
子の貫通孔面積比と金属板面積の比と室温抵抗率の関係
を示した。貫通孔が無いものは目標特性に達していない
ため本発明の範囲から除外される。
Table 3 below shows the relationship between the through hole area ratio, the metal plate area ratio, and the room temperature resistivity of the device obtained in the third embodiment. Those without a through-hole are excluded from the scope of the present invention because they do not reach the target characteristics.

【0030】[0030]

【表3】 [Table 3]

【0031】また、下記表4に、第3の実施の形態によ
るPTC組成物における各金属粉末分散量に対する、高
分子PTC素子をスイッチング(10A(50V)通
電)させた際の特性を示した。導電性粉末の分散量が4
0vol%以下の場合、室温抵抗率が目標に達しないた
め、本発明の範囲から除外される。また、導電性粉末分
散量が60vol%を上回ると、室温抵抗が著しく低下
し通電時の素子動作現象がみられなくなるため、本発明
の範囲から除外される。
Table 4 below shows the characteristics when the polymer PTC element was switched (10 A (50 V) applied) with respect to the dispersion amount of each metal powder in the PTC composition according to the third embodiment. Dispersion amount of conductive powder is 4
If it is 0 vol% or less, the room temperature resistivity does not reach the target, and is excluded from the scope of the present invention. On the other hand, when the dispersion amount of the conductive powder exceeds 60 vol%, the resistance at room temperature is remarkably reduced, and the element operation phenomenon upon energization is not observed.

【0032】[0032]

【表4】 [Table 4]

【0033】次に、第1の実施の形態による方法で得ら
れたPTC素子に10A(50V)の電流を繰り返し通
電した際の素子動作後の抵抗率の変化を図1に示した。
Next, FIG. 1 shows a change in resistivity after device operation when a current of 10 A (50 V) was repeatedly applied to the PTC device obtained by the method according to the first embodiment.

【0034】ここで、比較例1の素子は、初期の室温抵
抗は2Ω・cm以下であるが、1回目の通電で発火した
ために図1には記載されていない。
Here, the element of Comparative Example 1 has an initial room temperature resistance of 2 Ω · cm or less, but is not shown in FIG. 1 because it was fired by the first energization.

【0035】また、図1の曲線12で示される比較例2
の素子は、繰り返し通電後の抵抗率の変化は少ないが、
初期の室温抵抗が目標値より高い。
Further, Comparative Example 2 shown by a curve 12 in FIG.
The element has little change in resistivity after repeated energization,
The initial room temperature resistance is higher than the target value.

【0036】さらに、図1の曲線13で示される比較例
3の素子は、初期室温抵抗率は目標値に達しているもの
の、繰り返し通電により室温抵抗率が上昇している。こ
れは、繰り返し通電により金属板とPTC組成物が剥離
するために、金属板とPTC組成物の接触抵抗が大きく
なるためである。
Further, in the device of Comparative Example 3 shown by the curve 13 in FIG. 1, although the initial room temperature resistivity has reached the target value, the room temperature resistivity has been increased by repeated energization. This is because the contact resistance between the metal plate and the PTC composition increases because the PTC composition separates from the metal plate due to repeated energization.

【0037】このため貫通孔面積が1mmより大きいも
のは、本発明の範囲から除外される。これに対して、図
1の曲線11で示される本発明例1の各導電性粉末を分
散させた素子は、室温抵抗率<2Ω・cmと目標値を下
回り、かつ繰り返し通電後も<2Ω・cmと室温抵抗目
標値内を維持した。
For this reason, those having a through-hole area larger than 1 mm are excluded from the scope of the present invention. On the other hand, the element in which each conductive powder of Example 1 of the present invention shown by the curve 11 in FIG. 1 is dispersed has a room temperature resistivity <2 Ω · cm, which is lower than the target value, and is less than 2 Ω · cm and room temperature resistance within the target value.

【0038】以上説明した本発明の実施の形態において
は、ポリマー成分とこのポリマー成分に分散された導電
性粉末からなるPTC組成物表面に孔径が0.01mm
以上1mm以下であり、孔面積:金属板面積=1:9〜
9:1である貫通孔を有する金属板を接合しこれを電極
とすることによって、PTC組成物との間の接触抵抗が
低い電極を有するPTC素子が得られる。
In the embodiment of the present invention described above, a PTC composition comprising a polymer component and a conductive powder dispersed in the polymer component has a pore size of 0.01 mm.
Not less than 1 mm, hole area: metal plate area = 1: 9-
By joining a metal plate having a 9: 1 through-hole and using this as an electrode, a PTC element having an electrode with low contact resistance with the PTC composition can be obtained.

【0039】[0039]

【発明の効果】以上説明したように、本発明によれば、
ポリマー成分とこのポリマー成分に分散された導電性粉
末からなるPTC組成物表面に、貫通孔を有する金属板
を接合し、これを電極とすることによって、PTC組成
物との間の密着性が良好であり、またPTC組成物との
間の接触抵抗が低い電極を有するPTC素子が得られ
る。
As described above, according to the present invention,
By bonding a metal plate having a through hole to the surface of a PTC composition comprising a polymer component and a conductive powder dispersed in the polymer component and using this as an electrode, good adhesion between the PTC composition and the PTC composition is obtained. And a PTC element having an electrode with low contact resistance with the PTC composition is obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】素子による繰り返し通電回数と室温抵抗率の関
係を示す図である。
FIG. 1 is a diagram showing the relationship between the number of times of repeated energization by an element and the room temperature resistivity.

【符号の説明】[Explanation of symbols]

11 曲線(本発明例1) 12 曲線(比較例1) 13 曲線(比較例2) 11 Curve (Inventive Example 1) 12 Curve (Comparative Example 1) 13 Curve (Comparative Example 2)

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 ポリマー成分とこのポリマー成分に分散
された導電性粉末からなるPTC組成物表面に、貫通孔
を有する金属板を接合し、これを電極としたことを特徴
とするPTC素子。
1. A PTC element characterized in that a metal plate having through holes is joined to the surface of a PTC composition comprising a polymer component and a conductive powder dispersed in the polymer component, and this is used as an electrode.
【請求項2】 請求項1記載のPTC素子において、こ
のPTC素子に接合された金属板の貫通孔径は、0.0
1〜1mmであることを特徴とするPTC素子。
2. The PTC element according to claim 1, wherein a diameter of the through hole of the metal plate joined to the PTC element is 0.0.
A PTC element having a size of 1 to 1 mm.
【請求項3】 請求項1記載のPTC素子において、こ
のPTC素子に接合された金属板の貫通孔径トータル面
積と前記金属板の面積との比は、貫通孔面積:金属板面
積=1:9〜9:1であることを特徴とするPTC素
子。
3. The PTC element according to claim 1, wherein the ratio of the total area of the through-hole diameter of the metal plate joined to the PTC element to the area of the metal plate is as follows: through-hole area: metal plate area = 1: 9. PTC element, wherein the ratio is up to 9: 1.
【請求項4】 請求項1記載のPTC素子において、こ
のPTC素子に分散された導電性粉末は、TiC、W
C、W2 C、及びZrCからなる群から選択された少な
くとも1種であることを特徴とするPTC素子。
4. The PTC element according to claim 1, wherein the conductive powder dispersed in the PTC element comprises TiC, W
A PTC element, which is at least one selected from the group consisting of C, W 2 C, and ZrC.
【請求項5】 請求項1記載のPTC素子において、こ
のPTC素子に分散された導電性粉末は、前記PTC組
成物に対して45〜55vol%で分散していることを
特徴とするPTC素子。
5. The PTC element according to claim 1, wherein the conductive powder dispersed in the PTC element is dispersed at 45 to 55 vol% with respect to the PTC composition.
JP14723199A 1999-05-26 1999-05-26 Ptc element Withdrawn JP2000340402A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14723199A JP2000340402A (en) 1999-05-26 1999-05-26 Ptc element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14723199A JP2000340402A (en) 1999-05-26 1999-05-26 Ptc element

Publications (1)

Publication Number Publication Date
JP2000340402A true JP2000340402A (en) 2000-12-08

Family

ID=15425547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14723199A Withdrawn JP2000340402A (en) 1999-05-26 1999-05-26 Ptc element

Country Status (1)

Country Link
JP (1) JP2000340402A (en)

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