JP2007036045A - Ptc element and method for manufacturing the same - Google Patents

Ptc element and method for manufacturing the same Download PDF

Info

Publication number
JP2007036045A
JP2007036045A JP2005219355A JP2005219355A JP2007036045A JP 2007036045 A JP2007036045 A JP 2007036045A JP 2005219355 A JP2005219355 A JP 2005219355A JP 2005219355 A JP2005219355 A JP 2005219355A JP 2007036045 A JP2007036045 A JP 2007036045A
Authority
JP
Japan
Prior art keywords
ptc
region
electrode
ptc element
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005219355A
Other languages
Japanese (ja)
Inventor
Nobuo Kobayashi
信夫 小林
Hisanao Tosaka
久直 戸坂
Masashi Goto
真史 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2005219355A priority Critical patent/JP2007036045A/en
Publication of JP2007036045A publication Critical patent/JP2007036045A/en
Pending legal-status Critical Current

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a PTC element excellent in withstand voltage characteristics and a method for manufacturing the PTC element. <P>SOLUTION: The PTC element 1 is provided with a first element 2, a second electrode 4, and a PTC element assembly L 5 disposed between the first electrode 2 and the second electrode 4. The PTC element assembly L5 has a first PTC region 6 and a second PTC region 8 containing a resin and conductive particles, and an intermediate region 10 sandwiched between the first PTC region 6 and the second PTC region 8. The intermediate region 10 is extended in a direction with which an arrow A direction that is the disposition direction of the first electrode 2, the PTC element assembly L5, and the second electrode 4. In addition, the intermediate region 10 has a value of resistance higher than those of the first PTC region 6 and the second PTC region 8. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、PTC素子及びPTC素子の製造方法に関する。   The present invention relates to a PTC element and a method for manufacturing a PTC element.

従来のPTC素子として、例えば特許文献1に記載されているように、樹脂に導電性粒子を分散させて成るPTC素体(有機質正温度特性組成物)を電極で挟んだものが知られている。
特開平5−021207号公報
As a conventional PTC element, for example, as described in Patent Document 1, a PTC element body (organic positive temperature characteristic composition) obtained by dispersing conductive particles in a resin is sandwiched between electrodes. .
JP-A-5-021207

特許文献1記載のPTC素子が備えるPTC素体の内部には、製造時における導電性粒子の分散ばらつきや空気の混入によって、導電性粒子の凝集した領域が形成されることがある。このような領域が形成されたPTC素体をPTC素子に用いると、かかる領域を介して導電パスが構築されてしまい、PTC素子の耐電圧特性が低下するという問題が生じうる。   In the PTC element body included in the PTC element described in Patent Document 1, there may be a case where a region where the conductive particles are aggregated is formed due to dispersion dispersion of the conductive particles at the time of manufacture or air mixing. When the PTC element body in which such a region is formed is used for a PTC element, a conductive path is established through the region, which may cause a problem that a withstand voltage characteristic of the PTC element is deteriorated.

そこで、本発明は、耐電圧特性が良好なPTC素子及びPTC素子の製造方法を提供することを課題とする。   Therefore, an object of the present invention is to provide a PTC element having good withstand voltage characteristics and a method for manufacturing the PTC element.

本発明に係るPTC素子は、互いに対向した状態で配置された1対の電極と、1対の電極の間に配置されており、且つ、正の抵抗温度特性を有するPTC素体と、を備え、PTC素体は、樹脂と導電性粒子とを含む複数のPTC領域と、PTC領域の間に挟まれると共に一対の電極及びPTC素体の配置方向と交差する方向に延びる中間領域と、を有しており、中間領域は、PTC領域よりも高い抵抗値を有することを特徴とする。   A PTC element according to the present invention includes a pair of electrodes disposed in a state of being opposed to each other, and a PTC element body disposed between the pair of electrodes and having a positive resistance temperature characteristic. The PTC element body includes a plurality of PTC regions including a resin and conductive particles, and an intermediate region sandwiched between the PTC regions and extending in a direction intersecting with the arrangement direction of the pair of electrodes and the PTC element body. The intermediate region has a higher resistance value than the PTC region.

本発明のPTC素子は、一対の電極と、この電極に挟まれたPTC素体とを備えている。PTC素体内には中間領域が形成されており、この中間領域は高い抵抗値を有している。このような高抵抗の領域をPTC素体内に設けることによって、導電パスの構築を抑制することができる。   The PTC element of the present invention includes a pair of electrodes and a PTC element body sandwiched between the electrodes. An intermediate region is formed in the PTC element, and this intermediate region has a high resistance value. By providing such a high resistance region in the PTC body, the construction of the conductive path can be suppressed.

ところで、導電パスの構築を抑制するには、PTC素体の表面を高抵抗の膜等で覆うことも考えられる。しかしながら、この場合、PTC素体に配置した電極によって高抵抗の膜が傷つけられてしまい、導電パスの構築を十分に抑制できないおそれがある。これに対して、本発明のPTC素子が備えるPTC素体では、中間領域はPTC領域とPTC領域との間に位置している。そのため、電極によって中間領域が傷つくことがない。したがって、導電パスの構築を確実に抑制することができる。その結果、耐電圧特性が良好なPTC素子を得ることができる。   By the way, in order to suppress the construction of the conductive path, it is conceivable to cover the surface of the PTC element body with a high-resistance film or the like. However, in this case, the high-resistance film is damaged by the electrode disposed on the PTC element body, and the construction of the conductive path may not be sufficiently suppressed. On the other hand, in the PTC element body included in the PTC element of the present invention, the intermediate region is located between the PTC region and the PTC region. Therefore, the intermediate region is not damaged by the electrode. Therefore, the construction of the conductive path can be reliably suppressed. As a result, a PTC element with good withstand voltage characteristics can be obtained.

また、中間領域は主成分として樹脂を含んでおり、中間領域に含まれる樹脂とPTC領域に含まれる樹脂とは成分が同一であることが好ましい。この場合、同一の成分からなる樹脂を含む中間領域とPTC領域とは、接合が容易となる。その結果、中間領域とPTC領域との接合状態が良好なPTC素子を得ることができる。   The intermediate region contains a resin as a main component, and it is preferable that the resin contained in the intermediate region and the resin contained in the PTC region have the same components. In this case, the intermediate region including the resin composed of the same component and the PTC region can be easily joined. As a result, it is possible to obtain a PTC element in which the bonding state between the intermediate region and the PTC region is good.

また、電極の面のうちPTC素体と接する面には、粗面処理が施されていることが好ましい。この場合、電極をPTC素体に配した際に、電極の面に形成された微細な凸部がPTC素体の表面に入り込むこととなる。よって、PTC素体に対する電極の接合強度を向上させることができる。   Moreover, it is preferable that the surface which contacts a PTC element | base_body among the surfaces of an electrode is roughened. In this case, when the electrode is disposed on the PTC element body, fine convex portions formed on the surface of the electrode enter the surface of the PTC element body. Therefore, the bonding strength of the electrode with respect to the PTC element body can be improved.

本発明に係るPTC素子の製造方法は、互いに対向した状態で配置された1対の電極と、1対の電極の間に配置されており、且つ、正の抵抗温度特性を有するPTC素体と、を備えるPTC素子の製造方法であって、樹脂と導電性粒子とを含むPTC基材を複数用意する第1の工程と、複数のPTC基材のうち少なくとも一つのPTC基材の所定の面に、当該PTC基材よりも高い抵抗値を有する高抵抗領域を形成する第2の工程と、高抵抗領域が間に位置するように複数のPTC基材を重ね、PTC素体となるPTC成形体を形成する第3の工程と、PTC基材の積層方向に対してPTC成形体を挟むように1対の電極を配置する第4の工程と、1対の電極を配置した後、PTC成形体を架橋させる第5の工程と、を有することを特徴とする。   A method of manufacturing a PTC element according to the present invention includes a pair of electrodes arranged in a state of being opposed to each other, a PTC element body disposed between the pair of electrodes, and having a positive resistance temperature characteristic. A first step of preparing a plurality of PTC substrates including a resin and conductive particles, and a predetermined surface of at least one PTC substrate among the plurality of PTC substrates. And a second step of forming a high resistance region having a higher resistance value than the PTC base material, and a plurality of PTC base materials are stacked so that the high resistance region is positioned between them, thereby forming a PTC body. A third step of forming a body, a fourth step of arranging a pair of electrodes so as to sandwich the PTC molded body in the stacking direction of the PTC substrate, and a PTC molding after arranging the pair of electrodes And a fifth step of cross-linking the body. .

この製造方法では、PTC基材の所定の面に高抵抗領域を形成した後、この高抵抗領域が間に位置するようにPTC基材を重ね合わせるので、高抵抗領域はPTC基材とPTC基材との間に挟まれる形になる。このように、PTC基材とPTC基材との間に高抵抗領域を設けることによって、導電パスの構築を確実に阻害することができる。その結果、耐電圧特性が良好なPTC素子を得ることができる。   In this manufacturing method, after the high resistance region is formed on a predetermined surface of the PTC substrate, the PTC substrate is overlapped so that the high resistance region is located between the PTC substrate and the high resistance region. It will be sandwiched between the materials. Thus, by providing the high resistance region between the PTC base material and the PTC base material, the construction of the conductive path can be reliably inhibited. As a result, a PTC element with good withstand voltage characteristics can be obtained.

また、第2の工程は、PTC基材を加熱し、当該PTC基材に含まれる樹脂を所定の面に浮き出させることで高抵抗領域を形成することが好ましい。この場合、PTC基材を加熱することにより高抵抗領域を形成できるため、高抵抗領域を容易に形成することができる。   Moreover, it is preferable that a 2nd process forms a high resistance area | region by heating a PTC base material and raising the resin contained in the said PTC base material on a predetermined | prescribed surface. In this case, since the high resistance region can be formed by heating the PTC substrate, the high resistance region can be easily formed.

また、第2の工程は、PTC基材に含まれる樹脂とは成分が異なる樹脂を用いて高抵抗領域を形成することが好ましい。   Moreover, it is preferable that a 2nd process forms a high resistance area | region using resin from which a component differs from resin contained in a PTC base material.

また、第2の工程は、PTC基材の所定の面をエッチングして導電性粒子を除去することが好ましい。この場合、高抵抗領域を形成するために新たな材料を必要としないため、高抵抗領域を安価に形成することができる。   Moreover, it is preferable that a 2nd process etches the predetermined surface of a PTC base material, and removes electroconductive particle. In this case, since a new material is not required for forming the high resistance region, the high resistance region can be formed at low cost.

本発明に係るPTC素子は、互いに対向した状態で配置された第1の電極及び第2の電極と、第1の電極と第2の電極との間に配置されており、且つ、正の抵抗温度特性を有するPTC素体と、を備え、PTC素体は、樹脂及び導電性粒子を含むと共に第1の電極と接合する第1のPTC領域と、樹脂及び導電性粒子を含むと共に第2の電極と接合する第2のPTC領域と、第1のPTC領域と第2のPTC領域との間に位置すると共に第1のPTC領域及び第2のPTC領域よりも高い抵抗値を有する中間領域と、を有することを特徴とする。   A PTC element according to the present invention is disposed between a first electrode and a second electrode disposed in a state of facing each other, between the first electrode and the second electrode, and has a positive resistance. A PTC element body having temperature characteristics, wherein the PTC element body includes a resin and conductive particles, and includes a first PTC region bonded to the first electrode, a resin and conductive particles, and a second A second PTC region joined to the electrode, an intermediate region located between the first PTC region and the second PTC region and having a higher resistance value than the first PTC region and the second PTC region; It is characterized by having.

本発明のPTC素体は、高抵抗の中間領域を有している。この中間領域は、第1のPTC領域と第2のPTC領域との間に位置しているので、PTC素子の表面に配置された第1の電極及び第2の電極によって傷つくことがない。そのため、導電パスの構築を確実に阻害することができる。よって、耐電圧特性が良好なPTC素子を得ることができる。   The PTC element body of the present invention has a high-resistance intermediate region. Since the intermediate region is located between the first PTC region and the second PTC region, the intermediate region is not damaged by the first electrode and the second electrode arranged on the surface of the PTC element. Therefore, the construction of the conductive path can be reliably inhibited. Therefore, a PTC element with good withstand voltage characteristics can be obtained.

本発明によれば、耐電圧特性が良好なPTC素子及びPTC素子の製造方法を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a PTC element with a favorable withstand voltage characteristic and a PTC element can be provided.

以下、添付図面を参照して、本発明の好適な実施形態について詳細に説明する。なお、説明において、同一要素又は同一機能を有する要素には、同一符号を用いることとし、重複する説明は省略する。   Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

図1は本実施形態に係るPTC素子の断面図である。図1に示されるように、PTC素子1は、1対の電極である第1の電極2及び第2の電極4と、PTC素体L5とを備えている。   FIG. 1 is a cross-sectional view of a PTC element according to this embodiment. As shown in FIG. 1, the PTC element 1 includes a first electrode 2 and a second electrode 4 that are a pair of electrodes, and a PTC element body L5.

第1の電極2及び第2の電極4は、互いに対向した状態で配置されている。第1の電極2及び第2の電極4はそれぞれ電子伝導性を有しており、第1の電極2及び第2の電極4の面のうち、PTC素体L5と接する面2a,4aは、粗面化されている。より具体的には、第1の電極2及び第2の電極4は、Ni又はNiメッキを施したCu箔から成っている。第1の電極2及び第2の電極4は平板の形状を呈しており、第1の電極2の面2a及び第2の電極4の面4aには、節瘤(凹凸差が約5〜15μm程度で中間部から基部に至る部分が頭部に対してくびれている形状)が多数形成されている。この節瘤は、PTC素体L5の表面に入り込んでいる。第1の電極2及び第2の電極4には、図示しないリードが接続される。接続されたリードを介して、第1の電極2及び第2の電極4から外部に対して電荷を放出又は注入することが可能となる。   The first electrode 2 and the second electrode 4 are arranged in a state of facing each other. Each of the first electrode 2 and the second electrode 4 has electron conductivity. Of the surfaces of the first electrode 2 and the second electrode 4, the surfaces 2a and 4a in contact with the PTC element body L5 are It is roughened. More specifically, the 1st electrode 2 and the 2nd electrode 4 consist of Cu foil which gave Ni or Ni plating. The 1st electrode 2 and the 2nd electrode 4 are exhibiting the shape of a flat plate, and the surface 2a of the 1st electrode 2 and the surface 4a of the 2nd electrode 4 have nodules (unevenness difference is about 5-15 micrometers). A large number of portions from the middle part to the base part are constricted with respect to the head part. This nodule has entered the surface of the PTC element body L5. A lead (not shown) is connected to the first electrode 2 and the second electrode 4. It is possible to discharge or inject electric charges from the first electrode 2 and the second electrode 4 to the outside through the connected leads.

第1の電極2と第2の電極4との間には、正の抵抗温度特性を有するPTC素体L5が配置されている。PTC素体L5は、第1のPTC領域6と、第2のPTC領域8と、中間領域10とを有している。第1のPTC領域6及び第2のPTC領域8はそれぞれ、樹脂と導電性粒子とを含んでいる。より具体的には、第1のPTC領域6及び第2のPTC領域8は、熱可塑性の樹脂として直鎖状の低密度ポリエチレンと、導電性粒子としてニッケルからなるフィラメント状の粒子とを主成分としている。第1のPTC領域6は第1の電極2と接合しており、第2のPTC領域8は第2の電極4と接合している。   A PTC element body L5 having a positive resistance temperature characteristic is disposed between the first electrode 2 and the second electrode 4. The PTC element body L5 has a first PTC region 6, a second PTC region 8, and an intermediate region 10. The first PTC region 6 and the second PTC region 8 each contain a resin and conductive particles. More specifically, the first PTC region 6 and the second PTC region 8 are mainly composed of linear low-density polyethylene as a thermoplastic resin and filament-like particles made of nickel as conductive particles. It is said. The first PTC region 6 is bonded to the first electrode 2, and the second PTC region 8 is bonded to the second electrode 4.

なお、第1のPTC領域6及び第2のPTC領域8に含まれる樹脂は、熱可塑性のものでなくてもよい。すなわち、熱硬化性樹脂であってもよく、また、結晶性樹脂であっても非晶性樹脂であってもよい。   Note that the resin contained in the first PTC region 6 and the second PTC region 8 may not be thermoplastic. That is, it may be a thermosetting resin, or may be a crystalline resin or an amorphous resin.

ここで、結晶性樹脂とは、通常の熱分析測定によって融点を観測され得る樹脂のことをいい、非晶性樹脂とは、通常の熱分析測定によっても融点を観測され得ない樹脂のことをいう。非晶性樹脂としては、例えば、オレフィン系ポリマー、ハロゲン系ポリマー、ポリスチレン、エポキシ樹脂、不飽和ポリエステル樹脂、ジアリルフタレート樹脂、フェノール樹脂、熱硬化性ポリイミド樹脂もしくはメラミン樹脂等が挙げられる。   Here, a crystalline resin means a resin whose melting point can be observed by ordinary thermal analysis measurement, and an amorphous resin means a resin whose melting point cannot be observed even by ordinary thermal analysis measurement. Say. Examples of the amorphous resin include olefin polymers, halogen polymers, polystyrene, epoxy resins, unsaturated polyester resins, diallyl phthalate resins, phenol resins, thermosetting polyimide resins, and melamine resins.

オレフィン系ポリマーとしては、ポリエチレン、エチレン−酢酸ビニルコポリマーもしくはポリエチルアクリレート等のポリアルキルアクリレート、又は、ポリメチル(メタ)アクリレート等のポリアルキル(メタ)アクリレートなどのポリオレフィンあるいはそれらのコポリマーが挙げられる。   Examples of the olefin-based polymer include polyolefins such as polyethylene, ethylene-vinyl acetate copolymer or polyalkyl acrylate such as polyethyl acrylate, polyalkyl (meth) acrylate such as polymethyl (meth) acrylate, or copolymers thereof.

ハロゲン系ポリマーとしては、ポリフッ化ビニリデン、ポリテトラフルオロエチレンもしくはポリヘキサフルオロプロピレン又はこれらのコポリマー等のフッ素系ポリマー、ポリ塩化ビニル、ポリ塩化ビニリデン、塩素化ポリ塩化ビニル、塩素化ポリエチレンもしくは塩素化ポリプロピレン又はこれらのコポリマー等の塩素系ポリマー等が挙げられる。   Examples of the halogen-based polymer include fluorine-based polymers such as polyvinylidene fluoride, polytetrafluoroethylene, polyhexafluoropropylene, and copolymers thereof, polyvinyl chloride, polyvinylidene chloride, chlorinated polyvinyl chloride, chlorinated polyethylene, or chlorinated polypropylene. Or chlorine-type polymers, such as these copolymers, etc. are mentioned.

これらは、1種類を単独で、あるいは2種類以上を組み合わせて用いることが可能である。これらの中で、オレフィン系ポリマーを用いることが好ましく、ポリエチレンを用いることがより好ましく、直鎖状の低密度ポリエチレンを用いることが特に好ましい。   These can be used alone or in combination of two or more. Among these, it is preferable to use an olefin polymer, more preferably polyethylene, and particularly preferably linear low density polyethylene.

また、第1のPTC領域6及び第2のPTC領域8に含まれる導電性粒子は、電子伝導性を有していれば特に限定されず、例えば、カーボンブラック、グラファイト、各形状の金属粒子もしくはセラミック系導電性粒子を用いることができる。これらは、1種類を単独で、あるいは2種類以上を組み合わせて用いることが可能である。   Further, the conductive particles contained in the first PTC region 6 and the second PTC region 8 are not particularly limited as long as they have electronic conductivity. For example, carbon black, graphite, metal particles of various shapes or Ceramic conductive particles can be used. These can be used alone or in combination of two or more.

これらの中で、特に過電流保護素子のような低室温抵抗と十分な抵抗変化率とが求められる用途の場合、導電性金属粒子を用いることが好ましい。導電性金属粒子としては、銅、アルミニウム、ニッケル、タングステン、モリブデン、銀、亜鉛もしくはコバルト等が用いられるが、特に、銀もしくはニッケルを用いることが好ましい。さらに、その形状としては、球状、フレーク状もしくは棒状等が挙げられるが、表面にスパイク状の突起を有するものが好ましい。   Among these, it is preferable to use conductive metal particles particularly in applications where low room temperature resistance and a sufficient resistance change rate are required, such as overcurrent protection elements. As the conductive metal particles, copper, aluminum, nickel, tungsten, molybdenum, silver, zinc, cobalt, or the like is used, and it is particularly preferable to use silver or nickel. Further, the shape may be a spherical shape, a flake shape or a rod shape, and those having spike-like projections on the surface are preferable.

このような導電性金属粒子は、その一つ一つの粒子(一次粒子)が個別に存在する粉体であってもよいが、それらの一次粒子が鎖状に連なりフィラメント状の二次粒子を形成していることがより好ましく、その材質はニッケルであると更に好ましい。このような粒子を高分子マトリックス中に均一に分散させてなるPTC素子は、繰り返し動作や長期保存に対する信頼性が高いものとなる。   Such conductive metal particles may be a powder in which each individual particle (primary particle) exists individually, but these primary particles are linked in a chain to form filamentary secondary particles. More preferably, the material is nickel. A PTC element in which such particles are uniformly dispersed in a polymer matrix has high reliability for repeated operation and long-term storage.

第1のPTC領域6と第2のPTC領域8との間には、中間領域10が形成されている。中間領域10は、第1のPTC領域6と第2のPTC領域8との間に挟まれると共に、第1の電極2、PTC素体L5、及び第2の電極4の配置方向である矢印Aと交差する方向に延びている。中間領域10は主成分として樹脂を含んでおり、かかる樹脂は第1のPTC領域6及び第2のPTC領域8に含まれる樹脂と同一の成分を有している。より具体的には、第1のPTC領域6及び第2のPTC領域8で用いられている直鎖状の低密度ポリエチレンが、中間領域10にも用いられている。中間領域10の全成分の量に対する当該中間領域10に含まれる直鎖状の低密度ポリエチレンの量の割合は、第1のPTC領域6の全成分の量に対する当該第1のPTC領域6に含まれる直鎖状の低密度ポリエチレンの量の割合よりも大きく、且つ、第2のPTC領域8の全成分の量に対する当該第2のPTC領域8に含まれる直鎖状の低密度ポリエチレンの量の割合よりも大きい。このような割合とすることにより、中間領域10は、第1のPTC領域6及び第2のPTC領域8よりも高い抵抗値を有することとなる。   An intermediate region 10 is formed between the first PTC region 6 and the second PTC region 8. The intermediate region 10 is sandwiched between the first PTC region 6 and the second PTC region 8, and an arrow A indicating the arrangement direction of the first electrode 2, the PTC element body L 5, and the second electrode 4. It extends in the direction that intersects. The intermediate region 10 includes a resin as a main component, and the resin has the same component as the resin included in the first PTC region 6 and the second PTC region 8. More specifically, linear low density polyethylene used in the first PTC region 6 and the second PTC region 8 is also used in the intermediate region 10. The ratio of the amount of linear low density polyethylene contained in the intermediate region 10 to the amount of all components in the intermediate region 10 is included in the first PTC region 6 with respect to the amount of all components in the first PTC region 6. Greater than the proportion of the amount of the linear low density polyethylene to be added, and the amount of the linear low density polyethylene contained in the second PTC region 8 relative to the amount of all the components of the second PTC region 8. Greater than percentage. By setting such a ratio, the intermediate region 10 has a higher resistance value than the first PTC region 6 and the second PTC region 8.

続いて、図1〜3を参照して、上述した構成を有するPTC素子1の製造方法について説明する。図2は、本実施形態に係るPTC素子の製造方法を説明するためのフロー図である。図3は、本実施形態に係るPTC素子の製造方法を説明するための図である。   Then, with reference to FIGS. 1-3, the manufacturing method of the PTC element 1 which has the structure mentioned above is demonstrated. FIG. 2 is a flowchart for explaining the manufacturing method of the PTC element according to this embodiment. FIG. 3 is a view for explaining the method for manufacturing the PTC element according to the present embodiment.

まず、PTC基材を用意する(ステップS101)。PTC基材を用意するにあたって、直鎖状の低密度ポリエチレンやニッケルからなるフィラメント状の粒子といったPTC基材の材料を所定の割合となるように各々秤量した後、各成分を混合して混練物を調製する。そして、調整した混練物を押出機に入れて棒状の塊とする。この棒状の塊を所定の幅に切断し、プレス成形等の成形処理を施すことにより、シート状のPTC基材を得る。   First, a PTC base material is prepared (step S101). In preparing the PTC base material, the PTC base material such as linear low-density polyethylene and filamentary particles made of nickel are weighed so as to have a predetermined ratio, and then the components are mixed and kneaded. To prepare. And the adjusted kneaded material is put into an extruder to make a rod-like lump. This rod-shaped lump is cut into a predetermined width and subjected to a molding process such as press molding to obtain a sheet-like PTC substrate.

次に、得られたシート状のPTC基材上に、PTC基材よりも高い抵抗値を有する高抵抗領域を形成する(ステップS103)。高抵抗領域は、シート状のPTC基材をホットプレート等で加熱することにより形成される。PTC基材に含まれる直鎖状の低密度ポリエチレンは、PTC基材に含まれる他の成分と比べて融点が低い。そのため、PTC基材を加熱すると、直鎖状の低密度ポリエチレンがPTC基材の表面に浮き出てくる。この浮き出た直鎖状の低密度ポリエチレンが、高抵抗領域となる。このように、高抵抗領域は、PTC基材を加熱するといった容易な方法により形成することができる。PTC基材に対する加熱位置は、当該PTC基材の所定の面に直鎖状の低密度ポリエチレンが浮き出るように調整される。ここで、所定の面とは、シート状のPTC基材の一方の主面を指す。   Next, a high resistance region having a resistance value higher than that of the PTC substrate is formed on the obtained sheet-like PTC substrate (step S103). The high resistance region is formed by heating a sheet-like PTC substrate with a hot plate or the like. The linear low density polyethylene contained in the PTC base material has a lower melting point than other components contained in the PTC base material. Therefore, when the PTC base material is heated, linear low-density polyethylene emerges on the surface of the PTC base material. This raised linear low density polyethylene becomes a high resistance region. Thus, the high resistance region can be formed by an easy method such as heating the PTC substrate. The heating position with respect to the PTC substrate is adjusted so that the linear low-density polyethylene is raised on a predetermined surface of the PTC substrate. Here, the predetermined surface refers to one main surface of the sheet-like PTC base material.

次に、図3に示されるように、それぞれに高抵抗領域R1が形成された2つのPTC基材S1を、高抵抗領域R1が間に位置するように重ね合わせ、PTC積層体G5を得る(ステップS105)。すなわち、2つのPTC基材S1は、高抵抗領域R1の主面が対向するように重ねられることとなる。このようにして得られたPTC積層体G5を所望のサイズに切断して(ステップS107)、PTC素体L5となるPTC成形体を得る。   Next, as shown in FIG. 3, two PTC base materials S1 each formed with a high resistance region R1 are overlapped so that the high resistance region R1 is positioned therebetween to obtain a PTC laminate G5 ( Step S105). That is, the two PTC base materials S1 are overlapped so that the main surfaces of the high resistance region R1 face each other. The PTC laminate G5 thus obtained is cut into a desired size (step S107), and a PTC molded body that becomes the PTC element body L5 is obtained.

次に、PTC成形体の表面に、PTC基材の積層方向に対してPTC成形体を挟むように第1の電極2及び第2の電極4を設ける(ステップS109)。これらの電極は、熱プレスによりPTC成形体に接合される。このとき、第1の電極2及び第2の電極4の節瘤がPTC成形体の表面に入り込むため、PTC成形体に対して第1の電極2及び第2の電極4を確実に接合することができる。   Next, the first electrode 2 and the second electrode 4 are provided on the surface of the PTC molded body so as to sandwich the PTC molded body in the stacking direction of the PTC base material (step S109). These electrodes are joined to the PTC compact by hot pressing. At this time, since the nodules of the first electrode 2 and the second electrode 4 enter the surface of the PTC molded body, the first electrode 2 and the second electrode 4 must be reliably bonded to the PTC molded body. Can do.

次に、第1の電極2及び第2の電極4を接合したPTC成形体に電子線を照射する。電子線を照射すると、PTC成形体に含まれる直鎖状の低密度ポリエチレンが架橋される。直鎖状の低密度ポリエチレンが架橋されることにより、流動性の高かったPTC成形体は架橋して、弾性を有するPTC素体L5となる(ステップS111)。その結果、第1の電極2側に位置するPTC基材S1は第1のPTC領域6となり、第2の電極4側に位置するPTC基材S1は第2のPTC領域8となり、高抵抗領域R1は中間領域10となる。このようにして、第1の電極2と、第2の電極4と、PTC素体L5とを備えるPTC素子1が製造されることとなる。   Next, an electron beam is irradiated to the PTC molded body to which the first electrode 2 and the second electrode 4 are joined. When irradiated with an electron beam, the linear low-density polyethylene contained in the PTC molded product is crosslinked. By cross-linking the linear low-density polyethylene, the PTC molded body having high fluidity is cross-linked to become a PTC element body L5 having elasticity (step S111). As a result, the PTC base material S1 located on the first electrode 2 side becomes the first PTC region 6, the PTC base material S1 located on the second electrode 4 side becomes the second PTC region 8, and the high resistance region R 1 becomes the intermediate region 10. In this way, the PTC element 1 including the first electrode 2, the second electrode 4, and the PTC element body L5 is manufactured.

以上のように、本実施形態に係るPTC素子1は、第1の電極2及び第2の電極4に挟まれたPTC素体L5を備えている。このPTC素体L5は、第1のPTC領域6と第2のPTC領域8との間に高抵抗の中間領域10を有している。高抵抗の中間領域10を有することにより、導電パスの構築を抑制することができる。また、この中間領域10の位置を第1のPTC領域6及び第2のPTC領域8の間とすることにより、中間領域10が第1の電極2及び第2の電極4によって傷つくことを防げる。よって、導電パスの構築を確実に抑制することができる。その結果、耐電圧特性が良好なPTC素子1を得ることができる。   As described above, the PTC element 1 according to this embodiment includes the PTC element body L5 sandwiched between the first electrode 2 and the second electrode 4. The PTC element body L5 has a high-resistance intermediate region 10 between the first PTC region 6 and the second PTC region 8. By having the high-resistance intermediate region 10, the construction of the conductive path can be suppressed. In addition, by setting the position of the intermediate region 10 between the first PTC region 6 and the second PTC region 8, the intermediate region 10 can be prevented from being damaged by the first electrode 2 and the second electrode 4. Therefore, the construction of the conductive path can be reliably suppressed. As a result, a PTC element 1 with good withstand voltage characteristics can be obtained.

また、中間領域10は、第1のPTC領域6及び第2のPTC領域8に含まれる直鎖状の低密度ポリエチレンを主成分とするので、第1のPTC領域6及び第2のPTC領域8と中間領域10とのなじみが良くなる。その結果、第1のPTC領域6及び第2のPTC領域8と中間領域10との接合状態が良好なPTC素子1を得ることができる。   Further, since the intermediate region 10 is mainly composed of linear low density polyethylene contained in the first PTC region 6 and the second PTC region 8, the first PTC region 6 and the second PTC region 8 are included. And the familiarity with the intermediate region 10 is improved. As a result, it is possible to obtain the PTC element 1 in which the bonding state between the first PTC region 6 and the second PTC region 8 and the intermediate region 10 is good.

また、第1の電極2及び第2の電極4のPTC素体L5と接する面2a,4aは、粗面化されているので、PTC素体L5に対する第1の電極2及び第2の電極4の接合強度を向上させることができる。   In addition, since the surfaces 2a and 4a of the first electrode 2 and the second electrode 4 in contact with the PTC element body L5 are roughened, the first electrode 2 and the second electrode 4 with respect to the PTC element body L5. It is possible to improve the bonding strength.

以上、本発明の好適な実施形態について詳細に説明したが、本発明は上記実施形態に限定されるものではない。   The preferred embodiment of the present invention has been described in detail above, but the present invention is not limited to the above embodiment.

例えば上記実施形態では、中間領域10には、第1のPTC領域6及び第2のPTC領域8に含まれる樹脂を用いる、とした。これを、中間領域10には、第1のPTC領域6及び第2のPTC領域8に含まれる樹脂とは成分が異なる樹脂を用いる、としてもよい。また、中間領域10には、第1のPTC領域6及び第2のPTC領域8に含まれる樹脂と、この樹脂とは成分が異なる樹脂とを用いる、としてもよい。これらの場合、中間領域10となる高抵抗領域は、PTC基材に対して上述した樹脂を塗布や蒸着、あるいは積層することにより形成される。   For example, in the above embodiment, the resin contained in the first PTC region 6 and the second PTC region 8 is used for the intermediate region 10. Alternatively, a resin having a component different from that of the resin contained in the first PTC region 6 and the second PTC region 8 may be used for the intermediate region 10. The intermediate region 10 may be made of a resin contained in the first PTC region 6 and the second PTC region 8 and a resin having a component different from that of the resin. In these cases, the high resistance region to be the intermediate region 10 is formed by applying, evaporating, or laminating the above-described resin on the PTC base material.

また、上記実施形態では、中間領域10となる高抵抗領域は、PTC基材を加熱してPTC基材の一方の主面に直鎖状の低密度ポリエチレンを浮き出させることにより形成される、とした。これを、中間領域10となる高抵抗領域は、PTC基材の一方の主面をエッチングして導電性粒子を除去することにより形成される、としてもよい。この場合、エッチング後のPTC基材の一方の主面には直鎖状の低密度ポリエチレンが残り、この直鎖状の低密度ポリエチレンが高抵抗領域となる。したがって、高抵抗領域を形成するために新たな材料を必要としないため、高抵抗領域を安価に形成することができる。   Moreover, in the said embodiment, the high resistance area | region used as the intermediate | middle area | region 10 is formed by heating a PTC base material and making linear low density polyethylene stand out on one main surface of a PTC base material. did. Alternatively, the high resistance region serving as the intermediate region 10 may be formed by etching one main surface of the PTC base material to remove the conductive particles. In this case, linear low density polyethylene remains on one main surface of the PTC substrate after etching, and this linear low density polyethylene becomes a high resistance region. Therefore, since no new material is required to form the high resistance region, the high resistance region can be formed at low cost.

また、上記実施形態では、それぞれに高抵抗領域が形成された2つのPTC基材を重ね合わせて、PTC積層体を得るとしたが、重ね合わせる2つのPTC基材のうち、少なくともいずれか一方に高抵抗領域が形成されていればよい。また、PTC基材の数は3つ以上であってもよい。   In the above embodiment, two PTC base materials each having a high resistance region are overlapped to obtain a PTC laminate, but at least one of the two PTC base materials to be overlapped is obtained. It is sufficient that a high resistance region is formed. Further, the number of PTC base materials may be three or more.

また、PTC素子1の断面形状は、上記実施形態の図1に示されるものに限られず、例えば、図4(a)及び(b)に示されるようなものであってもよい。図4(a)に示されるPTC素子20は、第1の電極22、第2の電極24、第1のPTC領域26、第2のPTC領域28、及び中間領域30を有しており、これらはPTC素子1における第1の電極2、第2の電極4、第1のPTC領域6、第2のPTC領域8、及び中間領域10に相当する。図4(b)に示されるPTC素子40は、第1の電極42、第2の電極44、第1のPTC領域46、第2のPTC領域48、及び中間領域50を有しており、これらはPTC素子1における第1の電極2、第2の電極4、第1のPTC領域6、第2のPTC領域8、及び中間領域10に相当する。   Further, the cross-sectional shape of the PTC element 1 is not limited to that shown in FIG. 1 of the above embodiment, and may be as shown in FIGS. 4A and 4B, for example. The PTC element 20 shown in FIG. 4A has a first electrode 22, a second electrode 24, a first PTC region 26, a second PTC region 28, and an intermediate region 30, and these Corresponds to the first electrode 2, the second electrode 4, the first PTC region 6, the second PTC region 8, and the intermediate region 10 in the PTC element 1. The PTC element 40 shown in FIG. 4B has a first electrode 42, a second electrode 44, a first PTC region 46, a second PTC region 48, and an intermediate region 50. Corresponds to the first electrode 2, the second electrode 4, the first PTC region 6, the second PTC region 8, and the intermediate region 10 in the PTC element 1.

ここで、本発明のPTC素子について、耐電圧特性が良好となるという効果を確認するために、以下のような実験を行った。   Here, with respect to the PTC element of the present invention, the following experiment was conducted in order to confirm the effect that the withstand voltage characteristic is improved.

すなわち、それぞれ構造が異なる複数の種類のPTC素子を用意し、耐電圧特性を調べた。実施例は、本実施形態のPTC素子1と同じ構成を有するPTC素子であって、図3に示される製造工程に従って製造されたものである。シート状のPTC基材を用意する工程では、PTC基材の厚さが0.8mmとなるようプレス成形した。また、PTC成形体に第1の電極2及び第2の電極4を設ける工程では、2回の熱プレスを施した。   That is, a plurality of types of PTC elements having different structures were prepared, and the withstand voltage characteristics were examined. An Example is a PTC element which has the same structure as the PTC element 1 of this embodiment, Comprising: It manufactures according to the manufacturing process shown by FIG. In the step of preparing the sheet-like PTC base material, press molding was performed so that the thickness of the PTC base material was 0.8 mm. Moreover, in the process of providing the 1st electrode 2 and the 2nd electrode 4 in a PTC molded object, the hot press was performed twice.

これに対して、比較例1のPTC素子は、1枚のシート状のPTC基材を所望のサイズに切断した後、当該切断したものを一対の電極で挟んで2回の熱プレスを施したものである。比較例2のPTC素子は、シート状のPTC基材を2枚重ねて所望のサイズに切断した後、当該切断したものを一対の電極で挟んで2回の熱プレスを施したものである。比較例1及び比較例2では、切断前のPTC基材に対してホットプレート等による加熱処理を行っていない。すなわち、比較例1及び比較例2のPTC素子は共に、高抵抗の領域を有していない。なお、比較例1及び比較例2で用いられるシート状のPTC基材は、実施例で用いられるシート状のPTC基材と同様に製造されたものである。   In contrast, the PTC element of Comparative Example 1 was obtained by cutting one sheet-like PTC base material into a desired size, and sandwiching the cut piece between a pair of electrodes and performing two hot presses. Is. The PTC element of Comparative Example 2 is obtained by stacking two sheet-like PTC base materials and cutting them to a desired size, and then subjecting the cut pieces to a pair of electrodes and performing two hot presses. In Comparative Example 1 and Comparative Example 2, the heat treatment using a hot plate or the like is not performed on the PTC substrate before cutting. That is, both the PTC elements of Comparative Example 1 and Comparative Example 2 do not have a high resistance region. In addition, the sheet-like PTC base material used by the comparative example 1 and the comparative example 2 is manufactured similarly to the sheet-like PTC base material used by the Example.

このようにして製造された3種類のPTC素子をそれぞれ10個用意して、耐電圧値を測定した。測定の結果を図5に示す。なお、実施例、比較例1、及び比較例2それぞれにおいて、用意した10個の中に耐電圧値が略同一であるものが存在したため、グラフ上の点の数はそれぞれ10個以下となっている。   Ten pieces of the three types of PTC elements thus manufactured were prepared, and the withstand voltage value was measured. The measurement results are shown in FIG. In each of the example, comparative example 1 and comparative example 2, there were some of the 10 prepared that had substantially the same withstand voltage value, so the number of points on the graph was 10 or less, respectively. Yes.

比較例1のPTC素子の耐電圧値は、約30V以上であった。比較例2のPTC素子の耐電圧値は、約32V以上であった。それに対して、実施例のPTC素子の耐電圧値は、約44V以上であった。   The withstand voltage value of the PTC element of Comparative Example 1 was about 30V or more. The withstand voltage value of the PTC element of Comparative Example 2 was about 32V or more. On the other hand, the withstand voltage value of the PTC element of the example was about 44V or more.

このように、本発明に係る実施例の方が、比較例1及び比較例2と比べて耐電圧値が高い。よって、耐電圧特性が良好となるという本発明の有効性が確認された。   Thus, the withstand voltage value of the example according to the present invention is higher than that of Comparative Example 1 and Comparative Example 2. Therefore, the effectiveness of the present invention that the withstand voltage characteristic is good was confirmed.

本実施形態に係るPTC素子を示す断面図である。It is sectional drawing which shows the PTC element which concerns on this embodiment. 本実施形態に係るPTC素子の製造方法を説明するためのフロー図である。It is a flowchart for demonstrating the manufacturing method of the PTC element which concerns on this embodiment. 本実施形態に係るPTC素子の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the PTC element which concerns on this embodiment. 本実施携帯に係るPTC素子の変形例を示す断面図である。It is sectional drawing which shows the modification of the PTC element which concerns on this Example carrying. PTC素子の耐圧を調べる実験の結果を示す図表である。It is a graph which shows the result of the experiment which investigates the pressure | voltage resistance of a PTC element.

符号の説明Explanation of symbols

1…PTC素子、2…第1の電極、4…第2の電極、6…第1のPTC領域、8…第2のPTC領域、10…中間領域、L5…PTC素体、R1…高抵抗領域、S1…PTC基材。


DESCRIPTION OF SYMBOLS 1 ... PTC element, 2 ... 1st electrode, 4 ... 2nd electrode, 6 ... 1st PTC area | region, 8 ... 2nd PTC area | region, 10 ... Middle area | region, L5 ... PTC element | base_body, R1 ... High resistance Area, S1 ... PTC substrate.


Claims (8)

互いに対向した状態で配置された1対の電極と、
前記1対の電極の間に配置されており、且つ、正の抵抗温度特性を有するPTC素体と、を備え、
前記PTC素体は、樹脂と導電性粒子とを含む複数のPTC領域と、前記PTC領域の間に挟まれると共に前記一対の電極及び前記PTC素体の配置方向と交差する方向に延びる中間領域と、を有しており、
前記中間領域は、前記PTC領域よりも高い抵抗値を有することを特徴とするPTC素子。
A pair of electrodes arranged in opposition to each other;
A PTC element body disposed between the pair of electrodes and having a positive resistance temperature characteristic,
The PTC element body includes a plurality of PTC regions including a resin and conductive particles, and an intermediate region sandwiched between the PTC regions and extending in a direction intersecting with an arrangement direction of the pair of electrodes and the PTC element body. , And
The intermediate region has a higher resistance value than the PTC region.
前記中間領域は主成分として樹脂を含んでおり、前記中間領域に含まれる樹脂と前記PTC領域に含まれる樹脂とは成分が同一であることを特徴とする請求項1に記載のPTC素子。   The PTC element according to claim 1, wherein the intermediate region contains a resin as a main component, and the resin included in the intermediate region and the resin included in the PTC region have the same components. 前記電極の面のうち前記PTC素体と接する面には、粗面処理が施されていることを特徴とする請求項1又は2に記載のPTC素子。   3. The PTC element according to claim 1, wherein a surface of the electrode in contact with the PTC element body is subjected to a rough surface treatment. 4. 互いに対向した状態で配置された1対の電極と、前記1対の電極の間に配置されており、且つ、正の抵抗温度特性を有するPTC素体と、を備えるPTC素子の製造方法であって、
樹脂と導電性粒子とを含むPTC基材を複数用意する第1の工程と、
前記複数のPTC基材のうち少なくとも一つの前記PTC基材の所定の面に、当該PTC基材よりも高い抵抗値を有する高抵抗領域を形成する第2の工程と、
前記高抵抗領域が間に位置するように前記複数のPTC基材を重ね、前記PTC素体となるPTC成形体を形成する第3の工程と、
前記PTC基材の積層方向に対して前記PTC成形体を挟むように前記1対の電極を配置する第4の工程と、
前記1対の電極を配置した後、前記PTC成形体を架橋させる第5の工程と、
を有することを特徴とするPTC素子の製造方法。
A method of manufacturing a PTC element comprising: a pair of electrodes arranged in a state of being opposed to each other; and a PTC element body disposed between the pair of electrodes and having a positive resistance temperature characteristic. And
A first step of preparing a plurality of PTC substrates containing a resin and conductive particles;
A second step of forming, on a predetermined surface of at least one of the plurality of PTC substrates, a high resistance region having a higher resistance value than the PTC substrate;
A third step of stacking the plurality of PTC base materials so that the high resistance region is located therebetween, and forming a PTC molded body that becomes the PTC base body;
A fourth step of arranging the pair of electrodes so as to sandwich the PTC molded body with respect to the stacking direction of the PTC base material;
After arranging the pair of electrodes, a fifth step of crosslinking the PTC molded body;
A method for producing a PTC element, comprising:
前記第2の工程は、前記PTC基材を加熱し、当該PTC基材に含まれる樹脂を前記所定の面に浮き出させることで前記高抵抗領域を形成することを特徴とする請求項4に記載のPTC素子の製造方法。   The said 2nd process forms the said high resistance area | region by heating the said PTC base material and making resin contained in the said PTC base material stand out on the said predetermined | prescribed surface, The said high resistance area | region is formed. Manufacturing method of the PTC element. 前記第2の工程は、前記PTC基材に含まれる樹脂とは成分が異なる樹脂を用いて前記高抵抗領域を形成することを特徴とする請求項4に記載のPTC素子の製造方法。   5. The method of manufacturing a PTC element according to claim 4, wherein in the second step, the high resistance region is formed using a resin having a component different from that of the resin contained in the PTC base material. 前記第2の工程は、前記PTC基材の所定の面をエッチングして前記導電性粒子を除去することで前記高抵抗領域を形成することを特徴とする請求項4に記載のPTC素子の製造方法。   The said 2nd process forms the said high resistance area | region by etching the predetermined surface of the said PTC base material, and removing the said electroconductive particle, The manufacture of the PTC element of Claim 4 characterized by the above-mentioned. Method. 互いに対向した状態で配置された第1の電極及び第2の電極と、
前記第1の電極と前記第2の電極との間に配置されており、且つ、正の抵抗温度特性を有するPTC素体と、を備え、
前記PTC素体は、樹脂及び導電性粒子を含むと共に前記第1の電極と接合する第1のPTC領域と、前記樹脂及び前記導電性粒子を含むと共に前記第2の電極と接合する第2のPTC領域と、前記第1のPTC領域と前記第2のPTC領域との間に位置すると共に前記第1のPTC領域及び前記第2のPTC領域よりも高い抵抗値を有する中間領域と、を有することを特徴とするPTC素子。
A first electrode and a second electrode arranged facing each other;
A PTC element body disposed between the first electrode and the second electrode and having a positive resistance temperature characteristic,
The PTC element body includes a first PTC region including a resin and conductive particles and bonded to the first electrode; and a second PTC region including the resin and conductive particles and bonded to the second electrode. A PTC region; and an intermediate region located between the first PTC region and the second PTC region and having a higher resistance value than the first PTC region and the second PTC region. The PTC element characterized by the above-mentioned.
JP2005219355A 2005-07-28 2005-07-28 Ptc element and method for manufacturing the same Pending JP2007036045A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005219355A JP2007036045A (en) 2005-07-28 2005-07-28 Ptc element and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005219355A JP2007036045A (en) 2005-07-28 2005-07-28 Ptc element and method for manufacturing the same

Publications (1)

Publication Number Publication Date
JP2007036045A true JP2007036045A (en) 2007-02-08

Family

ID=37794911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005219355A Pending JP2007036045A (en) 2005-07-28 2005-07-28 Ptc element and method for manufacturing the same

Country Status (1)

Country Link
JP (1) JP2007036045A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011082203A (en) * 2009-10-02 2011-04-21 Nec Corp Insulating layer with conductive region, electronic component, and method of manufacturing the insulating layer and the electronic component
CN103531318A (en) * 2013-10-23 2014-01-22 上海长园维安电子线路保护有限公司 Over-current protective element with double PTC (Positive Temperature Coefficient) effect

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011082203A (en) * 2009-10-02 2011-04-21 Nec Corp Insulating layer with conductive region, electronic component, and method of manufacturing the insulating layer and the electronic component
CN103531318A (en) * 2013-10-23 2014-01-22 上海长园维安电子线路保护有限公司 Over-current protective element with double PTC (Positive Temperature Coefficient) effect

Similar Documents

Publication Publication Date Title
JP3930904B2 (en) Electrical device
JP6598231B2 (en) Polymer conductive composite material and PTC element
US4769901A (en) Method of making PTC devices
JPH11176610A (en) Ptc element, protection device and circuit board
JP2000188206A (en) Polymer ptc composition and ptc device
JP2007036045A (en) Ptc element and method for manufacturing the same
JP3914899B2 (en) PTC thermistor body, PTC thermistor, method for manufacturing PTC thermistor body, and method for manufacturing PTC thermistor
JP2010160954A (en) Surface heater
JP2024508705A (en) PPTC actuator heater
TWI606470B (en) Positive temperature coefficient current protection wafer device and its production method
KR100470906B1 (en) Very low resistance ptc device and continuous manufacturing method thereof
CN109427452B (en) Positive temperature coefficient circuit protection device and manufacturing method thereof
JP4459438B2 (en) Method for manufacturing an electrical device and method for manufacturing a battery assembly
JPS63244702A (en) Ptc device and manufacture of the same
JP2001052901A (en) Chip organic positive temperature coefficient thermistor and manufacturing method therefor
JP4299215B2 (en) Organic PTC thermistor
JPWO2004042745A1 (en) PTC material, manufacturing method thereof, circuit protection component using the PTC material, and manufacturing method thereof
JP4471145B2 (en) PTC element
JPS63216301A (en) Ptc device and manufacture of the same
JPH1187106A (en) Manufacture of ptc element
JP4087768B2 (en) Method for producing P-PTC thermistor composition, P-PTC thermistor composition, P-PTC thermistor body and P-PTC thermistor
JP2005086038A (en) P-ptc thermistor composition, method of manufacturing the same, elemental p-ptc thermistor body, and p-ptc thermistor
JP2006216902A (en) Overcurrent protective element and manufacturing method thereof
JP2003318008A (en) Polymer ptc composition and polymer ptc element
JP2002208504A (en) Polymer ptc device and method of manufacturing the same

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070629

A131 Notification of reasons for refusal

Effective date: 20070710

Free format text: JAPANESE INTERMEDIATE CODE: A131

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070903

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080212