CN108469321A - A kind of flexible sensor array - Google Patents

A kind of flexible sensor array Download PDF

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Publication number
CN108469321A
CN108469321A CN201810610353.1A CN201810610353A CN108469321A CN 108469321 A CN108469321 A CN 108469321A CN 201810610353 A CN201810610353 A CN 201810610353A CN 108469321 A CN108469321 A CN 108469321A
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electrode array
electrode
array substrate
pressure
flexible sensor
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王�华
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/20Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/04Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

The invention discloses a kind of flexible sensor arrays, set gradually first electrode array substrate, insulation glue-line, composite pressure-sensitive layer and second electrode array substrate, wherein, the first electrode array substrate and second electrode array substrate are all made of setting electrod-array on flexible base board and are respectively formed first electrode array and second electrode array, and any point electrode of first electrode array corresponds with one point electrode of second electrode array and is used as electrode group.The present invention can realize large area sensor array, and pressure sensitive array and electrode array show better connectivity, better adhesive force, volume smaller, and preparation efficiency higher avoids the process that varistor layer repeats installation.

Description

A kind of flexible sensor array
Technical field
The present invention relates to flexible sensor technical field more particularly to a kind of flexible sensor arrays.
Background technology
With the promotion of technology and modernization level, people are higher and higher to the detection requirement of pressure, be not confined to pair The pressure monitoring of regular rigid surface, form is also varied, and common rigid sensor has been unable to reach the practical need of people It asks.Such as it is desirable to which even implantable etc. modes by wearable, can be sticked, realize that, to such as heartbeat, pulse, blood pressure is exhaled The real-time monitoring of the physical signs such as suction, these products are in addition to accuracy to be taken into account and safety, it is considered however that human body was worn Comfort can bear the performance indicator of the various everyday actions of human body or even high intensity exercise without influencing sensor.Flexibility pressure For force snesor since arbitrarily bending even folds for it, small, thickness is thin, and flexible material is substantially nontoxic, has with human body Good compatibility, in Medical Devices, intelligent robot, the fields such as wearable device have obtained a large amount of research and application, closely Nian Lai, pliable pressure sensor have been no longer limited to pressure monitoring that is single or putting on a small quantity, current pliable pressure sensor skill Art is just towards large area, and high density, the directions such as low cost are developed.
Although pliable pressure sensor technology has obtained significant progress, large area flexible sensor array in recent years Research it is less.In the integrated application of large area, sensor of the prior art based on coating processes is generally first prepared pressure-sensitive Layer cuts further according to application demand and installs, and stock utilization is low, and thickness is excessive, and cost is excessively high.Secondly efficiency is too low, large area Integrated, the only repetition installation of single sensor makes, and is not suitable for the making of large-area high-density flexible array sensor.
Therefore in view of the drawbacks of the prior art, it is really necessary to propose a kind of technical solution to solve skill of the existing technology Art problem.
Invention content
In view of this, it is necessory to provide a kind of flexible sensor array, to reduce pliable pressure sensor array Volume improves the integrated efficiency made of large area, improves stock utilization.
In order to solve technical problem of the existing technology, technical scheme is as follows:
A kind of flexible sensor array sets gradually first electrode array substrate, insulation glue-line, composite pressure-sensitive layer and second Electrode array substrate, wherein the first electrode array substrate and second electrode array substrate are all made of on flexible base board and are arranged Electrod-array is respectively formed first electrode array and second electrode array, and any point electrode of first electrode array is with second One point electrode of electrod-array, which corresponds, is used as electrode group;
The composite pressure-sensitive layer is the varistor layer dot matrix being arranged between first electrode array and second electrode array, described Any dot element is completely covered and is pressed between counter electrode group in varistor layer dot matrix;The varistor layer dot matrix is directly with silk screen Uncured pressure sensitive composite material is printed in shape after first electrode array/second electrode array surface cures by the mode of printing At;
The insulation glue-line is for bonding the first electrode array substrate and second electrode array substrate.
The first electrode array substrate and second electrode array substrate also set up lead end as a preferred technical solution, Son, the lead terminal are electrically connected with each point electrode, for being connect with external circuit.
The first electrode array substrate and second electrode array substrate use flexible base board as a preferred technical solution, The mode of upper printing silver paste is respectively formed first electrode array and second electrode array.
The flexible base board uses polyester PET or polyimides PI as a preferred technical solution,.
The composite pressure-sensitive layer is prepared by pressure sensitive composite material as a preferred technical solution, described pressure-sensitive multiple Condensation material includes carbon black, silicon rubber, silane coupling agent, nanometer SIO2And naphtha.
The accounting of carbon black is the 2%-10% of silicon rubber quality, the accounting of silane coupling agent as a preferred technical solution, For the 2%-5% of dispensing gross mass, nanometer SIO2Accounting be dispensing gross mass 2%-10%, remaining is naphtha;More than The sum of component is 100%.
The accounting of carbon black is the 6% of silicon rubber quality as a preferred technical solution,.
Carbon black uses lion ECP600JD or Cabot BP2000 as a preferred technical solution,.
Silicon rubber uses DOW CORNING 184 or 107 type silicon rubber as a preferred technical solution,.
Silane coupling agent uses silane coupling agent KH-560 as a preferred technical solution,.
Compared with prior art, the present invention is realized big on the basis of improving composite-material formula using printing technology The making of area array sensor revolutionizes in the past based on coating method, the technique for repeating installation pliable pressure sensor Flow shows better connectivity with the pressure sensitive array obtained by printing technology with electrode array, and better adhesive force, volume is more Small, preparation efficiency higher avoids the process that traditional handicraft repeats installation, and simple for process, stock utilization is high.
Large area sensor array using the present invention, simple in structure, thinner thickness, electrod-array are connected by public ranks line It is logical, reduce the complexity of signal acquisition circuit.Meanwhile being interfered less between array point, density area can arbitrarily change, at low cost, Greatly improve the application range of flexible sensor array.
Description of the drawings
Fig. 1 is the structure chart of flexible sensor array of the present invention.
Fig. 2 is the preparation technology flow chart of pressure sensitive composite material in the present invention.
Fig. 3 is influence curve of the content of carbon black to conductivity of composite material energy.
Pressure drag curve when Fig. 4 is carbon black concentration 6%.
Fig. 5 is the preparation process of flexible sensor array of the present invention.
Fig. 6 is the piezoresistive characteristic curve of flexible sensor array of the present invention.
Following specific embodiment will be further illustrated the present invention in conjunction with above-mentioned attached drawing.
Specific implementation mode
Technical solution provided by the invention is described further below with reference to attached drawing.
In the flexible sensor of the prior art, the preparation that the modes such as spin coating realize pressure-sensitive film is mostly used greatly, it is to be solidified After molding, then from film obtain needed for shape varistor layer, this technological process efficiency is too low and stock utilization is also low, no It is suitble to prepare large area sensor array.
Referring to Fig. 1, it show the present invention and a kind of structure diagram of flexible sensor array is provided, pressed from both sides using " sandwich " type Layer structure sets gradually first electrode array substrate, insulation glue-line, composite pressure-sensitive layer and second electrode array substrate, wherein institute It states first electrode array substrate and second electrode array substrate is all made of setting electrod-array on flexible base board and is respectively formed first Electrod-array and second electrode array, any point electrode of first electrode array with one point electrode of second electrode array one by one To should be used as electrode group;
The composite pressure-sensitive layer is the varistor layer dot matrix being arranged between first electrode array and second electrode array, described Any dot element is completely covered and is pressed between counter electrode group in varistor layer dot matrix;The varistor layer dot matrix is directly with silk screen Uncured pressure sensitive composite material is printed in shape after first electrode array/second electrode array surface cures by the mode of printing At;
The insulation glue-line is for bonding the first electrode array substrate and second electrode array substrate.
Meanwhile the first electrode array substrate and second electrode array substrate also set up lead terminal, the lead end It is sub to be electrically connected with each point electrode, for being connect with external circuit.
In the above-mentioned technical solutions, the making for completing flexible sensor by pressing varistor layer between upper/lower electrode, wherein Using any one electrode array substrate as bottom plate, after preparing composite pressure-sensitive layer in a manner of silk-screen printing on each of which point electrode, Another electrode array substrate, which is arranged on composite pressure-sensitive layer, again makes upper/lower electrode press composite pressure-sensitive layer completely.Sensor array It is classified as public ranks cable architecture, each point electrode independently draws a terminal, by the cycle gating to ranks line, to convenient Acquisition of the completion to sensor array signal, and in dot matrix each point signal it is mutual indepedent, the signal value each put only with Actual strength has relationship, is conducive to the test to flexible face actual pressure value, and can be by the position relationship of each electrode points Preferably obtain actual loading situation.
Applicant has found under study for action, at present the widely used single-component room-temperature-vulsilicone silicone rubber of pressure sensitive, due to it Surface drying time is too short, if directly printed, can increase the contact area of composite material and air, the friction meeting between scraper and halftone Cause to generate heat, these factors can all accelerate the solidification of silicon rubber, lead to network blocking phenomenon.
Therefore, how to prepare high-performance, low cost and the pressure sensitive composite material suitable for silk-screen printing is crucial, the present invention On the basis of carrying out a large amount of theoretical and experimental analyses, a kind of formula and its preparation process of pressure sensitive composite material are proposed.
Referring to Fig. 2, it is shown the flow diagram of pressure sensitive composite material preparation method of the present invention, is included the following steps:
Step S11:Choose dispensing;Specifically include carbon black, silicon rubber, silane coupling agent, nanometer SIO2And naphtha, In, the accounting of carbon black is the 2%-10% of silicon rubber quality, and the accounting of silane coupling agent is the 2%-5% of dispensing gross mass, is received Rice SIO2Accounting be dispensing gross mass 2%-10%, remaining is naphtha;
Step S12:Batch mixing;First by carbon black, silane coupling agent, nanometer SIO2It is added in naphtha, physical agitation 5- Ultrasonic disperse 30-50min after 30min;Then silicon rubber is added in mixed solution again, physical agitation 5-8h;Using ultrasound point Day labor skill, contributes to conductive black to be thoroughly dispersed in naphtha.
Step S13:It is dry;Mixed solution is put into vacuum drying chamber, removes non-volatile organic solvent, it is molten to form viscosity Liquid.
In the above-mentioned technical solutions, the present invention selects two-component room-temperature-vulcanized silicone rubber and naphtha to prepare printing with again Condensation material, experimental study show two-component room-temperature-vulcanized silicone rubber, such as 184,107 silicon rubber of DOW CORNING etc., even if solid being added After changing crosslinking agent, still there is the operable time of 2h or so;Solvent evaporation rate is too fast or excessively slow, all can be to final composite material Curing molding bring adverse effect.It being found through experiments that, naphtha evaporation rate is moderate, is also very applicable for printing system, Appropriate naphtha is added to reduce the viscosity of composite material;But naphtha dosage is excessive, can influence the last shrinking percentage of silicon rubber. Preferably, naphtha dosage is the 2 times or more of silicon rubber quality, and naphtha divides most beneficial for carbon black and the uniform of modified material It dissipates.
Further, the present invention selects carbon black as conductive filler, and carbon black nature is widely present, and electric conductivity is excellent, Performance is stablized, and is not easy to be aoxidized, is also easy to disperse in silicon rubber compared to metallic.In a preferred embodiment, Carbon black is using conductive black of the selection with high structure, high-specific surface area, such as lion ECP600JD or Cabot BP2000.
Coupling agent is a kind of organic compound with special construction, and there are two types of the groups of characteristic for molecule tool.A kind of group It can work with inorganic filler, another group can work with organic molecule, and filler can be made to be handed over chemical bond with organic matter Connection improves the compatibility of organic matrix and inorganic filler, dispersibility of the inorganic particulate in silicon rubber is improved, in a kind of preferred reality It applies in mode, silane coupling agent uses silane coupling agent KH-560.
Nanometer SIO2With composition similar with silicon rubber so that they are mutually adsorbed, and are wound mutually, are not only facilitated and lead The dispersion of electric carbon black, while also can reinforcement silicon rubber so that the strand of silicon rubber easy glide and is not destroyed by external force, increases shape Become required work(, the resistive hysteresis time of composite material can be reduced, improve the static characteristic of pressure sensitive composite material.It is special in dynamic Property aspect, the addition of SIO2 can shorten the resistance stabilization time of composite material.
During printing composite material, the additive amount of carbon black has the electric conductivity of composite material important shadow It rings.In the present invention, the accounting of carbon black is that the 2%-10% of silicon rubber quality show carbon black/silicon rubber content referring to Fig. 3 The influence of conductivity of composite material energy is compared, as seen from the figure, the loading of carbon black has prodigious shadow to the electric conductivity of composite material It rings, with the raising of carbon black additive amount, the electric conductivity change dramatically of composite material.The changing rule of sample electric conductivity with above The conductive channel theory of introduction matches.When conducting particles mass fraction is 2%, due in unit volume conducting particles compared with Few, the spacing of carbon black particle in the base is larger, even if under external force, effective conductive path is still seldom, therefore resistance Rate is very high;When the mass ratio of conducting particles reaches 6%, the gap of conducting particles reduces in matrix, forms a large amount of effective Conductive path, resistance are reduced rapidly, and when loading is close to threshold limit value, conducting particles will be formed surely in composite inner Fixed conductive network, material resistance, which drastically reduces, there is percolation phenomenon.Continue growing the loading of conducting particles, particle gap into One step reduces, and some particles are in direct contact, and the electrical conduction mechanism of material internal becomes conductive path effect from tunnel current effect and accounts for The variation tendency of leading position, the resistivity of composite material gradually tends towards stability.When near percolation threshold, composite material Piezoresistive characteristic it is the most apparent.
It is 6% sample to select carbon black/silicon rubber mass ratio, its pressure drag spy is studied by pressure testboard and multimeter Property, piezoresistive effect curve is as shown in Figure 4, it can be seen that composite material exhibits go out good negative pressure inhibition effect, when pressure is more than certain When one critical pressure value, composite material shows positive piezoresistive effect in certain pressure limit.
When preparing sensor using traditional coating processes, seldom consider conducting particles concentration to preparing sensor difficulty or ease Composite material can be preferably coated on by the influence of degree, either high concentration or low concentration, sol evenning machine or spreading implement In template.But in the technological process using silk-screen printing, need to consider conducting particles concentration problems, because with carbon black concentration Raising, the viscosity of composite material is increasing, and worse and worse, this will bring a negative impact printing effect mobility, this hair Bright to select carbon black/silicon rubber mass ratio respectively be 2%, 6%, and when 10%, research conducting particles concentration is to composite material printing The influence of energy, wherein basis material selects DOW CORNING 184, printing screen plate mesh to select 200 mesh.
The experimental results showed that:
It when carbon black/silicon rubber mass ratio is 2%, is found in composite material printing, composite material can be good at penetrating net , there is certain paste face phenomenon in version, and the varistor layer film thickness after solidification is uneven, main reason is that, DOW CORNING 184 itself glues Spend it is relatively low, when using low concentration composite material when, the mobility of material is preferable, more through the amount of composite material of web plate, and And matrix surface drying time is longer, in PET film, still has certain mobility, under the influence of extraneous factor, occurs Phenomena such as membrane thickness unevenness.
It when carbon black/silicon rubber mass ratio is 6%, is found in composite material printing, modest viscosity, the film after printing solidification It is uniform and smooth, phenomena such as no paste face is lost shape.
When carbon black/silicon rubber mass ratio is 10%, found in composite material printing, due to the raising of conducting particles content, The viscosity of composite material becomes larger, and mobility is deteriorated, material net thoroughly it is less able, after multiple printing is dry, composite pressure-sensitive layer table Face is rougher, and thickness is relatively low and uneven.
It, before printing can be certain by adding meanwhile the study found that in the practical application for needing to add high concentration carbon black The solvent of amount such as naphtha makes composite material that certain mobility, additive amount be maintained to need according to actual needs, technique, formula Equal requirements determine, but do not answer excessive.Experiment finds that additive amount is excessive, and the film surface after solidification is not smooth enough, covering after solidification Lid rate is relatively low, the problems such as being susceptible to gap.
In a preferred embodiment, the present invention by carbon black/silicon rubber than the composite pressure-sensitive material for 6% based on, Influence of the different meshes to printing performance is studied respectively.Experiment shows:
1, in using the printing of 100 mesh halftones experiment, there is the phenomenon that paste face, main reason is that mesh is excessive, The amount of composite material of transmission is excessive, causes when scraper plate prints, excessive material can not uniformly scatter rapidly, lead to paste face Appearance.
2, in the experiment using 200 mesh web plates, composite pressure-sensitive layer surface is smooth, and thickness is moderate, achieves preferable print Brushing effects.
3, in the experiment using 300 mesh halftones, there is certain gap in the composite pressure-sensitive layer after printing, even if while Repeatedly printing, film thickness is still relatively low, main reason is that mesh is smaller, the amount of composite material that printing can penetrate web plate every time has Limit, since the amount of transmission is too small, composite material can not be uniformly covered on electrode, and varistor layer will appear certain gap, This will have a negative impact to the yields of sensor.
By above-mentioned experiment it is found that the present invention is preferred to select 200 mesh printing screen plates.
The invention also discloses a kind of preparation methods of large area flexible sensor array to show flow chart element referring to Fig. 5 Figure, includes the following steps:
Step S1:Prepare pressure sensitive composite material;
Step S2:Electrod-array is prepared on flexible substrates according to application demand, is respectively formed first electrode array and Two electrod-arrays, wherein any point electrode of first electrode array, which is corresponded with one point electrode of second electrode array, to be made For electrode group;
Step S3:By uncured pressure sensitive composite material, be directly printed in a manner of silk-screen printing first electrode array/ Second electrode array surface forms varistor layer dot matrix after solidification, wherein each dot element and each electricity in the varistor layer dot matrix Pole group corresponds, and point electrode is completely covered in pressure sensitive composite material in each dot element, and is formed between corresponding electrode group " sandwich " structure or " interdigital " structure;
Step S4:Electrode interface is drawn and formed to each point electrode, for being connected with external circuit;
Step S5:Integral packaging is carried out to above structure, to form large area flexible sensor array.
Using above-mentioned technical proposal, the making of large area sensor array is realized using printing technology, with printing technology institute Pressure sensitive array obtained and electrode array show better connectivity, better adhesive force, volume smaller, and preparation efficiency higher is kept away The process that traditional handicraft repeats installation is exempted from, simple for process, stock utilization is high.
The preparation flow of sandwich structure described in detail below:
When forming " sandwich " structure between varistor layer dot matrix, first electrode array and second electrode array:
In the step S2, conductive silver paste is directly printed and prepares first electrode array and second electrode with flexible base board Array waits impurity to degrease using absolute ethyl alcohol and deionized water cleaning flexible base board surface, improves conductive before printing The adhesive force of silver paste.Flexible base board is put into baking oven 120 degrees Celsius after printing, 20min enables silver paste cure;
In the step S3, (using first electrode array substrate/second electrode array substrate as bottom plate, it will be uncured Pressure sensitive composite material is directly printed in first electrode array substrate/second electrode array substrate surface in a manner of silk-screen printing, Varistor layer dot matrix is formed after solidification, when printing composite material, generally by the way of printing twice, it is therefore an objective to make composite material Electrode surface can be completely covered.
In the step S4, the conducting wire of first electrode array substrate/second electrode array substrate is drawn, and is pierced by film Broken terminal realizes, using film Punched terminal, can not only ensure stable electrical connectivity, while also need not will be after solidification Silver paste conducting wire exposes, and avoids the oxidation of silver paste, and the service life of sensor array can be improved.
In the step S5, the setting insulation glue-line between first electrode array substrate and second electrode array substrate, The insulation glue-line covers all areas other than varistor layer dot matrix, by first electrode array substrate and second electrode array substrate face Opposite fitting encapsulation can not only be separated silver wire inside air conservation and be sensed after being bonded due to the presence for the glue-line that insulate Device array thickness volume is relatively low.
Referring to Fig. 6, it is shown sandwich type piezoresistive characteristic curve (array point is the circle of diameter 1cm), with carbon black/silicon rubber Glue directly prints uncured composite material in electrode array list than the composite pressure-sensitive material for 6%, 200 mesh polyester web plates Face prepares the flexible pressure-sensitive layer of sensor.
By the pressure experiment of Fig. 6, statistics indicate that, array point is in negative pressure inhibition effect in 0-2N, can realize that pressure perceives, Array thickness is about 0.3mm, and the response time is about 1s, has good pressure-sensitive sensitivity, and each array point is mutual indepedent, The crosstalk between signal can be reduced.
The explanation of above example is only intended to facilitate the understanding of the method and its core concept of the invention.It should be pointed out that pair For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out Some improvements and modifications, these improvement and modification are also fallen within the protection scope of the claims of the present invention.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest range caused.

Claims (10)

1. a kind of flexible sensor array, which is characterized in that set gradually first electrode array substrate, insulation glue-line, compound pressure Photosensitive layer and second electrode array substrate, wherein the first electrode array substrate and second electrode array substrate are all made of flexibility Electrod-array is set on substrate and is respectively formed first electrode array and second electrode array, the first electrode array any point electricity It is extremely corresponded with one point electrode of second electrode array and is used as electrode group;
The composite pressure-sensitive layer is the varistor layer dot matrix being arranged between first electrode array and second electrode array, described pressure-sensitive Any dot element is completely covered and is pressed between counter electrode group in layer dot matrix;The varistor layer dot matrix is directly with silk-screen printing Mode uncured pressure sensitive composite material is printed in the solidification of first electrode array/second electrode array surface after formed;
The insulation glue-line is for bonding the first electrode array substrate and second electrode array substrate.
2. flexible sensor array according to claim 1, which is characterized in that the first electrode array substrate and second Electrode array substrate also sets up lead terminal, and the lead terminal is electrically connected with each point electrode, for being connect with external circuit.
3. flexible sensor array according to claim 1 or 2, which is characterized in that the first electrode array substrate and Second electrode array substrate is respectively formed first electrode array and second electrode battle array by the way of printing silver paste on flexible base board Row.
4. flexible sensor array according to claim 1 or 2, which is characterized in that the flexible base board uses polyester PET Or polyimides PI.
5. flexible sensor array according to claim 1 or 2, which is characterized in that the composite pressure-sensitive layer passes through pressure-sensitive Composite material is prepared, and the pressure sensitive composite material includes carbon black, silicon rubber, silane coupling agent, nanometer SIO2And naphtha.
6. flexible sensor array according to claim 5, which is characterized in that the accounting of carbon black is silicon rubber quality 2%-10%, the accounting of silane coupling agent are the 2%-5%, nanometer SIO of dispensing gross mass2Accounting be dispensing gross mass 2%-10%, remaining is naphtha;The sum of above component is 100%.
7. flexible sensor array according to claim 6, which is characterized in that the accounting of carbon black is silicon rubber quality 6%.
8. flexible sensor array according to claim 5, which is characterized in that carbon black uses lion ECP600JD or card Rich spy BP2000.
9. flexible sensor array according to claim 5, which is characterized in that silicon rubber uses DOW CORNING 184 or 107 types Silicon rubber.
10. flexible sensor array according to claim 5, which is characterized in that silane coupling agent uses silane coupling agent KH-560。
CN201810610353.1A 2018-06-14 2018-06-14 A kind of flexible sensor array Withdrawn CN108469321A (en)

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CN109683737A (en) * 2018-11-23 2019-04-26 京东方科技集团股份有限公司 A kind of touch base plate, display base plate and display panel
CN110068404A (en) * 2019-05-17 2019-07-30 深圳市航天新材科技有限公司 A kind of resistance-type pliable pressure senser element and preparation method thereof, sensor array
CN110108394A (en) * 2019-05-20 2019-08-09 中国科学院重庆绿色智能技术研究院 Large area array separate type pressure sensor and preparation method thereof, waterborne conductive slurry and preparation method thereof
CN110333010A (en) * 2019-04-10 2019-10-15 绍兴文理学院元培学院 A kind of interdigitation large area flexible sensor array and preparation method thereof
CN111103076A (en) * 2019-12-18 2020-05-05 上海交通大学 Wearable Braille identification system, identification method and preparation method thereof
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CN113049150A (en) * 2021-02-02 2021-06-29 诺瑞(深圳)新技术有限公司 Flexible pressure sensor, preparation method thereof, robot skin and wearable equipment
GB2628117A (en) * 2023-03-14 2024-09-18 Infi Tex Ltd Flexible pressure sensors, conductive transfers, and methods of manufacture for such

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109683737A (en) * 2018-11-23 2019-04-26 京东方科技集团股份有限公司 A kind of touch base plate, display base plate and display panel
CN109683737B (en) * 2018-11-23 2021-02-26 京东方科技集团股份有限公司 Touch substrate, display substrate and display panel
US11307727B2 (en) 2018-11-23 2022-04-19 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch control display panel, touch control display apparatus, touch substrate, and method of fabricating touch control display panel
CN110333010A (en) * 2019-04-10 2019-10-15 绍兴文理学院元培学院 A kind of interdigitation large area flexible sensor array and preparation method thereof
CN110068404A (en) * 2019-05-17 2019-07-30 深圳市航天新材科技有限公司 A kind of resistance-type pliable pressure senser element and preparation method thereof, sensor array
CN110108394A (en) * 2019-05-20 2019-08-09 中国科学院重庆绿色智能技术研究院 Large area array separate type pressure sensor and preparation method thereof, waterborne conductive slurry and preparation method thereof
CN111103076A (en) * 2019-12-18 2020-05-05 上海交通大学 Wearable Braille identification system, identification method and preparation method thereof
CN113049150A (en) * 2021-02-02 2021-06-29 诺瑞(深圳)新技术有限公司 Flexible pressure sensor, preparation method thereof, robot skin and wearable equipment
CN113008124A (en) * 2021-02-20 2021-06-22 宁波诺丁汉新材料研究院有限公司 Multi-mode sensor and preparation method thereof
CN113008124B (en) * 2021-02-20 2023-10-17 宁波诺丁汉新材料研究院有限公司 Multimode sensor and preparation method thereof
GB2628117A (en) * 2023-03-14 2024-09-18 Infi Tex Ltd Flexible pressure sensors, conductive transfers, and methods of manufacture for such

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Application publication date: 20180831