JPH0228035Y2 - - Google Patents

Info

Publication number
JPH0228035Y2
JPH0228035Y2 JP7211384U JP7211384U JPH0228035Y2 JP H0228035 Y2 JPH0228035 Y2 JP H0228035Y2 JP 7211384 U JP7211384 U JP 7211384U JP 7211384 U JP7211384 U JP 7211384U JP H0228035 Y2 JPH0228035 Y2 JP H0228035Y2
Authority
JP
Japan
Prior art keywords
side wall
mold
resin
movable side
wall member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7211384U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60184615U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7211384U priority Critical patent/JPS60184615U/ja
Publication of JPS60184615U publication Critical patent/JPS60184615U/ja
Application granted granted Critical
Publication of JPH0228035Y2 publication Critical patent/JPH0228035Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP7211384U 1984-05-17 1984-05-17 モ−ルド金型 Granted JPS60184615U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7211384U JPS60184615U (ja) 1984-05-17 1984-05-17 モ−ルド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7211384U JPS60184615U (ja) 1984-05-17 1984-05-17 モ−ルド金型

Publications (2)

Publication Number Publication Date
JPS60184615U JPS60184615U (ja) 1985-12-07
JPH0228035Y2 true JPH0228035Y2 (cg-RX-API-DMAC7.html) 1990-07-27

Family

ID=30610225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7211384U Granted JPS60184615U (ja) 1984-05-17 1984-05-17 モ−ルド金型

Country Status (1)

Country Link
JP (1) JPS60184615U (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPS60184615U (ja) 1985-12-07

Similar Documents

Publication Publication Date Title
US4944908A (en) Method for forming a molded plastic article
US5643835A (en) Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs
CA1250959A (en) Molded circuit board
JPH0758665B2 (ja) 複合型回路部品及びその製造方法
US4906802A (en) Molded chip carrier
US4628146A (en) Casing for electrical components, component assemblies or integrated circuits
JPH0228035Y2 (cg-RX-API-DMAC7.html)
JPS6214667Y2 (cg-RX-API-DMAC7.html)
GB2266410A (en) Circuit parts including conductor patterns on moulded bases
JPH0514553Y2 (cg-RX-API-DMAC7.html)
JPH0631137U (ja) 多連電子部品
JPH01143389A (ja) ハイブリッド集積回路装置
JPS62142338A (ja) 半導体装置用パツケ−ジ
JPS6242539Y2 (cg-RX-API-DMAC7.html)
JPS6311694Y2 (cg-RX-API-DMAC7.html)
JP2633568B2 (ja) 電子回路が配置された構造体
JPH0710510Y2 (ja) 混成集積回路用モジュール
JPH037870Y2 (cg-RX-API-DMAC7.html)
JPH03177056A (ja) 回路基板の製造方法
JPH0125423Y2 (cg-RX-API-DMAC7.html)
JP2002198227A (ja) 基板実装型コイル装置
JPH0445273Y2 (cg-RX-API-DMAC7.html)
JPS634092A (ja) 部分メツキプラスチツク成形品及びその製法
JPH0334848Y2 (cg-RX-API-DMAC7.html)
JPS6032765Y2 (ja) 集積回路パツケ−ジ