JPH0227760U - - Google Patents

Info

Publication number
JPH0227760U
JPH0227760U JP10607388U JP10607388U JPH0227760U JP H0227760 U JPH0227760 U JP H0227760U JP 10607388 U JP10607388 U JP 10607388U JP 10607388 U JP10607388 U JP 10607388U JP H0227760 U JPH0227760 U JP H0227760U
Authority
JP
Japan
Prior art keywords
circuit board
connection terminals
pattern formed
film
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10607388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10607388U priority Critical patent/JPH0227760U/ja
Publication of JPH0227760U publication Critical patent/JPH0227760U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る両面フイルム回路基板の
平面図、第2図は同基板の要部断面図、第3図は
異方性ヒートシールコネクターの平面図、第4図
は従来の基板の平面図、第5図は同基板の断面図
である。 1は基材、2は回路パターン、3,4は接続端
子、5は異方性ヒートシールコネクター。
Fig. 1 is a plan view of a double-sided film circuit board according to the present invention, Fig. 2 is a sectional view of the main part of the same board, Fig. 3 is a plan view of an anisotropic heat seal connector, and Fig. 4 is a plan view of a conventional board. The plan view and FIG. 5 are cross-sectional views of the same substrate. 1 is a base material, 2 is a circuit pattern, 3 and 4 are connection terminals, and 5 is an anisotropic heat seal connector.

Claims (1)

【実用新案登録請求の範囲】 ポリエステルフイルム等を基材とし、表裏両面
に回路パターンを形成した両面フイルム回路基板
において、 前記回路基板の表面に形成した回路パターンの
接続端子と裏面に形成した回路パターンの接続端
子とを前記回路基板の同一端部に配置すると共に
、前記基板両面の接続端子をフイルム状コネクタ
ー手段にて接続してなることを特徴とする両面フ
イルム回路基板。
[Claims for Utility Model Registration] In a double-sided film circuit board made of polyester film or the like as a base material and having a circuit pattern formed on both the front and back sides, connection terminals of the circuit pattern formed on the front surface of the circuit board and the circuit pattern formed on the back surface. A double-sided film circuit board, characterized in that the connection terminals are arranged at the same end of the circuit board, and the connection terminals on both sides of the board are connected by a film-like connector means.
JP10607388U 1988-08-10 1988-08-10 Pending JPH0227760U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10607388U JPH0227760U (en) 1988-08-10 1988-08-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10607388U JPH0227760U (en) 1988-08-10 1988-08-10

Publications (1)

Publication Number Publication Date
JPH0227760U true JPH0227760U (en) 1990-02-22

Family

ID=31339257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10607388U Pending JPH0227760U (en) 1988-08-10 1988-08-10

Country Status (1)

Country Link
JP (1) JPH0227760U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006140266A (en) * 2004-11-11 2006-06-01 Citizen Watch Co Ltd Manufacturing method of flexible circuit board mounter
JP2010129851A (en) * 2008-11-28 2010-06-10 Toppan Forms Co Ltd Laminated wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006140266A (en) * 2004-11-11 2006-06-01 Citizen Watch Co Ltd Manufacturing method of flexible circuit board mounter
JP2010129851A (en) * 2008-11-28 2010-06-10 Toppan Forms Co Ltd Laminated wiring board

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