JPH0227759U - - Google Patents
Info
- Publication number
- JPH0227759U JPH0227759U JP10598588U JP10598588U JPH0227759U JP H0227759 U JPH0227759 U JP H0227759U JP 10598588 U JP10598588 U JP 10598588U JP 10598588 U JP10598588 U JP 10598588U JP H0227759 U JPH0227759 U JP H0227759U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- resin layer
- circuit board
- printed circuit
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10598588U JPH0227759U (de) | 1988-08-12 | 1988-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10598588U JPH0227759U (de) | 1988-08-12 | 1988-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227759U true JPH0227759U (de) | 1990-02-22 |
Family
ID=31339091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10598588U Pending JPH0227759U (de) | 1988-08-12 | 1988-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227759U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679174U (ja) * | 1993-04-09 | 1994-11-04 | 東洋電機製造株式会社 | インバータ装置のプリント配線板 |
-
1988
- 1988-08-12 JP JP10598588U patent/JPH0227759U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0679174U (ja) * | 1993-04-09 | 1994-11-04 | 東洋電機製造株式会社 | インバータ装置のプリント配線板 |
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