JPH02276291A - Connection of pattern - Google Patents
Connection of patternInfo
- Publication number
- JPH02276291A JPH02276291A JP9784189A JP9784189A JPH02276291A JP H02276291 A JPH02276291 A JP H02276291A JP 9784189 A JP9784189 A JP 9784189A JP 9784189 A JP9784189 A JP 9784189A JP H02276291 A JPH02276291 A JP H02276291A
- Authority
- JP
- Japan
- Prior art keywords
- board
- pattern
- rigid
- flexible
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 77
- 239000000853 adhesive Substances 0.000 abstract description 11
- 230000001070 adhesive effect Effects 0.000 description 9
- 230000007261 regionalization Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
本発明は、変形し難い剛性基板と変形容易なフレキシブ
ル基板それぞれに形成されたパターンを精確に一致させ
て接続する方法に関する。The present invention relates to a method of connecting patterns formed on a rigid substrate that is difficult to deform and a flexible substrate that is easily deformable by accurately matching patterns.
現在、各種電気機器の制御部には小型軽ユ化を図る目的
で、ポリエチレン等の合成樹脂からなる変形容易なフレ
キシブルシートの基板が広く使用されている。そして、
要部には丈夫で変形し難い剛性基板が用いられることが
多いので、剛性基板とフレキシブルな基板とは良好な状
態で接続されなければならない。しかし、フレキシブル
基板２は第２Ａ図に示すように反っていることが多いた
め、第２Ｂ図のように平板な剛性基板１に接続する際、
中心部で電極１３と２３とを一致させると両端部ではず
れることになり、微細な電極が多数配設されたパターン
の場合は接続不良となって、機器が正常に作動しないこ
とがある。このため、一般的には剛性基板１の接続部に
フレキシブル基板２の接続部を重ねた後、適宜の押さえ
部材により押さえつける等して、変形したフレキシブル
基板２を平らに矯正し、それぞれのパターンを一致させ
て接続する方法が取られている。Currently, easily deformable flexible sheet substrates made of synthetic resin such as polyethylene are widely used in control units of various electrical devices for the purpose of making them smaller and lighter. and,
Since a rigid substrate that is strong and difficult to deform is often used for the main parts, the rigid substrate and the flexible substrate must be connected in good condition. However, since the flexible substrate 2 is often warped as shown in FIG. 2A, when connecting it to the flat rigid substrate 1 as shown in FIG. 2B,
If the electrodes 13 and 23 are matched at the center, they will come off at both ends, and in the case of a pattern with a large number of fine electrodes, this may result in poor connection and the device may not operate properly. For this reason, generally, after the connection part of the flexible board 2 is overlapped with the connection part of the rigid board 1, the deformed flexible board 2 is flattened by pressing down with an appropriate pressing member, etc., and each pattern is A method of matching and connecting is used.
しかし、剛性基板の接続部にフレキシブル基板の接続部
を別部材で押さえつける従来の接続方法では、装置が複
雑となるばかりでなく、操作性も低下すると云う大きな
問題点があるや
従って、フレキシブル基板が多少反っていても、剛性基
板のパターンに精確に接続することの出来る方法の開発
が望まれていた。However, the conventional connection method, in which the connection part of the flexible board is held down by a separate member to the connection part of the rigid board, not only complicates the device but also reduces operability, which is a major problem. It has been desired to develop a method that can accurately connect to a pattern on a rigid substrate even if it is slightly warped.
本発明は上記した従来技術の課題を解決するためになさ
れたもので、剛性基板のパターン形成面に、３〜１０度
傾斜したフレキシブル基板のパターン形成面を対向させ
、近接するパターン形成面の端部を押しつけて全線密着
させた後、対応するパターンを一致させるパターン接続
方法であり、対応するパターンを一致させた後、剛性基
板とフレキシブル基板とを加圧接着させるパターン接続
方法である。The present invention has been made in order to solve the problems of the prior art described above, and the pattern forming surface of a flexible substrate tilted by 3 to 10 degrees is opposed to the pattern forming surface of a rigid substrate, and the edges of the adjacent pattern forming surface are This is a pattern connection method in which the corresponding patterns are matched after the parts are pressed together so that all the lines are in close contact with each other, and the rigid board and the flexible board are bonded together under pressure after the corresponding patterns are matched.
本発明になるパターン接続方法は上記構成であるため、
剛性基板のパターン形成面に、３〜１０度傾斜したフレ
キシブル基板のパターン形成面を対向させ、近接したパ
ターン形成面の一端部を剛性基板のパターン形成面に押
しつけると、フレキシブル基板は例え反っていても、押
しつけられた端部は剛性基板の表面に沿って変形され、
剛性基板のパターン形成面にフレキシブル基板の端部が
前線に渡って密着する。この状態で剛性基板、又はフレ
キシブル基板の何れか一方、又は両方を移動することに
より対応するパターンを一致させる。又、双方のパター
ンを一致させた後、剛性基板とフレキシブル基板とを適
宜の接着剤等を用いて加圧接着する。Since the pattern connection method according to the present invention has the above configuration,
When the patterned surface of a flexible substrate tilted by 3 to 10 degrees is opposed to the patterned surface of the rigid substrate and one end of the adjacent patterned surface is pressed against the patterned surface of the rigid substrate, even if the flexible substrate is warped, Also, the pressed end is deformed along the surface of the rigid substrate,
The end of the flexible substrate is brought into close contact with the pattern-formed surface of the rigid substrate along the front. In this state, either the rigid substrate or the flexible substrate, or both, are moved to match the corresponding patterns. Further, after matching both patterns, the rigid substrate and the flexible substrate are bonded together under pressure using an appropriate adhesive or the like.
つぎに本発明を第１図に示した実施例に基づいて詳細に
説明する。
図中１が平板なガラス製の剛性基板であり、２が幾分反
った合成樹脂製の変形容易なフレキシブル基板である。
ガラス製の剛性基板１はフレキシブル基板２との関係に
於いては実質的に変形することのない基板と考えても構
わない。
剛性基板１の端部１１には、片面に付設されたＬＥＤ
（液晶表示体）１２に接続している多数の電極がパター
ン状に形成されており（以下単にパターンと云う）、該
パターン形成面を上にしてベツド３に水平に載置されて
いる。
ベツド３は、下方から剛性基板１の上面に形成されたパ
ターンの観察が可能に適宜の間隙３１が設けられており
、該ペッド３の下方には適宜の観察手段、例えば顕微鏡
付きカメラ４が配設されている。
フレキシブル基板２の片面（図面下側）にも剛性基板１
のパターンに対応する多数の電極がパターン状に形成さ
れており（以下パターンと云う）、上部梁５から懸垂さ
れ、水平方向と共に上下方向にも自在に移動することの
出来る調整装置６に取着された固定用バット６１の先端
部に真空吸着されて、前記剛性基板１のパターン形成面
に対して５度傾斜して支持されている。剛性基板１の端
部１１を臨むフレキシブル基板２の下側端部２１に、異
方性導電膜等の透明な適宜の接着剤２２を適量塗布し、
剛性基板１の端部１１側に降下させて端部２１を押しつ
けると、湾曲していた該端部２１は全線に渡って平板な
剛性基板１の表面に密着する。この密着状態を維持しな
がら前記カメラ４によって剛性基板１のパターンとフレ
キシブル基板２のパターンを観察し、前記調整装置６を
適宜駆動してフレキシブル基板２を前後左右に移動させ
、剛性基板１のパターンにフレキシブル基板２のパター
ンを一致させる。剛性基板１のパターンとフレキシブル
基板２のパターンを一致させた後、前記上部梁５から調
整装置６と同様、水平方向と共に上下方向にも自在に移
動可能に懸垂された接着手段７をフレキシブル基板２の
端部２１の上に降下させ、適宜の温度に加熱されている
接着ヘッド７１を押圧すると、前記接着剤２２が硬化し
て、剛性基板１とフレキシブル基板２とが対応するパタ
ーンを精確に一致させた状態で接着される。
尚、剛性基板１とフレキシブル基板２との傾斜角度が３
度未満の場合は、フレキシブル基板２の端部２１を剛性
基板１に押し当ててもフレキシブル基板２の反りを除去
することが出来ないため、パターンを精確に一致させる
ことが困難であり、１０度を越えて傾斜させるとパター
ンを一致させた後、上下から押圧して剛性基板１とフレ
キシブル基板２とを接着する際に位置がずれたり、フレ
キシブル基板２に疵が付くことがあると云う問題点があ
る。従って、剛性基板１とフレキシブル基板２とは３〜
１０度の範囲で傾斜させる必要がある。又、剛性基板１
としてはガラス基板の他にもエポキシ樹脂等からなる基
板であっても構わないし、基板に形成する電極等のパタ
ーンはアルミニウム、クロム等の適宜の導電性材料を用
いて形成される。そして、パターンを観察する顕微鏡付
きカメラ４等は、固定用バット６１と共に調整装置６等
に取着することも可能である。Next, the present invention will be explained in detail based on the embodiment shown in FIG. In the figure, 1 is a flat rigid substrate made of glass, and 2 is a somewhat warped flexible substrate made of synthetic resin that is easily deformable. The rigid substrate 1 made of glass may be considered as a substrate that does not substantially deform in relation to the flexible substrate 2. At the end 11 of the rigid substrate 1, there is an LED attached to one side.
(Liquid crystal display) A large number of electrodes connected to 12 are formed in a pattern (hereinafter simply referred to as a pattern), and are placed horizontally on the bed 3 with the patterned surface facing upward. The bed 3 is provided with an appropriate gap 31 so that the pattern formed on the upper surface of the rigid substrate 1 can be observed from below, and an appropriate observation means such as a camera 4 with a microscope is arranged below the bed 3. It is set up. There is also a rigid substrate 1 on one side (lower side of the drawing) of the flexible substrate 2.
A large number of electrodes corresponding to the pattern are formed in a pattern (hereinafter referred to as a pattern), which is suspended from the upper beam 5 and attached to an adjustment device 6 that can freely move in the vertical direction as well as the horizontal direction. It is vacuum-adsorbed to the tip of the fixing bat 61 and is supported at an angle of 5 degrees with respect to the pattern-forming surface of the rigid substrate 1. Applying an appropriate amount of a suitable transparent adhesive 22 such as an anisotropic conductive film to the lower end 21 of the flexible substrate 2 facing the end 11 of the rigid substrate 1,
When the rigid substrate 1 is lowered to the end 11 side and the end 21 is pressed, the curved end 21 comes into close contact with the surface of the flat rigid substrate 1 over the entire line. While maintaining this close contact state, the pattern of the rigid substrate 1 and the pattern of the flexible substrate 2 are observed with the camera 4, and the adjusting device 6 is appropriately driven to move the flexible substrate 2 back and forth and left and right, and the pattern of the rigid substrate 1 is The pattern of the flexible substrate 2 is made to match. After matching the pattern of the rigid substrate 1 and the pattern of the flexible substrate 2, the adhesive means 7, which is suspended from the upper beam 5 so as to be movable both horizontally and vertically as well as the adjustment device 6, is attached to the flexible substrate 2. When the adhesive head 71 heated to an appropriate temperature is pressed onto the edge 21 of the substrate, the adhesive 22 is cured and the corresponding patterns of the rigid substrate 1 and the flexible substrate 2 are precisely aligned. It is glued in the same position. Note that the angle of inclination between the rigid substrate 1 and the flexible substrate 2 is 3.
If the angle is less than 10 degrees, the warpage of the flexible substrate 2 cannot be removed even if the end 21 of the flexible substrate 2 is pressed against the rigid substrate 1, so it is difficult to match the patterns accurately. If the rigid substrate 1 and the flexible substrate 2 are tilted beyond this angle, the positions may shift or the flexible substrate 2 may be damaged when the rigid substrate 1 and the flexible substrate 2 are bonded together by pressing from above and below after matching the patterns. There is. Therefore, the rigid substrate 1 and the flexible substrate 2 are
It is necessary to tilt it within a range of 10 degrees. In addition, the rigid substrate 1
In addition to a glass substrate, a substrate made of epoxy resin or the like may be used as the substrate, and patterns such as electrodes formed on the substrate may be formed using an appropriate conductive material such as aluminum or chromium. The camera 4 with a microscope for observing the pattern can also be attached to the adjustment device 6 and the like together with the fixing bat 61.
以上説明したように、本発明になるパターン接続方法は
剛性基板のパターン形成面に、３〜１０度傾斜したフレ
キシブル基板のパターン形成面を対向させ、近接したパ
ターン形成面の一端部を剛性基板のパターン形成面に押
しつけるので、フレキシブル基板は例え反っていても、
押しつけられた端部は剛性基板の表面に沿って変形し、
前線に渡って密着する。そしてこの密着状態で基板を移
励させるものであるから、簡単にパターンを一致させる
ことが出来る。そして、双方のパターンを一致させた後
、剛性基板とフレキシブル基板とを適宜の接着剤等を用
いて接着するものであるから、簡単にしかも精確に剛性
基板とフレキシブル基板のパターンを接続させることが
出来る。As explained above, in the pattern connection method of the present invention, the pattern formation surface of the rigid substrate is opposed to the pattern formation surface of the flexible substrate tilted by 3 to 10 degrees, and one end of the adjacent pattern formation surface is connected to the pattern formation surface of the rigid substrate. Since it is pressed against the pattern forming surface, even if the flexible substrate is warped,
The pressed end deforms along the surface of the rigid substrate,
Close contact with the front line. Since the substrate is moved in this close contact state, the patterns can be easily matched. After matching the patterns on both sides, the rigid and flexible substrates are bonded together using an appropriate adhesive, so the patterns on the rigid and flexible substrates can be easily and precisely connected. I can do it.
第１図は本発明の詳細な説明図、第２Ａ図と第２Ｂ図は
従来例の説明図である。
１・・・剛性基板、
１１・・・ＬＣＤ。
１２・・・端部、
１３・・・電極、
２・・・フレキシブル基板、
２１・・・端部、
２２・・・接着剤、
２３・・・電極、
３・・・ベツド、
３１・・・間隙、
４・・・カメラ、
５・・・固定バット、
５１・・・調整装置、
６・・・上部梁、
７・・・接着装置、
７１・・・接着ヘッド。FIG. 1 is a detailed explanatory diagram of the present invention, and FIGS. 2A and 2B are explanatory diagrams of a conventional example. 1... Rigid substrate, 11... LCD. DESCRIPTION OF SYMBOLS 12... End part, 13... Electrode, 2... Flexible board, 21... End part, 22... Adhesive, 23... Electrode, 3... Bed, 31... Gap, 4... Camera, 5... Fixed bat, 51... Adjustment device, 6... Upper beam, 7... Adhesive device, 71... Adhesive head.
Claims (2)
たフレキシブル基板のパターン形成面を対向させ、近接
するパターン形成面の端部を押しつけて全線密着させた
後、対応するパターンを一致させることを特徴とするパ
ターン接続方法。(1) Place the pattern-formed surface of the flexible substrate inclined by 3 to 10 degrees to face the pattern-formed surface of the rigid substrate, press the edge of the adjacent pattern-formed surface so that all lines are in close contact, and then match the corresponding patterns. A pattern connection method characterized by:
レキシブル基板とを加圧接着させる第１項記載のパター
ン接続方法。(2) The pattern connection method according to item 1, in which the rigid substrate and the flexible substrate are bonded together under pressure after matching the corresponding patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9784189A JPH02276291A (en) | 1989-04-18 | 1989-04-18 | Connection of pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9784189A JPH02276291A (en) | 1989-04-18 | 1989-04-18 | Connection of pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02276291A true JPH02276291A (en) | 1990-11-13 |
Family
ID=14202947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9784189A Pending JPH02276291A (en) | 1989-04-18 | 1989-04-18 | Connection of pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02276291A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0538833A (en) * | 1991-08-07 | 1993-02-19 | Rapiasu Denki Kk | Bonding device for electronic part |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6185892A (en) * | 1984-10-04 | 1986-05-01 | 株式会社精工舎 | Connection of flexible circuit board |
-
1989
- 1989-04-18 JP JP9784189A patent/JPH02276291A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6185892A (en) * | 1984-10-04 | 1986-05-01 | 株式会社精工舎 | Connection of flexible circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0538833A (en) * | 1991-08-07 | 1993-02-19 | Rapiasu Denki Kk | Bonding device for electronic part |
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