JPH0227607U - - Google Patents
Info
- Publication number
- JPH0227607U JPH0227607U JP1988105792U JP10579288U JPH0227607U JP H0227607 U JPH0227607 U JP H0227607U JP 1988105792 U JP1988105792 U JP 1988105792U JP 10579288 U JP10579288 U JP 10579288U JP H0227607 U JPH0227607 U JP H0227607U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wedge bonding
- bonding wire
- utility
- sectional shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
-
- H10W72/533—
-
- H10W72/534—
-
- H10W72/5524—
Landscapes
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105792U JPH0227607U (enExample) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988105792U JPH0227607U (enExample) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227607U true JPH0227607U (enExample) | 1990-02-22 |
Family
ID=31338725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988105792U Pending JPH0227607U (enExample) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227607U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04118942A (ja) * | 1990-09-10 | 1992-04-20 | Hitachi Ltd | ワイヤボンディング方法、およびその装置 |
-
1988
- 1988-08-10 JP JP1988105792U patent/JPH0227607U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04118942A (ja) * | 1990-09-10 | 1992-04-20 | Hitachi Ltd | ワイヤボンディング方法、およびその装置 |