JPH02271560A - Heat-conduction type cooling apparatus - Google Patents
Heat-conduction type cooling apparatusInfo
- Publication number
- JPH02271560A JPH02271560A JP9381289A JP9381289A JPH02271560A JP H02271560 A JPH02271560 A JP H02271560A JP 9381289 A JP9381289 A JP 9381289A JP 9381289 A JP9381289 A JP 9381289A JP H02271560 A JPH02271560 A JP H02271560A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- heat
- cooling structure
- heating
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- 238000009423 ventilation Methods 0.000 claims abstract description 22
- 239000000498 cooling water Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 238000010009 beating Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000470 constituent Substances 0.000 description 4
- GLGNXYJARSMNGJ-VKTIVEEGSA-N (1s,2s,3r,4r)-3-[[5-chloro-2-[(1-ethyl-6-methoxy-2-oxo-4,5-dihydro-3h-1-benzazepin-7-yl)amino]pyrimidin-4-yl]amino]bicyclo[2.2.1]hept-5-ene-2-carboxamide Chemical compound CCN1C(=O)CCCC2=C(OC)C(NC=3N=C(C(=CN=3)Cl)N[C@H]3[C@H]([C@@]4([H])C[C@@]3(C=C4)[H])C(N)=O)=CC=C21 GLGNXYJARSMNGJ-VKTIVEEGSA-N 0.000 description 2
- 229940125758 compound 15 Drugs 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔、概 要〕
冷却構造体の熱伝導部を発熱体に当接させてこれを冷却
する熱伝導型冷却装置に関し、発熱体から冷却構造体を
分離する操作を安全。[Detailed Description of the Invention] [Summary] Regarding a heat conduction type cooling device in which the heat conduction part of the cooling structure is brought into contact with a heating element to cool it, the operation of separating the cooling structure from the heating element is safely performed. .
かつ容易に行い得る熱伝導型冷却装置の提供を目的とし
、
前記熱伝導部の発熱体と当接する側の面に通気〔産業上
の利用分野〕
本発明は、冷却水によって冷却された冷却構造体をＬＳ
Ｉ（集積回路装置）等の発熱体に当接させてこれを冷却
する熱伝導型冷却装置（以下冷却装置と呼ぶ）に関する
。The present invention aims to provide a heat conduction type cooling device that can be easily operated, and provides a cooling structure cooled by cooling water. LS body
The present invention relates to a heat conduction type cooling device (hereinafter referred to as a cooling device) that cools a heating element such as an integrated circuit device (I) by bringing it into contact with the heating element.
第２図ｆａｌと（ｂ）と（Ｃ１は従来の冷却装置の構成
を示す模式的要部側断面図とその細部構造を示す要部側
断面図および主要構成部材の形状を示す平面図である。Figures 2 (b) and (C1) are a schematic side sectional view of the main part showing the configuration of a conventional cooling device, a side sectional view of the main part showing its detailed structure, and a plan view showing the shapes of the main constituent members. .
第２図（ａｌと（ｂ）および（Ｃ）に示すように、従来
の冷却装置は、プリント板３０に実装された複数個の発
熱体３対応に設けられた冷却構造体５を装備すると共に
、冷却水１０の給水口１８および排水口１９を有してな
る本体部２０と、前記各発熱体３と冷却装置側の冷却構
造体５とがそれぞれ当接する形で前記プリント板３０を
支持する支持部材１７を具備している。図中、１Ｇは支
持部材１７を本体部２０に固定する固定ネジである。As shown in FIGS. 2(al), (b), and (C), the conventional cooling device is equipped with a cooling structure 5 provided corresponding to a plurality of heating elements 3 mounted on a printed board 30, and , the printed board 30 is supported in such a manner that the main body portion 20 having a water supply port 18 and a drain port 19 for the cooling water 10, each of the heating elements 3 and the cooling structure 5 on the cooling device side are in contact with each other. It has a support member 17. In the figure, 1G is a fixing screw that fixes the support member 17 to the main body part 20.
前記冷却構造体５は第２図（ｂ）に示すように、通常時
は矢印入方向に付勢され、かつ軸方向（矢印Ａ−Ａ’
）に弾力性を有する部材１例えばベローズ等で構成され
た弾性体部８と、その先端部分に装備された熱伝導部７
とによって構成され、前記弾性体部８内を矢印方向に流
動する冷却水１０によって冷却された該熱伝導部７をプ
リント板３０上の発熱体３に当接させることによって当
該発熱体３を冷却する。図中、１５は発熱体３と熱伝導
部７間の熱伝導度を向上させるために塗布されるグリー
ス状の熱媒体物質（以下サーマルコンパウンド１５と呼
ぶ）である。As shown in FIG. 2(b), the cooling structure 5 is normally biased in the direction of the arrow, and is biased in the axial direction (arrow A-A'
) an elastic body part 8 made of a member 1 having elasticity, such as a bellows, and a heat conduction part 7 equipped at its tip.
The heat-conducting part 7, which is cooled by the cooling water 10 flowing in the direction of the arrow in the elastic body part 8, is brought into contact with the heat-generating element 3 on the printed board 30 to cool the heat-generating element 3. do. In the figure, 15 is a grease-like heat transfer material (hereinafter referred to as thermal compound 15) that is applied to improve the thermal conductivity between the heating element 3 and the heat conduction part 7.
なお、従来の熱伝導部７は、発熱体３に当接する側の面
、即ち発熱体当接面２Ｇが第２図（Ｃ１に示すように平
面状になっている。In addition, in the conventional heat conduction part 7, the surface on the side that comes into contact with the heating element 3, that is, the heating element contacting surface 2G, is planar as shown in FIG. 2 (C1).
２６が平面状になっているため、発熱体３の交換等を実
施するに際して当該発熱体３から冷却構造体５を分離す
る操作（固定ネジ１６を取り外して本体部２０を？方向
に持ち上げる操作）が特に困難である。これは前記サー
マルコンパウンド１５によってこれら発熱体３と発熱体
当接面２６が互いに密接状態となり、そのため外部の空
気が内部に侵入できなくなってそこに真空現象が生じる
ためで、この場合のリムーブ力（プリント板３０と本体
部２０とを分離するに要する矢印官方向の力）は、発熱
体３の実装数にもよるが、かなり膨大なものとなり、こ
れが原因で構造的に脆弱な発熱体３のリード３８等が折
損するといった事故が屡々発生していた。26 is flat, so when replacing the heating element 3, the operation of separating the cooling structure 5 from the heating element 3 (operation of removing the fixing screw 16 and lifting the main body part 20 in the ? direction) is necessary. is particularly difficult. This is because the thermal compound 15 brings the heating element 3 and the heating element contact surface 26 into close contact with each other, making it impossible for outside air to enter the interior and creating a vacuum phenomenon. The force (in the direction of the arrow) required to separate the printed board 30 and the main body 20 depends on the number of heat generating elements 3 mounted, but it becomes quite large, and this causes damage to the structurally fragile heat generating elements 3. Accidents in which the lead 38 etc. were broken often occurred.
本発明は上記の事故を抑止するためになされたもので、
発熱体３の交換等を実施するに際して当該発熱体３と冷
却構造体５を容易にリムーブし得る構成とした点にその
特徴がある。The present invention was made to prevent the above-mentioned accidents.
Its feature is that the heating element 3 and the cooling structure 5 can be easily removed when the heating element 3 is replaced.
このように、従来の冷却装置は、発熱体当接面〔課題を
解決するための手段〕
本発明による冷却装置は第１図に示すように、冷却水１
０によって冷却された熱伝導部７の発熱体３と当接する
側の面６に通気溝１を装備した構成になっている。As described above, the conventional cooling device has a heating element contact surface [means for solving the problem].The cooling device according to the present invention has a cooling water 1 as shown in FIG.
A ventilation groove 1 is provided on the surface 6 of the heat conduction section 7 that is cooled by the heating element 3 and is in contact with the heating element 3.
本発明による冷却装置は、通気溝１を発熱体当接面６に
装備しているため、冷却構造体５と発熱体３とを分離す
る際に外気がその通気溝１から侵入し、冷却構造体５と
発熱体３間に構成されている真空構成を緩和するため、
両者の分”離が著しく容易になる。Since the cooling device according to the present invention is equipped with the ventilation groove 1 on the heating element contact surface 6, when the cooling structure 5 and the heating element 3 are separated, the outside air enters through the ventilation groove 1, and the cooling structure In order to alleviate the vacuum configuration between the body 5 and the heating element 3,
Separation of the two becomes significantly easier.
以下実施例図に基づいて本発明の詳細な説明する。 Hereinafter, the present invention will be described in detail based on embodiment figures.
第１図（ａｌと（ｂｌは本発明の一実施例を示す模式的
要部側断面図と主要構成部材の形状例を示す平面図であ
るが、前記第２図と同一部分に同一符号を付している。Figure 1 (al and (bl) are a schematic side sectional view of the main part showing one embodiment of the present invention and a plan view showing an example of the shape of the main constituent members. It is attached.
第１図（ａｌと（ｂｌに示すように、本発明による冷却
装置は、熱伝導部７の発熱体３と対向する側の面。As shown in FIGS. 1A and 1B, the cooling device according to the present invention shows the surface of the heat conduction section 7 facing the heating element 3.
即ち発熱体当接面６に、その一方の端部が当該発熱体当
接面６のほぼ中心部に位置し、他方の端部がその外周部
端面７ａにおいて開放状態となる複数条の通気溝１を装
備している。この通気溝１は、冷却構造体５と発熱体３
が互いに密接状態になった時でも外部の空気を発熱体当
接面６の中心位置に誘導するΦで、熱伝導部７と発熱体
３間に真空状態が形成され難い。しかもこの通気溝ｌは
空気の通過を妨げないだけの深さが有れば良いことから
、その溝幅を広くする必要は無く、従って通気溝１の占
める面積は発熱体当接面６の面積に対して１〜２％程度
で良い。このため、通気溝１を設けたことによって発熱
体３から熱伝導部７に伝導される熱量が減少するような
ことはない。That is, a plurality of ventilation grooves are provided on the heating element contacting surface 6, one end of which is located approximately at the center of the heating element contacting surface 6, and the other end of which is open at the outer peripheral end surface 7a. Equipped with 1. This ventilation groove 1 connects the cooling structure 5 and the heating element 3.
Even when they are in close contact with each other, it is difficult for a vacuum state to be formed between the heat conductive part 7 and the heat generating element 3 due to Φ which guides outside air to the center position of the heat generating element contact surface 6. Moreover, since this ventilation groove 1 only needs to have a depth that does not obstruct the passage of air, there is no need to make the groove width wide. Therefore, the area occupied by the ventilation groove 1 is the area of the heating element contact surface 6. It may be about 1 to 2%. Therefore, the provision of the ventilation groove 1 does not reduce the amount of heat conducted from the heating element 3 to the heat conduction section 7.
なお、本実施例では各通気溝ｌがそれぞれ独立して設け
られた形になっているが、これら各通気溝１が発熱体当
接面６の中心部分で互いに繋がる形になっていてもかま
わない。要するにこれらの通気溝１が発熱体当接面６の
ほぼ中心部を経由して外周部端面７ａにおいて開放状態
になっていればそれで良いわけである。In this embodiment, the ventilation grooves 1 are provided independently, but the ventilation grooves 1 may be connected to each other at the center of the heating element contact surface 6. do not have. In short, it is sufficient that these ventilation grooves 1 are open at the outer peripheral end surface 7a via approximately the center of the heat generating element abutting surface 6.
本実施例は各通気溝１がそれぞれ放射状に形成されてい
るが、一方の端部が発熱体当接面６のほぼ中心部に位置
するか、或いはほぼ中心部を経由した形で設けられ、か
つ他方の端部が熱伝導部７の外周部端面から開放された
状態になっているならば通気溝ｌの形状にはこだわらな
い。In this embodiment, each ventilation groove 1 is formed radially, and one end is located approximately at the center of the heating element contact surface 6, or is provided through approximately the center. In addition, as long as the other end is open from the outer peripheral end surface of the heat conduction section 7, the shape of the ventilation groove l is not critical.
この通気溝１は、切削加工等によって形成しても良いし
、熱伝導部７を鋳物等で加工する際は鋳型を用いて形成
するようにしてもかまわない。The ventilation grooves 1 may be formed by cutting or the like, or may be formed using a mold when the heat conduction portion 7 is made of a casting or the like.
以上の説明から明らかなように本発明の冷却装置は、発
熱体と当接する冷却構造体に通気溝が形成され、該通気
溝から侵入する外気によって冷却構造体と発熱体間に形
成される真空構造が緩和される構成になっていることか
ら、発熱体と冷却構造体とを分離する際に発熱体や冷却
構造体を損傷する事故が大幅に減少する。As is clear from the above description, in the cooling device of the present invention, ventilation grooves are formed in the cooling structure that comes into contact with the heating element, and a vacuum is formed between the cooling structure and the heating element by outside air entering through the ventilation groove. Since the structure is relaxed, accidents that damage the heating element and the cooling structure when the heating element and the cooling structure are separated are greatly reduced.
第１図（ａｌと（ｂ）は本発明の一実施例を示す模式的
要部側断面図と主要構成部材の形状例を示す平面図、
第２図（ａｌとｆｂｌと（Ｃ）は従来の冷却装置の構成
を示す模式的要部側断面図とその細部構造を示す要部側
断面図および主要構成部材の形状を示す平面図である。
図において、■は通気溝、
３は発熱体、
３ａはリード、
５は冷却構造体、
６と２６は発熱体当接面、
７は熱伝導部、
７ａは熱伝導部の外周部端面、
８は弾性体部、
１０は冷却水、
１５はサーマルコンパウンド、
１６は固定ネジ、
１７は支持部材、
１８は給水口、
１９は排水口、
２０は本体部、
３０はプリント板、
をそれぞれ示す。
（α］
冷禿明め一呻ゴ必
第１図Figure 1 (al and (b) is a schematic side sectional view of the main part showing one embodiment of the present invention and a plan view showing an example of the shape of the main constituent members; Figure 2 (al, fbl, and (c) is a conventional 2 is a schematic side sectional view of the main part showing the configuration of the cooling device, a side sectional view of the main part showing the detailed structure, and a plan view showing the shape of the main constituent members. In the figure, ■ is a ventilation groove, and 3 is a heating element. , 3a is a lead, 5 is a cooling structure, 6 and 26 are heating element contact surfaces, 7 is a heat conduction part, 7a is an outer peripheral end face of the heat conduction part, 8 is an elastic body part, 10 is cooling water, 15 is a Thermal compound, 16 is a fixing screw, 17 is a support member, 18 is a water supply port, 19 is a drain port, 20 is a main body part, 30 is a printed board, respectively. figure
Claims (1)
熱伝導部（７）を発熱体（３）に当接させて当該発熱体
（３）の冷却を行う熱伝導型冷却装置の構成において、
前記熱伝導部（７）の発熱体（３）と当接する側の面（
６）に通気溝（１）を装備してなることを特徴とする熱
伝導型冷却装置。Configuration of a heat conduction cooling device that cools the heat generating element (3) by bringing the heat conducting part (7) of the cooling structure (5) cooled by the cooling water (10) into contact with the heat generating element (3) In,
The surface of the thermally conductive part (7) that comes into contact with the heating element (3) (
6) A heat conduction type cooling device characterized by being equipped with a ventilation groove (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9381289A JPH02271560A (en) | 1989-04-12 | 1989-04-12 | Heat-conduction type cooling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9381289A JPH02271560A (en) | 1989-04-12 | 1989-04-12 | Heat-conduction type cooling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02271560A true JPH02271560A (en) | 1990-11-06 |
Family
ID=14092814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9381289A Pending JPH02271560A (en) | 1989-04-12 | 1989-04-12 | Heat-conduction type cooling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02271560A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10462939B2 (en) | 2015-01-22 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
-
1989
- 1989-04-12 JP JP9381289A patent/JPH02271560A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10462939B2 (en) | 2015-01-22 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
| DE112015006041B4 (en) * | 2015-01-22 | 2021-03-11 | Mitsubishi Electric Corporation | Semiconductor device |
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