JPH01166544A - Cooling structure for multi-chip module - Google Patents
Cooling structure for multi-chip moduleInfo
- Publication number
- JPH01166544A JPH01166544A JP62323937A JP32393787A JPH01166544A JP H01166544 A JPH01166544 A JP H01166544A JP 62323937 A JP62323937 A JP 62323937A JP 32393787 A JP32393787 A JP 32393787A JP H01166544 A JPH01166544 A JP H01166544A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- fins
- conductor
- heat
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims description 6
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000002470 thermal conductor Substances 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、基板上に複数の半導体チップを搭載したマル
チチップモジュールにおいて、半導体チップから発生す
る熱を除去するための冷却構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for removing heat generated from semiconductor chips in a multi-chip module in which a plurality of semiconductor chips are mounted on a substrate.
従来の冷却構造は特開昭６０−１２６８５１号公報に記
載のように、一つの半導体チップの領域内だけでばねを
使用していた。このため、半導体チップに熱伝導体を押
し付けると、熱伝導体とハウジングを押し付ける力の二
カを同時に得るように、熱伝導体とハウジング間を斜め
にばねで接続していた。A conventional cooling structure uses a spring only within the area of one semiconductor chip, as described in Japanese Patent Laid-Open No. 60-126851. For this reason, the thermal conductor and the housing have been connected diagonally by a spring so that when the thermal conductor is pressed against the semiconductor chip, the two forces of pressing the thermal conductor and the housing are obtained at the same time.
上記従来技術は、一つの半導体チップ領域でのみ冷却構
造を完結させようとしたために、半導体チップからハウ
ジングに至る熱の径路中に２つ以上の部品を有していた
。このため、各部品間に存在する間隙に伴う接触部の熱
抵抗について配慮されておらず、伝熱性能低下の問題が
あった。In the above-mentioned conventional technology, since the cooling structure was attempted to be completed in only one semiconductor chip area, two or more parts were included in the heat path from the semiconductor chip to the housing. For this reason, no consideration was given to the thermal resistance of the contact portion due to the gaps that exist between each component, resulting in a problem of deterioration in heat transfer performance.
本発明の目的は、半導体チップを複数個搭載したマルチ
チップモジュールの場合で、熱伝導体とハウジングのフ
ィン同士を接触させるばね挿入スペースを確保して、伝
熱性能の向上を図ることにある。An object of the present invention is to improve heat transfer performance in the case of a multi-chip module in which a plurality of semiconductor chips are mounted, by securing a space for inserting a spring that brings the heat conductor and the fins of the housing into contact with each other.
上記目的は、複数の半導体チップを有するマルチチップ
モジュールにおいて、それぞれの半導体チップに対応す
る熱伝導体の中で、隣接する半導体チップ領域の熱伝導
体の間にばねを挿入する方法でスペースを確保して、熱
伝導体とハウジングのフィンの接触を確実なものとする
ことにより、達成される。The above purpose is to secure space in a multi-chip module having multiple semiconductor chips by inserting a spring between the heat conductors in adjacent semiconductor chip areas among the heat conductors corresponding to each semiconductor chip. This is achieved by ensuring the contact between the heat conductor and the fins of the housing.
個々の半導体領域には熱伝導体と半導体チップが接触す
るためのばねを入れる。また、隣接する半導体チップ領
域の熱伝導体同士にばねを入れることで、この互いに及
ぼし合う反発力を利用し、ハウジングと熱伝導体の接触
が確実なものとなる。A spring is placed in each semiconductor region so that the thermal conductor and the semiconductor chip come into contact with each other. Furthermore, by inserting springs between the thermal conductors in adjacent semiconductor chip regions, the repulsive forces exerted on each other are utilized to ensure reliable contact between the housing and the thermal conductors.
以下１本発明の一実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
基板１には、半導体チップ２が複数個搭載される。A plurality of semiconductor chips 2 are mounted on the substrate 1.
各半導体チップ２のそれぞれに熱伝導体３をばね５の弾
性力によって押しつけている。熱伝導体３１よ複数枚の
熱伝導体フィン７を持ち、ハウジング４に設けたハウジ
ングフィン８と微小すきま９を介してかみあっている。A thermal conductor 3 is pressed against each semiconductor chip 2 by the elastic force of a spring 5. The heat conductor 31 has a plurality of heat conductor fins 7, which are engaged with housing fins 8 provided on the housing 4 through a minute gap 9.
ここで、横方向の力が存在しなければ、熱伝導体フィン
７とハウジングフィン８が接触せず、結果として伝熱性
能の低下を招き得る。そこで、隣接する熱伝導体３の間
にばね６を挿入することで横方向の力を作り、熱伝導体
フィン７とハウジングフィン８の圧接が確実なものとな
る。Here, if there is no lateral force, the heat conductor fins 7 and the housing fins 8 will not come into contact with each other, which may result in a reduction in heat transfer performance. Therefore, by inserting the spring 6 between the adjacent heat conductors 3, a lateral force is created, and the press contact between the heat conductor fins 7 and the housing fins 8 is ensured.
本実施例によれば、半導体チップからハウジング上面に
至る熱の流路の過程にすきまを持たない構造となり、伝
熱性能の向上の効果がある。According to this embodiment, the structure is such that there is no gap in the heat flow path from the semiconductor chip to the upper surface of the housing, which has the effect of improving heat transfer performance.
本発明によれば、伝熱性能を改善できるので、半導体チ
ップのジャンクション温度を低くでき、半導体の温度に
対する動作マージンの確保、信頼性の向上等が得られ、
ひいては装置全体の信頼性の向上等の効果がある。According to the present invention, the heat transfer performance can be improved, so the junction temperature of the semiconductor chip can be lowered, an operating margin with respect to the semiconductor temperature can be secured, reliability can be improved, etc.
This also has the effect of improving the reliability of the entire device.
図は本発明の一実施例の正面図である。
１・・・基板、２・・・半導体チップ、３・・・熱伝導
体。
４・・・ハウジング、５・・・ばねａ、６・・・ばねす
、７・・・熱伝導体フィン、８・・・ハウジングフィン
、９・・・微小すきま。
、５−１ｊね工The figure is a front view of one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Semiconductor chip, 3...Heat conductor. 4...Housing, 5...Spring a, 6...Spring, 7...Heat conductor fin, 8...Housing fin, 9...Minute gap. , 5-1j construction
Claims (1)
体に接触する熱伝導体を介してハウジングへ伝え外部に
逃がす冷却構造において、隣接する半導体チップ各々に
対応する熱伝導体の間に、互いに反発力を及ぼし合うよ
うばねを挿入し、この力で各熱伝導体をハウジングに接
触させることを特徴とするマルチチップモジュールの冷
却構造。1. In a cooling structure in which heat generated by a plurality of semiconductor chips is transmitted to the housing via heat conductors in contact with the individual semiconductors and released to the outside, a heat conductor is placed between the heat conductors corresponding to each adjacent semiconductor chip. A multi-chip module cooling structure characterized by inserting springs so that they exert repulsive forces on each other, and using this force to bring each thermal conductor into contact with the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62323937A JPH01166544A (en) | 1987-12-23 | 1987-12-23 | Cooling structure for multi-chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62323937A JPH01166544A (en) | 1987-12-23 | 1987-12-23 | Cooling structure for multi-chip module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01166544A true JPH01166544A (en) | 1989-06-30 |
Family
ID=18160294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62323937A Pending JPH01166544A (en) | 1987-12-23 | 1987-12-23 | Cooling structure for multi-chip module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01166544A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6780531B2 (en) | 2000-10-31 | 2004-08-24 | Hitachi Maxell, Ltd. | Magnetic recording medium comprising a magnetic layer having specific surface roughness and protrusions |
| KR100703874B1 (en) * | 2005-09-07 | 2007-04-04 | (주)파도시스템 | A structure of heatsink plate for embedded system being fixed on a inner wall |
| WO2017200630A1 (en) * | 2016-05-18 | 2017-11-23 | Raytheon Company | Expanding thermal device and system for effecting heat transfer within electronics assemblies |
-
1987
- 1987-12-23 JP JP62323937A patent/JPH01166544A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6780531B2 (en) | 2000-10-31 | 2004-08-24 | Hitachi Maxell, Ltd. | Magnetic recording medium comprising a magnetic layer having specific surface roughness and protrusions |
| KR100703874B1 (en) * | 2005-09-07 | 2007-04-04 | (주)파도시스템 | A structure of heatsink plate for embedded system being fixed on a inner wall |
| WO2017200630A1 (en) * | 2016-05-18 | 2017-11-23 | Raytheon Company | Expanding thermal device and system for effecting heat transfer within electronics assemblies |
| US10292255B2 (en) | 2016-05-18 | 2019-05-14 | Raytheon Company | Expanding thermal device and system for effecting heat transfer within electronics assemblies |
| US10887978B2 (en) | 2016-05-18 | 2021-01-05 | Raytheon Company | Expanding thermal device and system for effecting heat transfer within electronics assemblies |
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