JPH02270103A - Manufacture of magnetic head - Google Patents

Abstract

PURPOSE:To easily handle an object to be ground in a grinding process, and to prevent yield decrease by cutting a magnetic block into magnetic head wafers having a desired width and plural coil windows, eliminating a deformed layer on a cut surface, and cutting the wafer into the magnetic heads with a single coil window. CONSTITUTION:After the process to form a magnetic block 3, the process to cut the block to magnetic wafers 7 respectively being equipped with the desired width and plural coil windows 4, the process to eliminate the work deformed layer on a cut surface 6, and the process to divide the magnetic wafer 7 into the magnetic head respectively being equipped with a single coil window are carried out. Thus the process to handle the small magnetic head is eliminated, a working time is shortened (by 1/3 as usual), and a full-out rate due to a mis- handling is reduced (by 1/10 as usual).

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a magnetic head used in a magnetic recording/reproducing device.

[Conventional technology]

As shown in FIG. 2, the conventional method for manufacturing a magnetic head is to cut a magnetic block having a plurality of coil winding grooves parallel to the coil winding grooves, and cut one coil winding groove. The method involved forming a single magnetic head block with grooves, cutting the single magnetic head block to a desired thickness, and then polishing it to remove a layer damaged by cutting.

[Problem to be solved by the invention]

However, in the above-mentioned conventional technology, since the magnetic head is polished after cutting the magnetic head from a single magnetic head block, there are many defects due to handling due to the small size of the magnetic head during the polishing process, which reduces the yield. The problem was that the Furthermore, as magnetic recording devices become smaller in the future, there will be a demand for smaller magnetic heads, and it is thought that handling of magnetic heads will become increasingly difficult.

SUMMARY OF THE INVENTION The present invention is intended to solve these problems, and its purpose is to facilitate the handling of the polished object in the polishing process for removing the damaged layer generated in the magnetic head cutting process, and to improve the yield. The purpose is to prevent the decline.

[Means to solve the problem]

The method for manufacturing a magnetic head of the present invention includes the steps of providing a plurality of coil winding grooves in at least one of the two magnetic members, and joining the two magnetic members using a joining member. a step of joining to obtain a magnetic block; a step of separating the magnetic block into a single magnetic head block having a plurality of single coil winding grooves; and a step of forming the single magnetic head block into a desired thickness. In a method for manufacturing a magnetic head, which includes a step of cutting to obtain a magnetic head, and a polishing step to remove a process-affected layer on the cut surface of the magnetic head, after the step of forming the magnetic block, a desired thickness is formed. cutting the magnetic head wafer into magnetic head wafers each having a plurality of coil winding windows; removing a process-affected layer on the cut surface of the magnetic head wafer; and cutting the magnetic head wafer into one coil winding window. The method is characterized in that it includes a step of dividing the magnetic head into magnetic heads each having a line window.

〔Example〕

FIGS. 1(a) to 1(f) are perspective views of one embodiment of a method for manufacturing a magnetic head according to the present invention. The magnetic material in this example uses Mn-Zn polycrystalline ferrite.

As shown in FIG. 1(a), a magnetic body 1 having a plurality of coil winding grooves 4 and another magnetic body 2 are bonded together using a bonding member 5 to form a magnetic head block 3. In this example, low melting point glass is used as the bonding member, and approximately 7
Bonded at 00°C. Next, the magnetic head block 3 is cut by a dicing machine or the like along the dotted line 6 shown in FIG. 1(b) to obtain a magnetic helad wafer 7 as shown in FIG. 1(c). In this embodiment, this magnetic head wafer 7 is provided with three windows for coil winding, and is therefore later separated into three magnetic heads.

Next, as shown in FIG. 1(d), a plurality of the magnetic helad wafers 7 are pasted onto a polishing jig 8 using wax or the like, and polished to remove the damaged layer during cutting. Let's do it. This polishing is performed using diamond abrasive grains, and the grain size of the abrasive grains is divided into three stages: 3mm, 1mm, and 1/4m+*. After this polishing, the magnetic rad wafer 7 is removed from the polishing jig, and is again attached to the polishing jig 8 and polished in order to remove the damaged layer on the cut surface on the opposite side. After polishing both cut surfaces of the magnetic head (1-7), it is separated along the dotted line 9 shown in FIG. 1(e), and a magnetic head 1 as shown in FIG. 1(f) is prepared.
Get 0.

Magnetic held wafer 7 shown in FIG. 1(c) in this example
The work of pasting the wafer to the polishing jig 8 shown in FIG. 1(d) is mainly done manually using tweezers, but in this embodiment, since the magnetic helad wafer 7 is larger than the magnetic head 10, the work is performed by a robot. is being carried out.

In this embodiment, the coil winding groove 4 is provided only in one of the magnetic members 1, but it is also possible to provide it in both magnetic members.

Further, in this embodiment, there are three coil winding grooves 4, but it is also possible to have more than three grooves and increase the number of grooves.

Furthermore, in the cutting process of the magnetic helad wafer 7 from the magnetic head block 3 shown in FIG. It is also possible to use it, and it is possible to cut it with a -bracket.

〔Effect of the invention〕

As described above, according to the present invention, the steps include providing a plurality of coil winding grooves in at least one of the two magnetic members, and joining the two magnetic members using a joining member. a step of joining to obtain a magnetic block; a step of separating the magnetic block into a single magnetic head block having a plurality of single coil winding grooves; and a step of forming the single magnetic head block into a desired thickness. In a method for manufacturing a magnetic head, which includes a step of cutting to obtain a magnetic head, and a polishing step to remove a process-affected layer on the cut surface of the magnetic head, after the step of forming the magnetic block, a desired thickness is formed. cutting the magnetic head wafer into magnetic head wafers each having a plurality of coil winding windows; removing a process-affected layer on the cut surface of the magnetic head wafer; and cutting the magnetic head wafer into one coil winding window. By including the process of dividing the magnetic head into magnetic heads equipped with wire windows, there is no need to handle small magnetic heads as in the past, reducing work time (1/3 of the conventional time) and causing defects due to handling errors. This has the effect of reducing the rate (1/10 of the conventional rate).

Furthermore, since the object to be worked on (magnetic head wafer) is large, it can be held by a machine and manual work can be eliminated, which has the effect of improving workability and saving labor.

As described above, the present invention has many effects.

[Brief explanation of drawings]

FIGS. 1(a) to 1(C), FIGS. 1(e) and 1(f) are perspective views showing a manufacturing method of an embodiment according to the present invention, but only FIG. 1(d) is a plan view. FIGS. 2(a) to 2(f) are perspective views of the manufacturing method according to the prior art. However, only FIG. 2(e) is a plan view. 1...Magnetic member 2...Magnetic material Member 3... Magnetic head block 4... Coil winding groove 5... Joining member 6... Dotted line for cutting 7... Magnetic head wafer 8... Polishing jig 9... Cutting Dotted line 10...Magnetic head 11...Single magnetic head block 12...Magnetic head before polishing Applicant Seiko Epson Corporation Representative Patent attorney Kizobe Suzuki (1 other person) Torida 1F
7<a whistle diagram 1 (b) Tasa 1 Shiri (child) I Figure 2 (b)

Claims (1)

[Claims] a step of providing a plurality of coil winding grooves in at least one of the two magnetic members; a step of joining the two magnetic members using a joining member to obtain a magnetic block; A step of separating the magnetic material block into a plurality of single magnetic head blocks, a step of cutting the single magnetic head block to a desired thickness to obtain a magnetic head, and a step of removing a process-affected layer on the cut surface of the magnetic head. In a method of manufacturing a magnetic head including a polishing step for removal, after the step of forming the magnetic material block, the magnetic head wafer is cut into magnetic head wafers having a desired thickness and having a plurality of windows for coil winding. a step of removing a process-affected layer on a cut surface of the magnetic head wafer; and a step of dividing the magnetic head wafer into magnetic heads each having one coil winding window. A method of manufacturing a magnetic head.