JPH04117605A - Manufacture of magnetic head - Google Patents

Abstract

PURPOSE:To reduce the number of operations, and to improve an ingot utilizing efficiency by dividing a discoid ferrite wafer directly segmented from the ingot into almost two, and working a wounding groove, glass filling groove, and track groove on the semicicular ferrite wafer. CONSTITUTION:A discoid ferrite wafer 100 is divided into almost two, almost semicircular ferrite wafers 1A and 1B are combined with a base 101 and adhered to it, and a wounding groove and glass groove 200 are worked at the one semicircular ferrite wafer 1A. And also, a track groove 300 is worked at the both semicircular ferrite wafers 1A and 1B. Then, a film is fixed to the one semicircular ferrite wafer 1A, the other semicircular ferrite wafer 1B and the track groove 300 are made coincident, adhered, and integrated, plural blocks 400 are segmented by cutting it in the direction of the wounding groove 200, and the plural blocks 400 are sliced in the direction crossing the winding groove 200 in order to prepare a head chip 500. Thus, the number of operations can be reduced, and the ingot utilizing efficiency can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing a magnetic head used in a video tape recorder (hereinafter referred to as VTR) and the like.

(Prior Art) When manufacturing a magnetic head for a VTR, the steps shown in FIG. 4 are used.

Disc-shaped ferrite wafer 1 cut out from an ingot
0 (FIG. 2(a)) is cut into rectangles of a predetermined size. Among these divided wafers, two ferrite wafers 10a and 10b are pasted on one base 2o ((b) in the same figure), and the four sides are cut off to adjust the shape ((c) in the same figure). .

A winding groove and a glass groove 30 are formed in one ferrite core, and then track grooves 40 are formed in both ferrite wafers (FIG. 4(d)).

Once the track grooves 40 have been processed, the wafer is removed from the base, cleaned, and coated with a film to form gaps on the wafer on which the winding grooves and glass grooves 30 have been formed ((e) in the same figure). .

After the film is attached, the two sheets are pasted together, and the track grooves are aligned and bonded with glass (f in the same figure).

After bonding the glass, it is divided into blocks ((g) in the same figure).
The sliding surface side of the chip of each block is polished into a curved surface ((h) in the same figure. Once the curved surface is finished, slicing is performed along the track groove of the block to cut out the chip ((i) in the same figure). ).

(Problems to be Solved by the Invention) According to the conventional magnetic head manufacturing method described above, in the process, a disk-shaped ferrite wafer is made from an ingot, and then the square ferrite wafer is cut again. For this reason, the number of steps is large, and a lot of parts are wasted due to cutting the ingot.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a magnetic head that can reduce the number of steps and improve the efficiency of ingot use.

[Structure of the Invention] (Means for Solving the Problems) The present invention includes a step of dividing a disk-shaped ferrite wafer directly cut out from an ingot into approximately 1/2, and a process of dividing the thus obtained first and second wafers into two parts. The process of assembling and pasting the approximately semicircular ferrite wafers on the base, processing winding grooves and glass filling grooves on one semicircular ferrite wafer, and forming both semicircular ferrite wafers/\- a step of forming track grooves on the ferrite wafer, a step of applying a film to one of the semicircular ferrite wafers processed as described above, aligning the track grooves with the other semicircular ferrite wafer, and abutting the track grooves with adhesive; Ueno integrated in the process)
The process of cutting out multiple blocks by force and twisting the body in the direction of the winding groove, and the blocks cut out in this process,
This process includes the step of finishing the tape sliding surface side with a curved surface, and the step of slicing the block obtained in this step in a direction intersecting the winding groove to obtain a head chip.

(Function) By the above means, the process of making the ferrite wafer into a square shape is eliminated. In addition, rectangular ferrite wafers were inconvenient to work with due to their small size, but since the large-area semi-disc-shaped wafers can be used for subsequent processing, large-volume processing can be easily performed and ingot usage efficiency can be improved. .

(Example) Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment of the invention. A disk-shaped ferrite wafer 100 is wrapped to a predetermined thickness and attached to a base 101. Next, ferrite wafer 1
It is cut at a position slightly shifted from the center line in the diametrical direction of 00, and divided into halves ((a) and (b) in the same figure).

Next, the divided ferrite wafer IA.

A winding groove and a glass groove 200 are machined in the diametrical direction on one of the IB surfaces having a larger area (FIG. 2(C)). After this groove processing, track grooves 300 are processed across both ferrite wafers IA and IB (FIG. 2(d)). Also, on the ferrite wafer IA on which the winding grooves and glass grooves 200 have been formed. Gap A film is applied to obtain the desired part.

After this, ferrite wafer IA, 1B is attached to base 101.
The track grooves 300 of the ferrite wafers are aligned, and the butted winding grooves and glass grooves 200 are filled with glass and bonded to integrate the two (see figure (e)). f)).

At this time, since the center of the wafer is shifted when it is divided into 1/2, a step is created in the radial direction on the outer periphery of the two bonded ferrite wafers.

The wafer after pasting is cut along the direction of the winding groove. As a result, a large number of blocks 400 can be obtained ((g) in the same figure).

In this case, the lengths of the blocks in the winding groove direction are different from each other.

Each of these blocks 400 is finished with a curved surface by grinding the portion that will become the tape sliding surface (see figure (h)
)). In this case, since the block has a step, the depth can be read from the side of the block.
The reading for the difference in level is acceptable. Conventionally, it was possible to read only the narrow cross-sectional area of the glass groove from the end face of the block, but with this method, the exposed area of the glass groove is wide due to the step. Therefore,
Work when finishing curved surfaces is also easy.

The curved block is pasted on a base (not shown) and sliced along the track grooves (see figure (i)
)). As a result, the head chip 5 as shown in FIG.
00 can be obtained.

Although the winding groove and the glass groove are not distinguished in detail, as shown in FIG.
A portion 501 formed like a notch at the rear of 00 is a glass groove, which is filled with glass to join the two core halves.

The invention is not limited to the above embodiments.

In the above example, ferrite wafers IA and IB with the same crystal orientation were used, but when using ferrite wafers with different orientations and obtaining core half-break, as shown in Fig. The ferrite wafers 2A and 3A may be combined and attached to the base 101 (as shown in the figure).
a), (b). Then, the ferrite wafers 2A and 2B are prepared by processing them so that their center lines are shifted (FIG. 2(c)). The subsequent processing is the same as the processing described above.

Note that, assuming that blocks with small block lengths are not used, as shown in FIG. 3, after forming the winding groove, glass groove, and track groove, the ferrite wafers IA, I
Cut off the ends 4A and 4B of B ((a) in the same figure).
, the subsequent processing (FIG. 6(b)) may proceed.

[Effects of the Invention] As described above, according to the present invention, the number of steps can be reduced, the efficiency of ingot use can be improved, and the work at the time of finishing a curved surface can be facilitated.

In addition, since large-area wafers are handled, workability for mass production is good.

[Brief explanation of the drawing]

Fig. 1 is a process explanatory diagram showing one embodiment of the present invention, Figs. 2 and 3 are diagrams shown to explain other embodiments of the invention, respectively, and Fig. 4 is a diagram showing a conventional manufacturing process. It is a figure shown for explanation. 100...Disc-shaped ferrite wafer 101...
Base, IA, IB... Ferrite Urchin I\-200
...Winding groove, glass groove, 300...Track groove, 4
00...Block.

Claims (1)

[Claims] A step of dividing a disk-shaped ferrite wafer directly cut out from an ingot into approximately 1/2, and combining the first and second approximately semicircular ferrite wafers obtained in this way into a base. a step of pasting, a step of machining a winding groove and a glass filling groove on one semicircular ferrite wafer, a step of machining a track groove on both semicircular ferrite wafers, and a step of machining one of the semicircular ferrite wafers as described above. The process includes applying a film to one semicircular ferrite wafer, aligning the track grooves with the other semicircular ferrite wafer, and bonding them together, and cutting the integrated wafer body in this process in the direction of the winding groove. A process of cutting out multiple blocks, a process of finishing the blocks cut out in this process with a curved surface on the tape sliding contact side, and slicing the blocks obtained in this process in a direction intersecting the winding groove. 1. A method for manufacturing a magnetic head, comprising the step of: obtaining a head chip.