JPH02266554A - Integrated circuit package - Google Patents

Abstract

PURPOSE:To effectively connect a pin at the time of surface mounting by providing a substrate having a semiconductor element therein and many I/O pins protruding at one side, and a holder provided at the substrate and made of an insulator for protecting the base ends of the pins. CONSTITUTION:A ceramic substrate 11 having a semiconductor element therein is wholly formed in a planely rectangular shape, and many I/O pins 12 protruding downward are provided at one side. A flat platelike holder 13 is provided at the pin protruding side of the substrate 11, the whole body is formed of an insulator made, for example, of ceramics to protect the base ends of the pins 12, and the outer ends can be set to a size such as a length l, etc. Accordingly, when it is surface mounted on the pads of a printed circuit board by the holder 13, it can prevent the pins 12 from bending. Thus, since the end positions of the pins can be aligned, pin connection at the time of surface mounting can be effectively performed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit package suitable for use in, for example, PG8 (bin grid array).

[Conventional technology]

In recent years, as LSIs have become more highly integrated and faster, the number of input/output pins for access has increased, and as a result, the number of bins of integrated circuit packages that house LSIs has also increased.

Conventionally, this type of integrated circuit package has been adopted as shown in FIG. This will be explained based on the same figure. In the same figure, what is indicated by reference numeral 1 is a ceramic substrate having an LSI (not shown) therein and from which a large number of I/O pins 2 protrude, for example.

The buff cage configured in this way is surface mounted, for example, by connecting 170 bins 2 to each pad (not shown) on a printed wiring board (not shown).

[Problem to be solved by the invention]

By the way, in conventional integrated circuit packages, when the number of I/O pins 2 protruding downward from the ceramic substrate 1 increases (in the case of having 100 or more I/O pins 2), the problem of surface mounting as shown in FIG. As shown in FIG. 2, the I/O pins 2 became easily bent, and variations occurred in the accuracy of the tip position of each 1/O pin 2. This cannot be ignored due to warpage, especially when the package size is increased (in the case of a package size with vertical and horizontal dimensions of 30 m or more). As a result, during surface mounting, the connection between the I/O pins 2 and the printed wiring board (not shown) cannot be reliably established, resulting in a problem that reliability in package mounting is reduced.

Incidentally, in the case of an integrated circuit package having a small number of bins and a small package external shape, surface mounting becomes possible by increasing the design margin of the printed wiring board.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an integrated circuit package that can reliably connect bins during surface mounting, thereby improving the reliability of package mounting. be.

[Means to solve the problem]

An integrated circuit puff cage according to the present invention includes a substrate having a semiconductor element therein and a large number of I/O pins protruding from one side;
The device is provided with a holder made of an insulator that is provided on the substrate and protects the base end portion of the I/O pin.

[For production]

In the present invention, the holder allows I/O during surface mounting.
It is possible to prevent the O pin from bending.

[Example] Hereinafter, the configuration of the present invention will be explained in detail by referring to an example shown in the drawings.

FIG. 1 is a perspective view showing an integrated circuit package according to the present invention, and FIGS. 2 and 3 are the same (front views showing main parts of the integrated circuit package according to the present invention).
The reference numeral 11 is a ceramic substrate having a semiconductor element (not shown) such as an LSI inside it, and the whole is formed into a rectangular shape in a plan view, and the negative side (back side) has a large number of holes projecting downward. 170 bins 12 are provided. 1
Reference numeral 3 denotes a flat plate-shaped holder, which is provided on the bottle protruding side of the ceramic substrate 11, and is entirely formed of an insulator made of ceramic, for example. This holder 13 protects each proximal end of the I10 pin 12 and allows each external tip to be set to the same size of length l.

In the integrated circuit pancase configured in this way,
When surface mounting the pad 15 of the printed wiring board 14 using the holder 13 as shown in FIG.
This can prevent the pin 12 from bending.

Therefore, in this embodiment, since the tip positions of the 1/O pins 2 can be aligned, it is possible to reliably connect the pins during surface mounting.

In this case, if the I10 pin 12 is inserted into the holder 13 in advance during puff cage manufacture, the externally exposed end length and tip position accuracy of the I/O pin 12 can be adjusted.

Furthermore, in this embodiment, the ability to control the bending of the I/O pin 2, the length of the externally exposed end portion, and the accuracy of the tip position is achieved by using printed wiring! I/O pin 12 for '1lFi14
The soldering properties of this material are improved.

In this embodiment, ceramic is used as the material for the holder 13, but the present invention is not limited to this. For example, organic resins such as Teflon or polyimide may be used. In the case of package surface mounting, soldering is temperature resistant.2 It has relatively high mechanical strength, easy physical and chemical processing, and it absorbs the difference in thermal expansion coefficient with the printed wiring board. There are advantages such as being able to

Furthermore, in the present invention, if the holder 13 is made of a material that can be dissolved and etched with a solvent or the like, it can be removed after the pancage is surface-mounted on a printed wiring board (not shown).

Incidentally, the length of the I/O pin I2 in the present invention is designed to alleviate the thermal stress caused by the difference in coefficient of thermal expansion between the ceramic substrate 11 and the printed wiring board 14.

〔Effect of the invention〕

As explained above, according to the present invention, there is provided a substrate having a semiconductor element therein and a large number of I/O pins protruding from one side;
Since the substrate is provided with a holder made of an insulator that protects the base end of the I/O pin, the holder can prevent the I/O pin from bending during surface mounting. Therefore, since the positions of the tips of each of the 110 pins can be aligned, it is possible to reliably connect the pins during surface mounting, and to improve reliability in package mounting.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an integrated circuit package according to the invention, FIGS. 2 and 3 are front views showing main parts of the integrated circuit package according to the invention, and FIG. 4 is an integrated circuit package on a printed wiring board. A cross-sectional view showing an example of implementation of
FIG. 5 is a front view showing an example of a defective conventional integrated circuit package. 11... Ceramic board, 12... Tsukasa 10 pin,
13...Holder, 14...Printed wiring board. Patent applicant: NEC Corporation

Claims (1)

[Claims] A substrate having a semiconductor element therein and a large number of I/O pins protruding from one side, and a holder made of an insulator provided on the substrate and protecting the base ends of the I/O pins. An integrated circuit package featuring: