JPH0226399B2 - - Google Patents
Info
- Publication number
- JPH0226399B2 JPH0226399B2 JP14483984A JP14483984A JPH0226399B2 JP H0226399 B2 JPH0226399 B2 JP H0226399B2 JP 14483984 A JP14483984 A JP 14483984A JP 14483984 A JP14483984 A JP 14483984A JP H0226399 B2 JPH0226399 B2 JP H0226399B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- manufacturing
- pattern wiring
- stud
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14483984A JPS6124298A (ja) | 1984-07-12 | 1984-07-12 | 多層プリント板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14483984A JPS6124298A (ja) | 1984-07-12 | 1984-07-12 | 多層プリント板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6124298A JPS6124298A (ja) | 1986-02-01 |
| JPH0226399B2 true JPH0226399B2 (cg-RX-API-DMAC7.html) | 1990-06-08 |
Family
ID=15371629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14483984A Granted JPS6124298A (ja) | 1984-07-12 | 1984-07-12 | 多層プリント板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6124298A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0534138Y2 (cg-RX-API-DMAC7.html) * | 1987-04-17 | 1993-08-30 | ||
| JP3057924B2 (ja) * | 1992-09-22 | 2000-07-04 | 松下電器産業株式会社 | 両面プリント基板およびその製造方法 |
-
1984
- 1984-07-12 JP JP14483984A patent/JPS6124298A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6124298A (ja) | 1986-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0469308B1 (en) | Multilayered circuit board assembly and method of making same | |
| US7491896B2 (en) | Information handling system utilizing circuitized substrate with split conductive layer | |
| US4854040A (en) | Method of making multilayer pc board using polymer thick films | |
| US6284982B1 (en) | Method and component for forming an embedded resistor in a multi-layer printed circuit | |
| JPH05327211A (ja) | 多層フレキシブルプリント基板およびその製法 | |
| JP2002324962A (ja) | インダクタ内蔵のプリント配線板及びその製造方法 | |
| JPS59175796A (ja) | 多層印刷配線板の製造方法 | |
| JPH0226399B2 (cg-RX-API-DMAC7.html) | ||
| EP0572232A2 (en) | A multilayer printed circuit board and method for manufacturing same | |
| CN217088243U (zh) | 一种镍磷方阻材料混压的多层盲孔微波板 | |
| JPH04168794A (ja) | 多層プリント配線板の製造方法 | |
| JPH02237142A (ja) | 半導体搭載用基板の製造方法 | |
| EP1259102B1 (en) | Multi-layer printed circuit bare board enabling higher density wiring and a method of manufacturing the same | |
| KR20080051085A (ko) | 다층 프린트 배선판 및 그 제조방법 | |
| JPH0818228A (ja) | 多層プリント配線板の製造方法 | |
| JP2006134927A (ja) | 段差回路形成方法とその配線基板 | |
| JPH0799376A (ja) | プリント配線基板 | |
| JPS59232491A (ja) | 多層印刷配線板の製造方法 | |
| JPH03211897A (ja) | 多層型ブラインドスルホール配線板の製造方法 | |
| JPH08274416A (ja) | プリント配線板及びその製造方法 | |
| JPS59232492A (ja) | 多層印刷配線板の製造方法 | |
| JPH0521960A (ja) | 多層プリント配線板およびその製造方法 | |
| JPH02153594A (ja) | 多層プリント配線板の製造方法 | |
| JPS6347158B2 (cg-RX-API-DMAC7.html) | ||
| JPH04278600A (ja) | 多層プリント配線板の製造方法 |