JPH02260384A - Connection of hybrid integrated circuit - Google Patents
Connection of hybrid integrated circuitInfo
- Publication number
- JPH02260384A JPH02260384A JP8207989A JP8207989A JPH02260384A JP H02260384 A JPH02260384 A JP H02260384A JP 8207989 A JP8207989 A JP 8207989A JP 8207989 A JP8207989 A JP 8207989A JP H02260384 A JPH02260384 A JP H02260384A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- substrate
- thermal expansion
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 239000012798 spherical particle Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 229910000906 Bronze Inorganic materials 0.000 abstract description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010974 bronze Substances 0.000 abstract description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 3
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 230000005496 eutectics Effects 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 229920001721 polyimide Polymers 0.000 abstract description 3
- 239000009719 polyimide resin Substances 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 6
- 239000013078 crystal Substances 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、回路パターンを有するセラミック基板にリー
ドフレームを半田接合し、その周囲を樹脂で被覆した混
成集積回路の接合方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for joining a hybrid integrated circuit in which a lead frame is soldered to a ceramic substrate having a circuit pattern and the periphery thereof is covered with resin.
（従来の技術）
回路パターンを有するセラミックか樹脂基板に外部回路
の入出力のためリードフレームを半田付けする混成集積
回路において、外部回路へのリードフレーム取付けの際
に再度半田付けにより加わる熱の昇温くより、取付けた
リードフレームの半田付は部分が昇温しで半田が溶融し
、リードフレームがずれてしまう不具合を防止するため
エポキシ樹脂などで半田取付部分を固定した構成がある
。(Prior art) In a hybrid integrated circuit in which a lead frame is soldered to a ceramic or resin substrate having a circuit pattern for inputting/outputting an external circuit, heat increases due to re-soldering when the lead frame is attached to the external circuit. In order to prevent the soldering part of the attached lead frame from rising in temperature and causing the solder to melt and cause the lead frame to shift, the soldered part is fixed with epoxy resin or the like.
（発明が解決しようとする課題）
従来この種のものにおいては、ＰＣ板など外部回路基板
へ混成集積回路のリードフレームを挿入し、半田浸漬槽
へ浸漬し半田付けする際、リードフレームを介して伝わ
った熱により混成集積回路基板の取付部分が急徴に昇温
し強固な接合力を有する固定樹脂層が膨張して、基板と
回路パターンが剥離するという不具合があった。また、
この不具合を避けるために、基板とリードフレームを取
付ける半田の材料を、例えば、錫５％、鉛９５％の高温
半田材料を使用するなどの方法が採られている。この場
合でも、リードフレームの接合時の昇温により予め銀２
０％、鉛３６％、錫６２％の共晶半田材料で取付けたＩ
Ｃ，トランジスタ、チップコンデンサなどの電気部品が
再溶融して位置がずれたり、熱衝撃によりクラックが発
生するなどの不具合を生じることがあった。(Problem to be Solved by the Invention) Conventionally, in this type of device, when a lead frame of a hybrid integrated circuit is inserted into an external circuit board such as a PC board and dipped in a solder dipping bath for soldering, the lead frame is Due to the transferred heat, the temperature of the mounting portion of the hybrid integrated circuit board suddenly rises, causing the fixed resin layer, which has strong bonding strength, to expand, causing the circuit pattern to separate from the board. Also,
In order to avoid this problem, a method has been adopted in which a high temperature solder material containing 5% tin and 95% lead is used as the solder material for attaching the board and the lead frame. Even in this case, due to the temperature increase during lead frame bonding, silver 2
I attached with eutectic solder material of 0%, 36% lead, and 62% tin.
In some cases, electric components such as C, transistors, and chip capacitors may be remelted and displaced, or cracks may occur due to thermal shock.
（課題を解決するための手段）
本発明は、これらの欠点を解決するため、基板へリード
フレームを半田接合してから、固定する樹脂に高い比率
で含有する酸化アルミニウムをフィラーとした樹脂を使
用することを特徴とし、その目的は熱伝導性の改善と熱
膨張係数の抑制により外部基板へ取付ける際の昇温によ
っても基板と導体回路パターンに剥離を生じない混成集
積回路を提供するにある。(Means for Solving the Problems) In order to solve these drawbacks, the present invention uses a resin containing a high proportion of aluminum oxide filler in the resin to be fixed after soldering the lead frame to the board. The purpose is to provide a hybrid integrated circuit which does not cause peeling between the substrate and the conductor circuit pattern even when the temperature rises during attachment to an external substrate by improving thermal conductivity and suppressing the coefficient of thermal expansion.
（実施例）
図は本発明の詳細な説明図で、さらには回路パターンを
有するセラミック基板１ヘリードフレーム３を取付は固
定用樹脂を被覆した部分の断面図である。セラミック基
板１の表面に設けた銀パラジウムなどの厚膜材料による
取付ランド２とセラミック基板１へ外部回路との取付け
のため燐青銅などの材質から成るリードフレーム８を挟
持するように挿入し、銀２％、鉛８６％、錫６２％の共
晶半田４で接合する。更に、酸化アルミニウムを含むエ
ポキシ樹脂あるいはポリイミド樹脂の固定用樹脂５を半
田取付部分を全て被覆する領域まで塗布する。かかる構
成の混成集積回路のリードフレームを外部回路であるＰ
Ｃ板などへ挿入し、半田付けする際にリードフレームへ
伝搬する熱量６はリードフレーム接合部分へと伝わるが
、熱伝導性のよい酸化アルミニウム粉末によりセラミッ
ク基板１の樹脂接合面、全般に伝搬し、局部的な昇温を
抑制することが出来る。(Example) The figure is a detailed explanatory view of the present invention, and is also a sectional view of a portion where a lead frame 3 is attached to a ceramic substrate 1 having a circuit pattern and coated with a fixing resin. A lead frame 8 made of a material such as phosphor bronze is inserted between a mounting land 2 made of a thick film material such as silver palladium provided on the surface of the ceramic substrate 1 and a lead frame 8 made of a material such as phosphor bronze to attach an external circuit to the ceramic substrate 1. 2%, lead 86%, and tin 62% eutectic solder 4. Furthermore, a fixing resin 5 of epoxy resin or polyimide resin containing aluminum oxide is applied to an area that completely covers the solder attachment portion. The lead frame of a hybrid integrated circuit having such a configuration is used as an external circuit P.
The amount of heat 6 that is transmitted to the lead frame when it is inserted into a C board etc. and soldered is transmitted to the lead frame joint part, but due to the aluminum oxide powder, which has good thermal conductivity, it is prevented from being transmitted to the resin joint surface of the ceramic board 1 in general. , local temperature rise can be suppressed.
また、酸化アルミニウムの添加は固定用樹脂５の熱膨張
係数を低下させ、樹脂とセラミック基板１の熱膨張差に
よる剥離力を抑制し、厚膜材料による取付ランド２の破
損を回避することが出来る。Additionally, the addition of aluminum oxide reduces the thermal expansion coefficient of the fixing resin 5, suppresses the peeling force due to the difference in thermal expansion between the resin and the ceramic substrate 1, and can avoid damage to the mounting land 2 due to thick film material. .
さらに付は加えると、樹脂に添加する酸化アルミニウム
は、熱伝導性と熱膨張を抑制するため高い比率の値が効
果的で、重量比で５０％から８０％がよい。５０％以下
の場合は、熱伝導性の効果が例えば、４０％の場合、無
添加のポリイミド樹脂の１．２倍にすぎないが、５０％
で１．８倍の値を得た。一方８０％を超えると樹脂の流
動性が悪くリードフレーム接合部分に被覆した際、空孔
などの不具合を生じ易い。Additionally, a high ratio of aluminum oxide added to the resin is effective in suppressing thermal conductivity and thermal expansion, preferably 50% to 80% by weight. If the thermal conductivity effect is 50% or less, for example, if the thermal conductivity effect is 40%, it is only 1.2 times that of polyimide resin without additives, but if it is 50%
A value of 1.8 times was obtained. On the other hand, if it exceeds 80%, the fluidity of the resin is poor and problems such as voids are likely to occur when coating the joint portion of the lead frame.
また、酸化アルミニウム粉末の形状はアルファ酸化アル
ミニウムで粒径が平均５ミクロンから１０ミクロンの球
状がよく、この現象は球状品が樹脂中において粗密化し
易いためと考えられる。塗布に際しては酸化アルミニウ
ムの比重が４．０と大きく樹脂と分離し易いため、例え
ば、２液の樹脂を混合する際に使用する２分化室を有す
るシリンジを使用したデイスペンサーを使用することが
望ましい。Further, the shape of the aluminum oxide powder is preferably spherical with alpha aluminum oxide particles having an average particle size of 5 to 10 microns, and this phenomenon is thought to be due to the fact that spherical particles tend to become denser in the resin. During application, since the specific gravity of aluminum oxide is 4.0 and it is easy to separate from the resin, it is desirable to use a dispenser that uses a syringe with a bifurcated chamber, which is used when mixing two-part resin, for example. .
塗布の領域はリードフレーム半田接合面を少なくとも全
て被覆し、基板全般への熱の拡散を大とすることが効果
的である。また、この種の取付は方法はセラミック基板
に拘わらず樹脂基板などにも同様の効果を得ることが出
来る。It is effective for the coating area to cover at least the entire solder joint surface of the lead frame to increase heat diffusion to the entire board. Further, this type of mounting method can achieve the same effect not only on ceramic substrates but also on resin substrates and the like.
（発明の効果）
以上説明したように、セラミック基板へリードフレーム
を半田付は接合し、この接合部分を被覆する樹脂に酸化
アルミニウムの粉末を高い値で添加することにより、外
部基板へ半田付けする際の昇温においても高い熱伝導性
による熱拡散効果と低い熱膨張係数による発生歪が少く
リードフレーム接合部分に破損のない混成集積回路を提
供出来る利点がある。(Effects of the Invention) As explained above, a lead frame is soldered to a ceramic board, and by adding a high amount of aluminum oxide powder to the resin that covers this joint part, soldering to an external board is performed. Even when the temperature rises, the heat diffusion effect due to the high thermal conductivity and the low thermal expansion coefficient generate little strain, so there is an advantage that it is possible to provide a hybrid integrated circuit without damage to the lead frame joint portion.
図は本発明の詳細な説明図である。
１・・・セラミック基板、２・・・取付ランド、３・・
・リードフレーム、４・・・半田、５・・・固定用樹脂
、６・・・外部から伝搬する熱量。The figure is a detailed explanatory diagram of the present invention. 1...Ceramic board, 2...Mounting land, 3...
・Lead frame, 4...Solder, 5...Fixing resin, 6...Amount of heat propagated from the outside.
Claims (2)
への接続のためのリードフレームを半田接合した混成集
積回路において、前記セラミック基板とリードフレーム
が接合する部分の表面を重量比で５０％から８０％の値
で酸化アルミニウムを含有する樹脂により被覆したこと
を特徴とする混成集積回路の接合方法。(1) In a hybrid integrated circuit in which a ceramic substrate having a circuit pattern and a lead frame for connection to an external circuit are soldered together, the surface of the part where the ceramic substrate and the lead frame are bonded is 50% to 80% by weight. A method for joining a hybrid integrated circuit, characterized in that the hybrid integrated circuit is coated with a resin containing aluminum oxide with a value of .
粉末の粒径を５ミクロンから１０ミクロンの球状とした
ことを特徴とする混成集積回路の接合方法。(2) A method for bonding a hybrid integrated circuit, characterized in that the aluminum oxide powder according to claim 1 has a spherical particle size of 5 to 10 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8207989A JPH02260384A (en) | 1989-03-31 | 1989-03-31 | Connection of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8207989A JPH02260384A (en) | 1989-03-31 | 1989-03-31 | Connection of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02260384A true JPH02260384A (en) | 1990-10-23 |
Family
ID=13764454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8207989A Pending JPH02260384A (en) | 1989-03-31 | 1989-03-31 | Connection of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02260384A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0532215A2 (en) * | 1991-09-10 | 1993-03-17 | Fujitsu Limited | Electrical connecting method |
-
1989
- 1989-03-31 JP JP8207989A patent/JPH02260384A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0532215A2 (en) * | 1991-09-10 | 1993-03-17 | Fujitsu Limited | Electrical connecting method |
| US5417362A (en) * | 1991-09-10 | 1995-05-23 | Fujitsu Limited | Electrical connecting method |
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