JPH02256029A - Active matrix substrate - Google Patents

Abstract

PURPOSE:To allow the connection of the active matrix substrate and driving circuit via a flexible substrate or the like and to simplify a packaging stage by forming an insulating film on the metallic film patterns connected with at least >=2 signal lines of the switching elements of the active matrix substrate. CONSTITUTION:The metallic film patterns 3 to short the signal lines are formed simultaneously with the formation of input terminals 2 of the signal lines on a glass substrate 10. The insulating film 4 is formed on the patterns 3 simultaneously with the formation of the switching elements. An auxiliary metallic film 5 is formed on the input terminals 2 in order to correct the steps generated by the insulating film 4. The patterns 3 are insulated by the film 4 in this way and, therefore, the contact of the patterns 3 and the flexible substrate is obviated even if the insulating treatment by sticking insulating tapes, etc., is not executed at the time of connecting the active matrix substrate and the driving circuit with the flexible substrate or the like. The packaging stage is thus simplified.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an active matrix substrate used in a liquid crystal display panel.

BACKGROUND OF THE INVENTION In recent years, with the miniaturization of industrial equipment, there has been a demand for thin flat display devices to replace conventional display devices.Among the various flat display devices, display devices using liquid crystals consume less power. It is attracting attention because it is easy to display in full color. In particular, active matrix liquid crystal display panels in which each display pixel is provided with a switching element have excellent display image quality and are therefore being applied to portable televisions and the like.

FIG. 3 is an equivalent circuit diagram showing the structure of a conventional active matrix substrate. In FIG. 3, 51 is a thin film transistor, 52 is a metal film pattern for shorting the signal line, X1 to xII+ are scanning signal lines, Y, to Y
n is a video signal line.

However, active matrix substrates have the problem that static electricity that builds up on the substrate during the manufacturing process destroys the insulation film at the intersections of switching elements and scanning signal lines and video signal lines, resulting in short circuits. Ta. As a measure to prevent damage to the insulating film due to static electricity,
Conventionally, as shown in FIG. 3, a method has been used in which all terminals of an active matrix substrate are short-circuited with a metal film pattern 52, and after assembly into a liquid crystal panel, this metal film pattern 52 is cut.

Problems to be Solved by the Invention However, in the conventional active matrix substrate shown in FIG. 3, the metal film pattern 52 shorting the signal line terminals was exposed on the substrate surface, making it difficult to complete the liquid crystal panel. Later, when connecting the liquid crystal panel and the drive circuit using a flexible substrate or the like, there is a problem that the metal film pattern 52 and the flexible substrate come into contact and short-circuit the signal lines. An insulating tape or the like was placed on top of the metal film pattern 52 to insulate the metal film pattern 52 to prevent contact.

The present invention has been made in view of the above, and an object of the present invention is to provide an active matrix substrate that can prevent short circuits in signal lines due to contact between a metal film pattern and a flexible substrate to prevent breakdown of an insulating film due to static electricity. .

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention is configured such that an insulating film is formed on a metal film pattern connecting at least two signal lines of switching elements of an active matrix substrate. It is.

Effect of the Invention With the above-described configuration, the present invention makes it possible to connect the active matrix substrate and the drive circuit with a flexible substrate or the like without insulating the metal film pattern with an insulating tape or the like, thereby simplifying the mounting process.

EXAMPLE Hereinafter, an active matrix substrate according to an example of the present invention will be described with reference to the drawings.

FIG. 1 is a configuration diagram of an active matrix substrate in one embodiment of the present invention. In FIG. 1, 1 is a thin film transistor, 2 is an input terminal for scanning signal and video signal lines,
3 is a metal film pattern for short-circuiting the scanning signal line and the video signal line, 4 is an insulating film formed on the metal film pattern 3, X1 to Xll1 are scanning signal lines, and Y1 to Yn are video signal lines. Figure 2 shows signal line 2 and metal film pattern 3,
2 is a schematic cross-sectional view of the insulating film 4 taken along the line a-a' in FIG. 1. FIG.

The structure of this embodiment will be explained with reference to FIGS. 1 and 2.

When forming the input terminal 2 of the signal line on the glass substrate 10, a metal film pattern 3 for shorting the signal line is formed at the same time. Then, when forming the switching elements, an insulating film 4 is formed on the metal film pattern 3 at the same time. Also,
An auxiliary metal film 5 is formed on the input terminal 2 in order to correct the step difference caused by the insulating film 4.

With this configuration, the gold W14 film pattern 3 is insulated by the insulating film 4, so when connecting the active matrix board and the drive circuit using a flexible board, etc., there is no need to apply insulation tape or the like to insulate the drive circuit. Even if the metal film pattern 3 and the flexible substrate are not in contact with each other, the mounting process is simplified.

Effects of the Invention As described above, the present invention provides a structure in which an insulating film is formed on a gold film pattern to which at least two signal lines of switching elements of an active matrix substrate are connected. This makes it possible to connect the active matrix substrate and the drive circuit with a flexible substrate or the like without insulating the metal film pattern, thereby simplifying the mounting process.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 shows an active matrix I-I in an embodiment of the present invention.
FIG. 2 is a schematic sectional view taken along the line a-a' in FIG. 1, and FIG. 3 is a configuration diagram showing the configuration of a conventional active matrix substrate. 1... Thin film transistor, 2... Input terminal, 3... Metal film pattern, 4...
Insulating film, 5... Auxiliary metal film, X1 to Xff1.
...Scanning signal line, Y1 to Yn...Video signal line. Name of agent: Patent attorney Shigetaka Awano 111
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Claims (3)

[Claims] (1) An active matrix substrate in which switching elements are arranged in a matrix on a glass substrate, wherein at least two or more signal lines of the switching elements are connected by a metal film pattern formed on the glass substrate, and the metal film An active matrix substrate characterized by having an insulating film formed on a pattern. (2) The active matrix substrate according to claim 1, wherein the pattern of the metal film to which the signal line is connected is sufficiently thicker than the pattern width of the signal line to serve as a common electrode. (3) The active matrix substrate according to claim (1), wherein the switching element is composed of a two-terminal element or a thin film transistor.