JPH0225578Y2 - - Google Patents
Info
- Publication number
- JPH0225578Y2 JPH0225578Y2 JP1983032183U JP3218383U JPH0225578Y2 JP H0225578 Y2 JPH0225578 Y2 JP H0225578Y2 JP 1983032183 U JP1983032183 U JP 1983032183U JP 3218383 U JP3218383 U JP 3218383U JP H0225578 Y2 JPH0225578 Y2 JP H0225578Y2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder
- flow
- main body
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 41
- 238000005192 partition Methods 0.000 claims description 12
- 238000005476 soldering Methods 0.000 description 6
- 238000010992 reflux Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000010349 pulsation Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3218383U JPS59140064U (ja) | 1983-03-08 | 1983-03-08 | 噴流式はんだ槽 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3218383U JPS59140064U (ja) | 1983-03-08 | 1983-03-08 | 噴流式はんだ槽 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59140064U JPS59140064U (ja) | 1984-09-19 |
JPH0225578Y2 true JPH0225578Y2 (ko) | 1990-07-13 |
Family
ID=30163013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3218383U Granted JPS59140064U (ja) | 1983-03-08 | 1983-03-08 | 噴流式はんだ槽 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59140064U (ko) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS521827B2 (ko) * | 1971-12-27 | 1977-01-18 | ||
JPS5247518A (en) * | 1975-10-14 | 1977-04-15 | Yasuharu Takumi | Sand mold forming method for casting |
JPS5916766B2 (ja) * | 1978-05-04 | 1984-04-17 | タイガー魔法瓶株式会社 | 電気炊飯器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5213315Y2 (ko) * | 1972-12-15 | 1977-03-25 | ||
JPS521827U (ko) * | 1975-06-24 | 1977-01-07 | ||
JPS5916766U (ja) * | 1982-07-20 | 1984-02-01 | クラリオン株式会社 | 噴流付平面デイツプ槽 |
-
1983
- 1983-03-08 JP JP3218383U patent/JPS59140064U/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS521827B2 (ko) * | 1971-12-27 | 1977-01-18 | ||
JPS5247518A (en) * | 1975-10-14 | 1977-04-15 | Yasuharu Takumi | Sand mold forming method for casting |
JPS5916766B2 (ja) * | 1978-05-04 | 1984-04-17 | タイガー魔法瓶株式会社 | 電気炊飯器 |
Also Published As
Publication number | Publication date |
---|---|
JPS59140064U (ja) | 1984-09-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4530457A (en) | Wave-soldering of printed circuit boards | |
JPS6051939B2 (ja) | 噴流式はんだ槽 | |
EP0201158A2 (en) | Vibratory wave soldering | |
DE3262683D1 (en) | Device for the dispersion of a solder layer on a printed-circuit board | |
JPH0225578Y2 (ko) | ||
JPH04291990A (ja) | プリント回路基板のハンダならし方法及び装置 | |
JPH0134712B2 (ko) | ||
JPH034437Y2 (ko) | ||
JPS6056588B2 (ja) | 噴流式はんだ槽 | |
KR900006977B1 (ko) | 인쇄배선 기판의 진동성 유동납땜 방법 및 그 장치 | |
JPS5973071U (ja) | 自動半田づけ装置 | |
JPH022540Y2 (ko) | ||
JPH0451022Y2 (ko) | ||
JPS6051941B2 (ja) | 噴流式はんだ槽 | |
JPS6113156Y2 (ko) | ||
JPS6116549B2 (ko) | ||
JPS58195469U (ja) | 半田付装置 | |
JPH0444306Y2 (ko) | ||
JPS6039159Y2 (ja) | 噴流式はんだ槽 | |
JPS6117356A (ja) | はんだ付け装置 | |
JPS591500B2 (ja) | 噴流はんだ装置 | |
JPH02121768A (ja) | 噴流式はんだ槽 | |
JPH0783174B2 (ja) | プリント基板のはんだ付け方法およびその装置 | |
SU819992A1 (ru) | Устройство дл удалени излишковпРипО из ОТВЕРСТий и C пОВЕРХНОСТипЕчАТНыХ плАТ | |
JPS58146573U (ja) | 鋼帯の連続片面薬液塗布装置 |