JPH02254791A - Manufacture of multilayer ceramic substrate - Google Patents
Manufacture of multilayer ceramic substrateInfo
- Publication number
- JPH02254791A JPH02254791A JP7612889A JP7612889A JPH02254791A JP H02254791 A JPH02254791 A JP H02254791A JP 7612889 A JP7612889 A JP 7612889A JP 7612889 A JP7612889 A JP 7612889A JP H02254791 A JPH02254791 A JP H02254791A
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- multilayer ceramic
- paste
- pattern
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004020 conductor Substances 0.000 claims abstract description 22
- 239000012212 insulator Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000007639 printing Methods 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 238000011156 evaluation Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は多層セラミック基板の製造方法に関し、特に最
外層に形成する導体パターンの基板との接着強度を改善
するための方法に間する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a multilayer ceramic substrate, and particularly to a method for improving the adhesive strength between a conductive pattern formed in the outermost layer and a substrate.
従来、この種の多層セラミック基板の最外層に導体パタ
ーンを形成する場合、第２図に示すように、積層しな絶
縁体グリーン・シー）９．１０を除く絶縁体グリーン・
シート８，１１上に直接導体ペーストをスクリーン印刷
して導体パターン１２をそれぞれ形成していた。また、
図中１３はバイア・ホールである。Conventionally, when forming a conductor pattern on the outermost layer of this type of multilayer ceramic substrate, as shown in FIG.
Conductor patterns 12 were formed by screen printing a conductor paste directly on the sheets 8 and 11, respectively. Also,
In the figure, 13 is a via hole.
上述した従来の製造方法により形成される導体パターン
においては、導体ペースト中のガラス成分の量をコント
ロールすることにより、導体パターンと基板との接触強
度及びハンダ濡れ性をコントロールしているが、接着強
度及びハンダ濡れ性の両特性共にそれぞれの規格を満た
すことが非常に困難であるという欠点がある。In the conductor pattern formed by the conventional manufacturing method described above, the contact strength and solder wettability between the conductor pattern and the board are controlled by controlling the amount of glass component in the conductor paste, but the adhesive strength It has the drawback that it is extremely difficult to meet the respective standards for both the properties of solder and solder wettability.
本発明の目的は前記課題を解決した多層セラミック１板
の製造方法を提供することにある。An object of the present invention is to provide a method for manufacturing a single multilayer ceramic plate that solves the above problems.
上述した従来の導体パターン形成方法に対し、本発明は
最外層に導体パターンを形成する工程において、絶縁体
グリーン・シート上に絶縁体ペーストを印刷し、絶縁体
パターンを形成した後、この絶縁体パターン上に導体ペ
ーストを印刷し、導体パターンを形成するという相違点
を有する。In contrast to the conventional conductor pattern forming method described above, in the process of forming a conductor pattern on the outermost layer, the present invention prints an insulator paste on an insulator green sheet, forms an insulator pattern, and then prints an insulator paste on the insulator green sheet. The difference is that a conductive paste is printed on the pattern to form a conductive pattern.
前記目的を達成するなめ、本発明はスクリーン印刷法に
より導体パターンが形成され、且つ必要に応じてバイア
・ホールが形成された複数の絶縁体グリーン・シートを
積層し、焼成して得られる多層セラミック基板の製造方
法において、少なくとも最外層に導体パターンを形成す
る際に、セラミックと有機ビヒクルとを主成分とする絶
縁体パターンを絶縁体グリーン・シートに印刷した後、
該絶縁体パターン上に導体パターンを印刷する１穆を含
むものである。In order to achieve the above object, the present invention provides a multilayer ceramic obtained by laminating and firing a plurality of insulating green sheets each having a conductor pattern formed thereon by a screen printing method and via holes formed as necessary. In the method for manufacturing a substrate, when forming a conductive pattern on at least the outermost layer, after printing an insulating pattern mainly composed of ceramic and an organic vehicle on an insulating green sheet,
It includes one square for printing a conductor pattern on the insulator pattern.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
（実施例１）
第１図は本発明の一実施例の積層体の構造を説明する断
面図である。(Example 1) FIG. 1 is a sectional view illustrating the structure of a laminate according to an example of the present invention.
先ず、セラミック・グリーン・シートからなる絶縁体グ
リーン・シート１，４にバイアホール７をそれぞれ形成
する０次に絶縁体グリーン・シート１．４上に鉛ホウケ
イ酸ガラスと有機ビヒクルとを主成分とする絶縁体ペー
ストをスクリーン印刷して絶縁体パターン６をそれぞれ
形成する０次いで、銀８５重量％−パラジウム１５重量
％の金属成分と有機ビヒクルとを主成分とする導体ペー
ストを印刷して絶縁体パターン６上に導体パターン５を
それぞれ形成する。First, via holes 7 are formed in the insulator green sheets 1 and 4 made of ceramic green sheets. Lead borosilicate glass and an organic vehicle are formed as main components on the zero-order insulator green sheets 1 and 4. Next, a conductive paste whose main components are a metal component of 85% by weight of silver and 15% by weight of palladium and an organic vehicle is printed to form insulating patterns. A conductor pattern 5 is formed on each of the conductor patterns 6.
次いで、絶縁体グリーン・シート１及び絶縁体グリーン
・シート４の裏面に導水パターン５をそれぞれ印刷形成
する。Next, a water guiding pattern 5 is printed on the back surfaces of the insulating green sheet 1 and the insulating green sheet 4, respectively.
次いで、絶縁体グリーン・シート１．２，３゜４を所定
の金型に入れ、温度１２０℃、圧力２５０ ｋｇ／−で
熱プレスして積層体を形成する０次いで積層体をアルミ
ナ基板上に乗せて温度８５０℃で焼成し、多層セラミッ
ク１板を得る。Next, the insulating green sheets 1,2,3°4 were placed in a predetermined mold and hot pressed at a temperature of 120°C and a pressure of 250 kg/- to form a laminate.Then, the laminate was placed on an alumina substrate. It is placed and fired at a temperature of 850°C to obtain one multilayer ceramic plate.
このようにして得られた多層セラミック基板の最外層に
形成された導体パターンの接着強度及びハンダ濡れ性を
表１に示す条件でそれぞれ評価しな。The adhesive strength and solder wettability of the conductor pattern formed on the outermost layer of the multilayer ceramic substrate thus obtained were evaluated under the conditions shown in Table 1.
表 １
表２に評価結果を、従来の多層セラミック基板での評価
結果と比較して示す、但し、試料数はそれぞれ２０個で
あり、データとして平均値を示した。Table 1 Table 2 shows the evaluation results in comparison with the evaluation results for a conventional multilayer ceramic substrate. However, the number of samples was 20 for each, and the average value is shown as data.
表２
本実施例の試料では、ハンダ濡れ性が若干低下している
が、規格を十分に満足する値である。−方、接着強度は
著しく向上することがわかる。Table 2 Although the solder wettability of the sample of this example is slightly decreased, it is still a value that fully satisfies the specifications. - On the other hand, it can be seen that the adhesive strength is significantly improved.
（実施例２） 次に、他の実施例について説明する。(Example 2) Next, other embodiments will be described.
絶縁体ペーストの無機質の主成分を鉛ホイケイ酸ガラス
とアルミナとの複合セラミックに変えて、前述の実施例
１と同様の製造方法にて多層セラミック基板を得る。A multilayer ceramic substrate is obtained by the same manufacturing method as in Example 1, except that the main inorganic component of the insulating paste is replaced with a composite ceramic of lead borosilicate glass and alumina.
このようにして得られた多層セラミック基板の最外層に
形成された導体パターンの接着強度及びハンダ濡れ性を
実施例１と同じ条件で評価した。The adhesive strength and solder wettability of the conductive pattern formed on the outermost layer of the thus obtained multilayer ceramic substrate were evaluated under the same conditions as in Example 1.
表３に評価結果を示す、但し試料数は２０個であり、デ
ータとして平均値を示しな。The evaluation results are shown in Table 3, however, the number of samples was 20, and the average value is not shown as data.
表 ３
〔発明の効果〕
以上説明したように本発明は、多層セラミック基板の最
外層となる絶縁体グリーン・シート上に絶縁体ペースト
を印刷して絶縁体パターンを形成した後、この絶縁体パ
ターンの上に導体ペーストを印刷して導体パターンを形
成することにより、焼成後において、最外層に形成され
た導体パターンの基板との接着強度を著しく向上するこ
とができ、且つハンダ濡れ性も十分に実用に耐え得る導
体パターンを得ることができる効果がある。Table 3 [Effects of the Invention] As explained above, the present invention is capable of forming an insulating pattern by printing an insulating paste on an insulating green sheet, which is the outermost layer of a multilayer ceramic substrate, and then printing the insulating pattern. By printing a conductive paste on top of the conductive pattern to form a conductive pattern, it is possible to significantly improve the adhesive strength of the conductive pattern formed on the outermost layer to the substrate after firing, and also to ensure sufficient solder wettability. This has the effect of making it possible to obtain a conductor pattern that can withstand practical use.
第１図は本発明の多層セラミック基板の積層体を示す部
分断面図、第２図は従来の多層セラミック基板の積層体
を示す部分断面図である。
１〜４，８〜１１・・・絶縁体グリーン・シート５．１
２・・・導体パターン
６・・・絶縁体パターン
７．１３・・・バイア・ホール
特許出願人 日本電気株式会社
１〜４：！色壜俸グリーンシート
５：導イ本ノＶターン
６：絶縁体パターン
７：バイア・ホール
第１図FIG. 1 is a partial sectional view showing a multilayer ceramic substrate laminate according to the present invention, and FIG. 2 is a partial sectional view showing a conventional multilayer ceramic substrate laminate. 1-4, 8-11...Insulator green sheet 5.1
2... Conductor pattern 6... Insulator pattern 7.13... Via hole patent applicant NEC Corporation 1-4:! Colored Bottle Green Sheet 5: Guidebook V Turn 6: Insulator Pattern 7: Via Hole Diagram 1
Claims (1)
、且つ必要に応じてバイア・ホールが形成された複数の
絶縁体グリーン・シートを積層し、焼成して得られる多
層セラミック基板の製造方法において、少なくとも最外
層に導体パターンを形成する際に、セラミックと有機ビ
ヒクルとを主成分とする絶縁体パターンを絶縁体グリー
ン・シートに印刷した後、該絶縁体パターン上に導体パ
ターンを印刷する工程を含むことを特徴とする多層セラ
ミック基板の製造方法。(1) A method for manufacturing a multilayer ceramic substrate obtained by laminating and firing a plurality of insulating green sheets each having a conductor pattern formed thereon by a screen printing method and via holes formed therein as required, comprising at least When forming the conductor pattern on the outermost layer, the method includes the step of printing an insulator pattern mainly composed of ceramic and an organic vehicle on an insulator green sheet, and then printing a conductor pattern on the insulator pattern. A method for manufacturing a multilayer ceramic substrate characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7612889A JPH02254791A (en) | 1989-03-28 | 1989-03-28 | Manufacture of multilayer ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7612889A JPH02254791A (en) | 1989-03-28 | 1989-03-28 | Manufacture of multilayer ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02254791A true JPH02254791A (en) | 1990-10-15 |
Family
ID=13596297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7612889A Pending JPH02254791A (en) | 1989-03-28 | 1989-03-28 | Manufacture of multilayer ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02254791A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5549778A (en) * | 1993-12-21 | 1996-08-27 | Fujitsu Limited | Manufacturing method for multilayer ceramic substrate |
| US5662755A (en) * | 1993-10-15 | 1997-09-02 | Matsushita Electric Industrial Co., Ltd. | Method of making multi-layered ceramic substrates |
-
1989
- 1989-03-28 JP JP7612889A patent/JPH02254791A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5662755A (en) * | 1993-10-15 | 1997-09-02 | Matsushita Electric Industrial Co., Ltd. | Method of making multi-layered ceramic substrates |
| US5549778A (en) * | 1993-12-21 | 1996-08-27 | Fujitsu Limited | Manufacturing method for multilayer ceramic substrate |
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