JPH022535Y2 - - Google Patents

Info

Publication number
JPH022535Y2
JPH022535Y2 JP12068184U JP12068184U JPH022535Y2 JP H022535 Y2 JPH022535 Y2 JP H022535Y2 JP 12068184 U JP12068184 U JP 12068184U JP 12068184 U JP12068184 U JP 12068184U JP H022535 Y2 JPH022535 Y2 JP H022535Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
support
solder reflow
reflow apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12068184U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6136365U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12068184U priority Critical patent/JPS6136365U/ja
Publication of JPS6136365U publication Critical patent/JPS6136365U/ja
Application granted granted Critical
Publication of JPH022535Y2 publication Critical patent/JPH022535Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP12068184U 1984-08-07 1984-08-07 半田リフロ−装置 Granted JPS6136365U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12068184U JPS6136365U (ja) 1984-08-07 1984-08-07 半田リフロ−装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12068184U JPS6136365U (ja) 1984-08-07 1984-08-07 半田リフロ−装置

Publications (2)

Publication Number Publication Date
JPS6136365U JPS6136365U (ja) 1986-03-06
JPH022535Y2 true JPH022535Y2 (enrdf_load_stackoverflow) 1990-01-22

Family

ID=30679495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12068184U Granted JPS6136365U (ja) 1984-08-07 1984-08-07 半田リフロ−装置

Country Status (1)

Country Link
JP (1) JPS6136365U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6136365U (ja) 1986-03-06

Similar Documents

Publication Publication Date Title
US6575352B2 (en) Apparatus and method for soldering electronic components to printed circuit boards
JPH022535Y2 (enrdf_load_stackoverflow)
JPS61289697A (ja) リフロー装置
EP0233125B1 (en) Surface mount technology repair station and method for repair of surface mount technology circuit boards
JPH022560Y2 (enrdf_load_stackoverflow)
US3582610A (en) Flat pack heater
EP0434135B1 (en) Method of positioning and soldering of SMD components
JP2782789B2 (ja) リフロー装置における加熱方法及びその装置
JPS6417495A (en) Double side soldering method
JPS6317581Y2 (enrdf_load_stackoverflow)
JP2538130B2 (ja) 光ビ―ム半田付け方法
JP3314712B2 (ja) はんだの濡れ性評価方法
JPH01278967A (ja) 電子部品リードの予備はんだ付け方法
GB2248417A (en) Compliant hot bar soldering apparatus.
JPH0446671A (ja) ハンダリフロー方法およびその装置
JPH1012992A (ja) 実装方法及び電子部品収容パレツト
JPS57192908A (en) Fixing method for soldering
JPH079846Y2 (ja) 搬送機構におけるガイドレールの取付け構造
JPH03114287A (ja) チップ部品の実装方法
RU2311272C1 (ru) Способ пайки безвыводных электрорадиоизделий на печатную плату
JPH0621646A (ja) 薄板配線板の半田付け方法およびその半田付け装置
JP2597695Y2 (ja) リフロー炉
JPH04339561A (ja) 自動はんだ付け装置用プリヒータ
JPH0241770A (ja) リフロー装置
JP2002324972A (ja) リフロー装置およびそれを用いたリフローはんだ付け方法