JPH0225273Y2 - - Google Patents
Info
- Publication number
- JPH0225273Y2 JPH0225273Y2 JP1986066629U JP6662986U JPH0225273Y2 JP H0225273 Y2 JPH0225273 Y2 JP H0225273Y2 JP 1986066629 U JP1986066629 U JP 1986066629U JP 6662986 U JP6662986 U JP 6662986U JP H0225273 Y2 JPH0225273 Y2 JP H0225273Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- metal chassis
- solder
- cutout
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 33
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 238000005476 soldering Methods 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 210000002105 tongue Anatomy 0.000 description 22
- 230000000694 effects Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986066629U JPH0225273Y2 (US08088918-20120103-C00476.png) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986066629U JPH0225273Y2 (US08088918-20120103-C00476.png) | 1986-04-30 | 1986-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62178596U JPS62178596U (US08088918-20120103-C00476.png) | 1987-11-12 |
JPH0225273Y2 true JPH0225273Y2 (US08088918-20120103-C00476.png) | 1990-07-11 |
Family
ID=30904813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986066629U Expired JPH0225273Y2 (US08088918-20120103-C00476.png) | 1986-04-30 | 1986-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0225273Y2 (US08088918-20120103-C00476.png) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0322958Y2 (US08088918-20120103-C00476.png) * | 1988-03-29 | 1991-05-20 | ||
JPH0528799Y2 (US08088918-20120103-C00476.png) * | 1988-06-13 | 1993-07-23 | ||
JPH071831Y2 (ja) * | 1989-02-25 | 1995-01-18 | 日本ケミコン株式会社 | シールド構造 |
JPH09260884A (ja) * | 1996-03-18 | 1997-10-03 | Alps Electric Co Ltd | プリント基板の固定構造 |
JP2010002427A (ja) * | 2006-08-09 | 2010-01-07 | Epson Toyocom Corp | 慣性センサ、慣性センサ装置及びその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49112165A (US08088918-20120103-C00476.png) * | 1973-02-28 | 1974-10-25 | ||
JPS5918488B2 (ja) * | 1980-08-15 | 1984-04-27 | 三井建設株式会社 | 安定液掘削工法におけるスライムの処理方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55139596U (US08088918-20120103-C00476.png) * | 1979-03-24 | 1980-10-04 | ||
JPS5780926U (US08088918-20120103-C00476.png) * | 1980-10-31 | 1982-05-19 | ||
JPS5918488U (ja) * | 1982-07-26 | 1984-02-04 | アルプス電気株式会社 | 電子機器の基板保持構造 |
JPS59125888U (ja) * | 1983-02-09 | 1984-08-24 | 日本電気ホームエレクトロニクス株式会社 | シールド構造 |
JPS59132692U (ja) * | 1983-02-24 | 1984-09-05 | シャープ株式会社 | 放熱板の取付装置 |
-
1986
- 1986-04-30 JP JP1986066629U patent/JPH0225273Y2/ja not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49112165A (US08088918-20120103-C00476.png) * | 1973-02-28 | 1974-10-25 | ||
JPS5918488B2 (ja) * | 1980-08-15 | 1984-04-27 | 三井建設株式会社 | 安定液掘削工法におけるスライムの処理方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS62178596U (US08088918-20120103-C00476.png) | 1987-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4628412A (en) | Case for shielding electronic devices | |
JPH0225273Y2 (US08088918-20120103-C00476.png) | ||
JP3208075B2 (ja) | シールドケース | |
JP3934400B2 (ja) | 電子機器の取付構造 | |
GB2153152A (en) | Case for electronic devices | |
KR0166431B1 (ko) | 회로 모듈 제조방법 | |
JP2665482B2 (ja) | プリント基板と金属シャーシの接続構体及びその製造方法 | |
KR200200102Y1 (ko) | 프레임체와프린트기판의접속구조 | |
JPH0142379Y2 (US08088918-20120103-C00476.png) | ||
JPH025590Y2 (US08088918-20120103-C00476.png) | ||
JP2830702B2 (ja) | ケースの基板への取り付け構造 | |
JPH09260884A (ja) | プリント基板の固定構造 | |
JP2570678B2 (ja) | プリント基板のシールドケースへの取付方法 | |
JPH07240591A (ja) | シールドケースを有するプリント基板及びその製造方法 | |
JPH0513039Y2 (US08088918-20120103-C00476.png) | ||
JPS5843803Y2 (ja) | プリント配線基板の支持装置 | |
JP2569214Y2 (ja) | フレキシブル基板の固定機構 | |
JPH10107459A (ja) | 半田接続構体およびその製造方法 | |
JPH0220874Y2 (US08088918-20120103-C00476.png) | ||
KR810001639Y1 (ko) | 시 일 드 장 치 | |
JPH0452948Y2 (US08088918-20120103-C00476.png) | ||
JPH0741197Y2 (ja) | アース半田付け構造 | |
JP2830532B2 (ja) | シールドケース | |
JPH0322958Y2 (US08088918-20120103-C00476.png) | ||
JPH06857Y2 (ja) | シャーシベース構体 |