JPH02249258A - Semiconductor device - Google Patents

Abstract

PURPOSE:To absorb stresses applied to the soldered parts of outer leads stood on the end surfaces of a package main part and, moreover, facilitate confirmation of the soldering state by a method wherein the tips of the outer leads are bent into U-shapes so as to face the end surfaces of the package main part. CONSTITUTION:A package main part 1 in which an integrated circuit chip and the like are enclosed and sealed and outer leads 4 which are stood on the end surfaces of the package main part 1 and whose tips are bent into U- shapes so as to face the end surfaces of the package main part 1 are provided. Or, a package main part 1 in which an integrated circuit chip and the like are enclosed and sealed and outer leads 4 which are composed of inside lead parts 4A stood on the end surfaces of the package main part 1 and outside lead parts 4B which are provided solidly with the inside lead parts 4A and have larger widths than the inside lead parts 4A and are soldered to external circuits are provided. With this constitution, stresses applied to the soldered parts can he absorbed by the U-shaped bent parts of the outer leads or by the narrow inside lead parts.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, particularly a surface mount type semiconductor device.

[Conventional technology]

4 to 6 show conventional surface mount type semiconductor devices. FIG. 4 is a side view of the device with gull-wing external leads, FIG. 5 is a plan view of the device shown in FIG. 4, and FIG. FIG. 6 is a side view of one having a J-shaped external lead.

In these figures, (1) is a resin package body that contains an integrated circuit chip, etc. and is sealed, and (2) is an external package that is embedded in the end surface of the package body and is connected to the integrated circuit chip, etc. The lead (3) is a soldering part provided at the tip of the external lead, and is soldered when the semiconductor device is mounted on a substrate (not shown) or the like.

[Problem to be solved by the invention]

Since conventional semiconductor devices were configured as described above,
If a reliability test such as a cycle test over high and low temperatures is carried out after being mounted on a board etc. by soldering, the fourth
The semiconductor device shown in FIG. 5 and FIG. 5 has a problem in that cracks occur in the soldered portion due to the difference in coefficient of thermal expansion between the package body and the substrate. Furthermore, in the semiconductor device shown in FIG. 6, the tip of the external lead curved in a 5-shape wraps around the back surface of the package body (1) and is difficult to see from the surface, making it difficult to check the soldering condition. was there.

This invention was made to solve these problems, and provides a semiconductor device that can absorb the stress applied to the solder parts of the external leads and that can easily check the soldering condition. This is what we are trying to provide.

[Means to solve the problem]

In the semiconductor device according to the present invention, an external lead implanted in the end surface of the package body is curved into a U-shape so that the leading end thereof faces the end surface of the package body. In addition, the external lead implanted on the end face of the package body is composed of an outer lead part including some solder and an inner lead part located on the side of the package body, and the outer lead part is made wider than the inner lead part. It was formed.

[For production]

According to this invention, the external lead implanted on the end surface of the package body is curved into a U-shape, and the curved portion is located on the side of the package body so that the tip thereof faces the end surface of the package body. Because of this shape, it is easy to check the condition of the solder parts, and the U-shaped curved part can absorb stress applied to the solder parts. In addition, the outer lead portion of the outer lead is wider than the inner lead portion, in other words, the inner lead portion is sandwiched between the outer lead portion and the outer lead portion.
The stress applied to some parts of the solder is absorbed by the narrow inner lead part.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIG.

In this figure, (1) is a resin package body that contains an integrated circuit chip etc. and is sealed, and (2) is an external lead implanted on the end face (IA>) of the package body, with the tip end being U. The external lead (4) is curved in a letter shape and is configured to face the end surface (IA) of the package body.That is, the tip and curved portion of the external lead (4) are located on the sides of the package body (1). This shape prevents the tip from wrapping around the back of the package body.

(3) is the solder portion provided at the tip of the external lead. In this embodiment, the solder part G) is located on the side of the package body (1), so even when it is soldered, its condition can be easily checked, and the external lead Since a U-shaped curved part is formed in the middle part, several parts of solder (31
can absorb stress applied to

FIGS. 2 and 3 show other embodiments of the invention, with FIG. 2 being a plan view and FIG. 3 being a side view. In these figures, (4) is a gull wing-shaped external lead, which is connected to an inner lead part (4A) implanted in the end face (IA) of the package body (1), and is provided from the inner lead part. It consists of an outer lead part (4B) 5 formed wide. In this example, the width of the outer lead part (4B) is the same as the width of the solder part (3) of the example shown in FIG.
The width of the inner lead portion (4A) is narrower than the width of the inner lead portion (4A). Also, (3) is the number of solder parts provided on the outer lead part (4B).

In this way, change the width of the inner lead part (4A) to the outer lead part (4A).
By forming the width relatively narrower than the width of 4B),
This makes it easier to absorb the stress applied to the solder part G). Of course, it is also easy to check the condition of some parts of the solder.

〔Effect of the invention〕

As described above, the present invention curves the external lead implanted on the end face of the package body into a U-shape, or consists of an inner lead part and an outer lead part, so that the outer lead part is wider than the inner lead part. As a result, the stress applied to the solder parts can be effectively absorbed and cracks can be prevented from occurring, and reliability can be improved because it is easy to check the condition of the solder parts.

[Brief explanation of drawings]

Fig. 1 is a side view showing one embodiment of the present invention, Figs. 2 and 3 show other embodiments of the invention, Fig. 2 is a plan view, and Fig. 3 is a side view. . 4 to 6 show conventional semiconductor devices.
The figure is a side view of the device having gull wing-shaped external leads, FIG. 5 is a plan view, and FIG. 6 is a side view of the device having J-shaped external leads. In the figure, (1) is the package body, (2) (A) is the external lead, (3) is the solder sealing part, (4A) is the inner lead part, and (4B) is the outer lead part. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent: Masuo Oiwa, patent attorney

Claims (2)

[Claims] (1) A package with a sealed integrated circuit chip, etc. inside, and an external lead implanted on the end face of the package main body, the tip of which is curved in a U-shape so as to face the end face of the package main body. A semiconductor device equipped with (2) A package body in which an integrated circuit chip, etc. is built-in and sealed, an inner lead part implanted on the end face of this package body, and an outer lead integrally provided with this inner lead part and wider than the inner lead part. What is claimed is: 1. A semiconductor device comprising an external lead, the external lead portion being soldered to an external circuit.