JPH02244657A - Hermetically sealed case - Google Patents

Abstract

PURPOSE:To envelop dust occurred at welding so as to improve a semiconductor element in quality and reliability by a method wherein a gap between a lid member and a case main body is filled with a sealing member inside a part where the lid member and the case main body is soldered. CONSTITUTION:A sealing member 7 is formed of silicone bonding agent of low elasticity bonded to the whole circumference of the inner face of a lid member 5. The member 7 is bonded to the cover section 5A at a position near a soldering section 5B, pressure-welded to the side face and the circumferential face of a mounting section 1A deforming elastically when the member 5 is pressed against the extension section 1B of the case main body 1, and formed into such a shape that it fills a gap between the member 5 and the main body 1. A welding section 6 welds the soldering section 5B and the extension section 1B together through all their circumferences to hermetically seal up the inside. By this setup, even if dust occurs at welding, the dust is accumulated at the gap between a welded section and a sealing member, so that a semiconductor element can be improved in quality and reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an airtight container, particularly to an airtight container for accommodating semiconductor elements, surface acoustic wave elements, etc.

[Conventional technology]

FIG. 3 is a side sectional view showing a conventional airtight container described in, for example, pages 135 to 136 of "rIC Mounting Technology" published by Kogyo Kenkyukai.

In this figure, (1) is a container body made of an insulating material, which includes a mounting part (IA) for mounting a semiconductor element, etc., and a mounting part (IA) that is formed one step lower than the mounting part and extends outward from the periphery of the mounting part. The extension part (IB) extends in the shape of a brim.

(2) is a semiconductor element etc. mounted on the mounting part, (3A)
(3B) is an external drawer lead implanted in the attachment part, (4
AX4B) are wires (5
) is a lid member, and the cover part (5) covers the semiconductor element etc. (2).
A) and a flange-shaped welded part (5B) placed on the extension part (IB). (6) Extension part (
IB) and the welded part (5B) are brought into close contact with each other under a predetermined pressure, and the welded part is made by metal welding over the entire circumference, and serves both to fix the lid member (5) and to hermetically seal the semiconductor element, etc. (2). It is.

[Problem to be solved by the invention]

Conventional airtight containers were constructed as described above, so when welding the extension part (IB) of the container body and the weld part (5B) of the lid member, if there is a problem with the extension part or the weld part. ,
Alternatively, if there is a mismatch in welding conditions, metallic dust (hereinafter referred to as dust) will be generated from the welding area (6), and this may scatter on the surface of the semiconductor element etc. (2) or the container body. Dust adhering to the cover and cover may fall due to vibration or shock,
There have been problems such as adhesion to the surfaces of semiconductor devices and the like, leading to short circuits and characteristic deterioration.

This invention was made to solve the above problems, and provides an airtight container that can prevent dust generated during welding from entering the vicinity of semiconductor elements, etc.
This is what we are trying to do.

[Means to solve the problem]

In the airtight container according to the present invention, a sealing member is interposed between the lid member and the container body inwardly from the welding portion where the lid member is welded to the container body.

[For production]

According to the invention, the gap between the lid member and the container body is sealed inward from the welding part, so even if dust is generated during welding, the sealing member prevents it from entering the inside. Therefore, dust only accumulates in the gap between the weld and the sealing member.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIG.

In this figure, (7) is a sealing member that is adhered to the entire circumference of the inner surface of the lid member, and is made of a silicone-based adhesive that has low elasticity. Note that this sealing member (
7) is the welded part (5B) on the inner surface of the cover part (5A) of the lid member.
The lid member (5) is glued close to the container body (1).
When pressed against the extension part (IB) of the lid member, it is shaped to elastically deform and come into pressure contact with the side and curved surfaces of the attachment part (IA) of the container body, closing the gap between the lid member and the container body. (6
) is the welded part (5B) of the lid member and the extended part (I) of the container body.
B) is welded around the entire circumference to airtightly seal the inside of the lid member.

The rest of the configuration is the same as the conventional one, so the explanation will be omitted.

With the above configuration, the sealing member (7) can close the gap between the lid member (5) and the container body (1) inside the welded part (6) or welded part (5B). Therefore, even if dust is generated during welding, this dust will accumulate in the gap between the welding part (6) and the sealing member (7), which will have a negative impact on semiconductor elements, etc. Never.

In addition, in the following explanation, an example was given in which the sealing member (7) is adhered to the inner surface of the lid member (5), but the attachment part (
A similar effect can be expected even if the adhesive is attached to all sides of the IA). In addition, although an example was shown in which the sealing member (7) is made of silicone adhesive, as shown in FIG.
It may also be attached to the side of the

〔Effect of the invention〕

As described above, according to the present invention, the gap between the lid member and the container body is closed by the sealing member inward from the part where the lid member and the container body are welded, and the dust generated during welding is contained. It is possible to improve the quality and reliability of semiconductor devices, etc. and ensure high yields.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing one embodiment of the invention, FIG. 2 is a side sectional view showing another embodiment of the invention, and FIG. 3 is a side sectional view showing a conventional airtight container. In the figure, (1) is the container body, (2) is the semiconductor element, etc.
(5) is a lid member, (6) is a welded portion, and (7) and (8) are sealing members. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] It has a container body in which a semiconductor element, etc. is mounted, a cover part that covers the semiconductor element, etc., and a welded part welded to the container body, and a lid member that hermetically seals the semiconductor element, etc., and an inner side of the welded part. An airtight container comprising a sealing member interposed between the lid member and the container body.