JPH02239157A - Production of ceramic substrate - Google Patents
Production of ceramic substrateInfo
- Publication number
- JPH02239157A JPH02239157A JP1056869A JP5686989A JPH02239157A JP H02239157 A JPH02239157 A JP H02239157A JP 1056869 A JP1056869 A JP 1056869A JP 5686989 A JP5686989 A JP 5686989A JP H02239157 A JPH02239157 A JP H02239157A
- Authority
- JP
- Japan
- Prior art keywords
- green sheets
- warpage
- ceramic
- ceramic green
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000010304 firing Methods 0.000 claims description 8
- 230000003292 diminished effect Effects 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は各種電子素子の塔載基板等として用いられるセ
ラミック基板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a ceramic substrate used as a mounting substrate for various electronic devices.
従来、セラミック基板はセラミックグリーンシートをセ
ッター上に順次所要枚数積層して焼成するもので、セラ
ミックグリーンシートの表面に次のセラミックグリーン
シートの裏面が重なって因るため、焼成時に反りが発生
した場合には反りが増幅して大きな反り発生となり，且
つ反り不良本が大となる。Conventionally, ceramic substrates are made by laminating the required number of ceramic green sheets in sequence on a setter and firing them.As the back side of the next ceramic green sheet overlaps with the front surface of one ceramic green sheet, warping may occur during firing. In this case, the warpage is amplified and large warpage occurs, and the number of warped defective books increases.
従来の技術で述べたよう−こ、セラミックグリーンシー
トの表百に次のセラミックグリーンシートの裏面を重ね
、順次積層して積層すると反り不良率が大となり、且つ
反りも増幅して大きくなる。As described in the prior art section, if the front side of one ceramic green sheet is overlapped with the back side of the next ceramic green sheet, and the ceramic green sheets are stacked one after another, the warpage defect rate increases and the warp also increases and becomes larger.
本発明は従来の技術における上述の問題点ｌこ鑑みてな
されたもので、その目的とするところは、反り不良本が
小さく、且つ反りが発生しても小さくなるセラミーｌク
基板の渠造方法を提供することにある。The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to create a method for producing a ceramic lubricant substrate in which the number of defective warps is small and even if warp occurs, it is small. Our goal is to provide the following.
本発明はセラミックグリーンシートを焼成してセラミッ
ク基板を製造する方法において、セラミックグリーンシ
ートの表面と表面又は裏面と裏面とを重ね合わせて積層
し焼成することを特徴とするセラミ噌ク基板の製造方法
のため、焼成時に発生する反りを抑制することができる
もので、以下本発明を詳細に説明する。The present invention relates to a method for manufacturing a ceramic substrate by firing ceramic green sheets, the method comprising: stacking and firing the ceramic green sheets by overlapping the front surface and the front surface or the back surface and the back surface. Therefore, it is possible to suppress warping that occurs during firing, and the present invention will be described in detail below.
本発明に用いるセラミックグリーンシートはアルミナ質
、マグネシア質、珪石質、窒化質，ボロン質等のような
耐火物骨材やセラミックのグリーンシ一ト全般を用いる
ことができる。セ−ｊター材質につ論ても特に限定する
ものではなーが、セッター上に積層するセラミーｌクグ
リーンシ一トは、表面と表面又は裏面と裏面とを重ね合
わせて積層することが必要である。As the ceramic green sheet used in the present invention, refractory aggregates such as alumina, magnesia, silica, nitride, boron, etc., and ceramic green sheets in general can be used. Although there are no particular limitations on the material of the setter, it is necessary that the ceramic green sheets to be laminated on the setter be laminated surface to surface or back surface to back surface.
以下本開明を実施例にもとづいて説明する。The present invention will be described below based on examples.
実施例１
平均粒径２、８クロンのアルミナ９８重板部（以下単１
こ部と記す）に対し、タルク２部を加え混合後メチルセ
ルロース５部、水δ部を加え混練後厚み】．ＩＨにシー
ト化し乾燥後、４００ Ｘ ４００ ｔｘに打抜いてグ
リーンシ一トを得た。次にアルミナ製セッター上に上記
グリーンシ一トの表面と表面とを重ね合わせて１組とし
たものを５組枦層しｉｏｏ’ｃ，４間の昇温率で１５７
０℃迄昇温させ， １５７０℃で３時間焼成後、降温
しでセラミック基板を得た。Example 1 Alumina 98 layered plate part with an average particle size of 2.8 chrome (hereinafter referred to as single plate)
2 parts of talc were added to the mixture, 5 parts of methylcellulose and δ parts of water were added to the mixture, and after kneading, the thickness was as follows. After forming into a sheet on IH and drying, it was punched out to a size of 400 x 400 tx to obtain a green sheet. Next, 5 sets of the surfaces of the above green sheets were layered on an alumina setter, and the heating rate was 157
The temperature was raised to 0°C, and after firing at 1570°C for 3 hours, the temperature was lowered to obtain a ceramic substrate.
実施例２
実施例１と同じセラミフクグリーンシ一トを、アルミナ
製セウター上に裏面と裏面とを重ね合わせて１組とした
ものを５組積層した以外は実施例１と同様に処理してセ
ラミウク基板を得た。Example 2 The same process as in Example 1 was carried out, except that 5 sets of the same ceramic green sheets as in Example 1 were laminated, back side to back side, on an alumina coater. A ceramic substrate was obtained.
比較例
実施例１と同じセラミウクグリーンシ一トを、アルミナ
製セヮター上にグリーンシ一ト表面に次のグリーンシ一
トの表面が重なるように順次ｌＯ枚積層した以外は実施
例ｌと同様に処理してセラミック基板を得た。Comparative Example Same as Example 1 except that 10 pieces of the same ceramic green sheets as in Example 1 were stacked one after another on an alumina sewator so that the surface of one green sheet overlapped with the surface of the next green sheet. A ceramic substrate was obtained.
実施例１及び２と比較例のセラミプク基板の性能は第１
表のようである。The performance of the ceramic substrates of Examples 1 and 2 and the comparative example was the first.
It looks like a table.
本発明は上述した如く構戊されている。特許請求の範囲
に記載した構成を有するセラミック基板の裏造方法にお
いては反り不良率が小さく、反り量も小さくなる効果が
ある。The present invention is constructed as described above. The method for backing a ceramic substrate having the configuration described in the claims has the effect of reducing the warpage defect rate and the amount of warpage.
Claims (1)
ク基板を製造する方法において、セラミックグリーンシ
ートの表面と表面又は裏面と裏面とを重ね合わせて積層
し焼成することを特徴とするセラミック基板の製造方法
。(1) A method for producing a ceramic substrate by firing ceramic green sheets, which comprises stacking the ceramic green sheets one on top of the other, or one on the other, and firing them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056869A JPH02239157A (en) | 1989-03-08 | 1989-03-08 | Production of ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056869A JPH02239157A (en) | 1989-03-08 | 1989-03-08 | Production of ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02239157A true JPH02239157A (en) | 1990-09-21 |
Family
ID=13039431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1056869A Pending JPH02239157A (en) | 1989-03-08 | 1989-03-08 | Production of ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02239157A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010159184A (en) * | 2009-01-09 | 2010-07-22 | Denki Kagaku Kogyo Kk | Method for producing aluminum nitride sintered compact |
| JP2021024106A (en) * | 2019-07-31 | 2021-02-22 | デンカ株式会社 | Method for producing ceramic substrate |
-
1989
- 1989-03-08 JP JP1056869A patent/JPH02239157A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010159184A (en) * | 2009-01-09 | 2010-07-22 | Denki Kagaku Kogyo Kk | Method for producing aluminum nitride sintered compact |
| JP2021024106A (en) * | 2019-07-31 | 2021-02-22 | デンカ株式会社 | Method for producing ceramic substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI532853B (en) | Anti-depression low shrinkage mirror plate | |
| JPH02239157A (en) | Production of ceramic substrate | |
| JPH09187809A (en) | Manufacture of ceramic member having fine through holes | |
| JP2003027227A (en) | Sputtering target | |
| JPH0799263A (en) | Manufacture of ceramic substrate | |
| JPS62128973A (en) | Method of burning ceramic substrate | |
| JP2002057413A (en) | Ceramic substrate and its producing method | |
| JPH059393B2 (en) | ||
| JPH0431368A (en) | Method for correcting warpage of ceramic substrate | |
| JPH02141476A (en) | Production of ceramics substrate | |
| JPH01172277A (en) | Production of ceramic substrate | |
| JPH02311371A (en) | Sintering of ceramic substrate | |
| JPS6389467A (en) | Mold release sheet for burning ceramic substrate | |
| JPS63295480A (en) | Production of ceramic sheet | |
| JP2825987B2 (en) | Refractory shelf with sandwich construction | |
| JPH08258016A (en) | Manufacture of ceramic substrate | |
| JP4161618B2 (en) | Method for producing multilayer ceramic fired body | |
| JPH10258415A (en) | Production of ceramic green substrate and ceramic substrate | |
| JP2021024106A (en) | Method for producing ceramic substrate | |
| JP2814120B2 (en) | Forming method of ceramic green sheet | |
| JPH02129055A (en) | Production of ceramic green sheet | |
| JPH02164777A (en) | Production of ceramic base board | |
| JPS63112473A (en) | Manufacture of ceramic substrate | |
| JP2720199B2 (en) | Ceramic substrate firing method | |
| JPH0248901A (en) | Manufacture of ceramic board |