JPH02164777A - Production of ceramic base board - Google Patents
Production of ceramic base boardInfo
- Publication number
- JPH02164777A JPH02164777A JP63321804A JP32180488A JPH02164777A JP H02164777 A JPH02164777 A JP H02164777A JP 63321804 A JP63321804 A JP 63321804A JP 32180488 A JP32180488 A JP 32180488A JP H02164777 A JPH02164777 A JP H02164777A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramic green
- green sheets
- base board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 29
- 238000000465 moulding Methods 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 13
- 230000003746 surface roughness Effects 0.000 abstract description 7
- 239000010409 thin film Substances 0.000 abstract description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 238000007606 doctor blade method Methods 0.000 abstract description 3
- 238000001354 calcination Methods 0.000 abstract 4
- 238000010304 firing Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明はセラミック基板の製造方法に関し、特に、た
とえば薫着膜やスパッタリング膜などの薄膜を形成する
ために平滑な平面が要求される、セラミック基板の製造
方法に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a method for manufacturing ceramic substrates, and particularly to ceramic substrates that require a smooth flat surface in order to form a thin film such as a smoked film or a sputtered film. The present invention relates to a method for manufacturing a substrate.
この種の薄膜用基板の多くは、混成集積回路用として用
いられる。回路の集積化、高密度化に伴って、基板表面
に形成される回路パターンも微細化が進み、基板表面の
平滑性（基板表面の反りやうねりあるいは粗さ）が混成
集積回路の歩留りや性能を大きく左右するようになった
。Many of this type of thin film substrates are used for hybrid integrated circuits. As the integration and density of circuits increases, the circuit patterns formed on the substrate surface also become finer, and the smoothness of the substrate surface (warpage, waviness, or roughness of the substrate surface) has an impact on the yield and performance of hybrid integrated circuits. It has come to have a large influence on
そこで、従来では、薄膜用基板としては、セラミック基
板に施釉して表面を平滑にしたグレーズ基板や、焼成後
に研磨した研磨基板などが用いられている。Therefore, conventionally, as a thin film substrate, a glazed substrate, which is a ceramic substrate coated with a glaze to make the surface smooth, or a polished substrate, which is polished after firing, has been used.
グレーズ基板では、電気的および熱的特性が悪く、一方
、研磨基板では、基板のコストが高くなるという欠点が
あった。Glazed substrates have poor electrical and thermal characteristics, while polished substrates have the drawback of increasing the cost of the substrate.
また、焼成したままのセラミック基板表面を利用するこ
ともあるが、この場合には、反り直し処理が必要であり
、この方法もコストが高くなるという欠点があった。In addition, the surface of the ceramic substrate as fired may be used, but in this case, it is necessary to perform a treatment to correct the warpage, and this method also has the disadvantage of increasing costs.
それゆえに、この発明の主たる目的は、安価にして、平
滑性のよい表面を有するセラミック基板が得られる、セ
ラミック基板の製造方法を提供することである。Therefore, the main object of the present invention is to provide a method for manufacturing a ceramic substrate, which is inexpensive and allows a ceramic substrate having a smooth surface to be obtained.
〔課題を解決するための手段］
この発明は、セラミックグリーンシートをビヒクルで貼
り合わせて一体焼成する、セラミック基板の製造方法で
ある。[Means for Solving the Problems] The present invention is a method for manufacturing a ceramic substrate, in which ceramic green sheets are bonded together using a vehicle and then integrally fired.
複数枚のセラミックグリーンシートは、ビヒクルで貼り
合わされて一体焼成される。このとき、ビヒクルは各セ
ラミックグリーンシートを互いに接着する作用を果たす
ので、焼成に伴う基板表面の反りやうねりが抑制される
。A plurality of ceramic green sheets are bonded together with a vehicle and fired together. At this time, the vehicle serves to bond the ceramic green sheets to each other, so that warping and waviness of the substrate surface due to firing is suppressed.
この発明によれば、焼成時の反りやうねりが抑制される
ので、研磨や施釉等の仕上げ工程は不要となり、焼成後
の基板表面をそのまま利用する場合でも、反り直し処理
も不要である。このため、生産効率が高く、製品のコス
トダウンが図れる。According to the present invention, warpage and waviness during firing are suppressed, so finishing steps such as polishing and glazing are not necessary, and even when the substrate surface after firing is used as is, there is no need for rewarping treatment. Therefore, production efficiency is high and product costs can be reduced.
さらに、実施例のように、シート成形時のフィルム面が
最外層になるように貼り合わせて一体焼成すれば、基板
表面も緻密になり、−層有効である。Further, as in the example, if the sheets are laminated together so that the film surface at the time of sheet formation becomes the outermost layer and fired together, the substrate surface becomes dense and the layer is effective.
この発明の上述の目的、その他の目的、特徴および利点
は、図面を参照して行う以下の実施例の詳細な説明から
一層明らかとなろう。The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.
第１図はこの発明の一実施例を示す断面図解図である。 FIG. 1 is an illustrative cross-sectional view showing one embodiment of the present invention.
この実施例のセラミックグリーン体ｌＯはセラミックグ
リーンシート１２を含み、この２枚のセラミックグリー
ンシート１２はビヒクル層１４によって貼り合わされる
。The ceramic green body IO of this embodiment includes a ceramic green sheet 12, and the two ceramic green sheets 12 are bonded together by a vehicle layer 14.
セラミックグリーンシート１２は、たとえばドクタブレ
ード法によって形成されるが、その形成時のフィルム接
触面１２ａがセラミックグリーン体ｌＯの最外表面にな
るように配置される。これは、焼成後のセラミック基板
の表面粗さを小さくして、緻密な表面を得るためである
。なぜなら、フィルム接触面１２ａは、その表面平滑性
に優れたフィルム（図示せず）に接触しているため、非
接触面に比べて表面が緻密であるからである。The ceramic green sheet 12 is formed, for example, by a doctor blade method, and is arranged so that the film contact surface 12a at the time of formation is the outermost surface of the ceramic green body IO. This is to reduce the surface roughness of the ceramic substrate after firing and obtain a dense surface. This is because the film contact surface 12a is in contact with a film (not shown) having excellent surface smoothness, and therefore has a denser surface than the non-contact surface.
なお、ビヒクル層１４によって貼り合わされるセラミッ
クグリーンシート１２の枚数は、第１図実施例の２枚に
限らず、第２図実施例の３枚、第３図実施例の６枚等、
任意の枚数であってよい。Note that the number of ceramic green sheets 12 bonded together by the vehicle layer 14 is not limited to two in the embodiment in FIG. 1, but may be three in the embodiment in FIG. 2, six in the embodiment in FIG. 3, etc.
The number may be any number.
しかしながら、いずれの場合も、ビヒクル層１４は、好
ましくは、貼り合わせるべきセラミックグリーンシート
１２と同じセラミック原料をバインダでつ（る。これは
、それぞれのセラミックグリーンシート１２が焼成時良
好に一体化されるようにするためである。なお、セラミ
ックグリーンシート１２のフィルム接触面１２ａが最外
表面（上下表面）になるように配置されるのも前述の通
りである。However, in any case, the vehicle layer 14 is preferably made of the same ceramic raw material as the ceramic green sheets 12 to be bonded together as a binder. This is because the respective ceramic green sheets 12 are well integrated during firing. As described above, the ceramic green sheet 12 is arranged so that the film contacting surface 12a is the outermost surface (upper and lower surfaces).
実験では、主原料のアルミナに、ＰＶＢ系バインダおよ
び可塑剤を加えてセラミックスラリを作り、ドクタブレ
ード法によってセラミックグリーンシート１２を得た。In the experiment, a ceramic slurry was prepared by adding a PVB binder and a plasticizer to alumina as the main raw material, and a ceramic green sheet 12 was obtained using a doctor blade method.
一方、アルミナ原料とバインダとに溶剤としてテルミネ
オール（ＴＮＰ）を加えて約８０ ｐｏｉｓｅのビヒク
ルを作成した。Meanwhile, termineol (TNP) was added as a solvent to the alumina raw material and the binder to create a vehicle of about 80 poise.
そして、第１図実施例に従って厚みｔが０． ３ｍａｎ
のセラミックグリーンシート１２を２枚貼り合わせ、第
２図実施例に従って厚みＬが０．２ｍｍのものを３枚貼
り合わせ、そして第３図実施例に従って厚みｔが０．
１ｍｎ＋のものを６枚貼り合わせ、それぞれの実施例サ
ンプルのセラミックグリーン体１０を作成した。According to the embodiment in FIG. 1, the thickness t is 0. 3man
Two ceramic green sheets 12 having a thickness L of 0.2 mm are pasted together according to the embodiment shown in FIG.
Six pieces of 1 mm+ were pasted together to create ceramic green bodies 10 for each example sample.
これらの実施例サンプルのセラミックグリーン体１０と
、比較のための当初の厚みが０．６ｍｍの１枚のセラミ
ックグリーンシートから成る比較例サンプルとを、それ
ぞれ、１０枚ずつ、１６００“Ｃ２時間、大気中で焼成
し、得られた実施例サンプルと比較例サンプルとの反り
と表面粗さ（Ｒａ）とを測定した。その結果が次表に示
される。なお、いずれの場合も、得られたセラミック基
板の厚みは０．５２±０．０３ｍｍ内に収まっていた。The ceramic green bodies 10 of these example samples and a comparative example sample consisting of one ceramic green sheet with an initial thickness of 0.6 mm were each placed in the atmosphere at 1600"C for 2 hours. The warpage and surface roughness (Ra) of the obtained example sample and comparative example sample were measured.The results are shown in the following table.In each case, the obtained ceramic The thickness of the substrate was within 0.52±0.03 mm.
また、表には各１０サンプルずつの平均値を示した。The table also shows the average value of each 10 samples.
（以下余白）
表
表から明らかなように、比較例サンプルによるセラミッ
ク基板では、基板の表面では表面粗さが０．０５μｍ、
裏面では０．１０μｍとなる。すなわち、セラミックグ
リーンシート成形時のフィルム接触面では表面粗さはよ
くなるが、フィルム非接触面では表面粗さは悪くなる。(Left below) As is clear from the table, the ceramic substrate according to the comparative sample had a surface roughness of 0.05 μm on the surface of the substrate.
On the back side, it is 0.10 μm. That is, the surface roughness of the film contact surface during ceramic green sheet molding is good, but the surface roughness of the film non-contact surface is poor.
そして、フィルム接触面とフィルム非接触面とではセラ
ミック粒子の充填密度が異なるので、反りも２．４１ｍ
ｍ／インチと大きい。Since the packing density of ceramic particles is different between the film contact surface and the film non-contact surface, the warpage is also 2.41 m.
It is large at m/inch.
それに対して、各実施例サンプルによるセラミック基板
では、表面粗さは、表面および裏面ともに０．０５μｍ
であり、良好であった。また、各実施例サンプルでは、
ビヒクル層１４による接着力のために焼成時の反りやう
ねりが抑制され、反りも比較例サンプルに比べて格段に
よくなっている。In contrast, the surface roughness of the ceramic substrate according to each example sample was 0.05 μm on both the front and back surfaces.
It was good. In addition, in each example sample,
Due to the adhesive strength of the vehicle layer 14, warping and waviness during firing were suppressed, and the warping was also much better than that of the comparative sample.
なお、上述の実施例ではセラミックグリーンシート１２
の主原料はアルミナであったが、この発明はムライト、
フォルステライトおよびＡｌ２Ｎなどの他のセラミック
原料のものにも同様に適用できることはいうまでもない
。Note that in the above embodiment, the ceramic green sheet 12
The main raw material was alumina, but this invention uses mullite,
It goes without saying that it can be similarly applied to other ceramic raw materials such as forsterite and Al2N.
第１図はこの発明の一実施例の焼成前のセラミックグリ
ーン体を示す断面図である。
第２図はこの発明の他の実施例の焼成前のセラミックグ
リーン体を示す断面図である。
第３図はこの発明のその他の実施例の焼成前のセラミッ
クグリーン体を示す断面図である。
図において、１０はセラミックグリーン体、１２はセラ
ミックグリーンシート、１２ａはフィルム接触面、１４
はビヒクル層を示す。
特許出願人 株式会社 村田製作所
代理人 弁理士 山 １） 義 火
弟１図
第２図
第３ ロ
ｎFIG. 1 is a sectional view showing a ceramic green body before firing according to an embodiment of the present invention. FIG. 2 is a sectional view showing a ceramic green body before firing according to another embodiment of the present invention. FIG. 3 is a sectional view showing a ceramic green body before firing according to another embodiment of the present invention. In the figure, 10 is a ceramic green body, 12 is a ceramic green sheet, 12a is a film contact surface, 14
indicates the vehicle layer. Patent applicant Murata Manufacturing Co., Ltd. Agent Patent attorney Yama 1) Yoshihiro 1 Figure 2 Figure 3 Ron
Claims (1)
て一体焼成する、セラミック基板の製造方法。 ２ 前記セラミックグリーンシートはシート成形時のフ
ィルム面が外側になるように貼り合わせる、請求項１記
載のセラミック基板の製造方法。 ３ 前記ビヒクルは前記セラミックグリーンシートと同
じセラミック材料を含む、請求項１または２記載のセラ
ミック基板の製造方法。[Claims] 1. A method for manufacturing a ceramic substrate, in which ceramic green sheets are laminated together using a vehicle and then fired together. 2. The method of manufacturing a ceramic substrate according to claim 1, wherein the ceramic green sheets are bonded together so that the film surface at the time of sheet molding is on the outside. 3. The method of manufacturing a ceramic substrate according to claim 1 or 2, wherein the vehicle includes the same ceramic material as the ceramic green sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63321804A JPH02164777A (en) | 1988-12-19 | 1988-12-19 | Production of ceramic base board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63321804A JPH02164777A (en) | 1988-12-19 | 1988-12-19 | Production of ceramic base board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02164777A true JPH02164777A (en) | 1990-06-25 |
Family
ID=18136600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63321804A Pending JPH02164777A (en) | 1988-12-19 | 1988-12-19 | Production of ceramic base board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02164777A (en) |
-
1988
- 1988-12-19 JP JP63321804A patent/JPH02164777A/en active Pending
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