JPH0799263A - Manufacture of ceramic substrate - Google Patents
Manufacture of ceramic substrateInfo
- Publication number
- JPH0799263A JPH0799263A JP5262984A JP26298493A JPH0799263A JP H0799263 A JPH0799263 A JP H0799263A JP 5262984 A JP5262984 A JP 5262984A JP 26298493 A JP26298493 A JP 26298493A JP H0799263 A JPH0799263 A JP H0799263A
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- ceramic
- ceramic substrate
- ceramic green
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばハイブリッドＩ
Ｃやマルチチップモジュール等に用いるセラミック基板
の製造方法に関する。更に詳しくは、表面に多数個取り
用の切込溝を有するセラミック基板の製造方法に関する
ものである。BACKGROUND OF THE INVENTION The present invention is a hybrid I
The present invention relates to a method for manufacturing a ceramic substrate used for C, a multi-chip module, or the like. More specifically, the present invention relates to a method of manufacturing a ceramic substrate having a groove for cutting a large number on the surface.
【０００２】[0002]
【従来の技術】従来、上記のようなセラミック基板を製
造する場合、その製造効率を高めるために、比較的大き
な面積のセラミック基板の表面にスナップラインと呼ば
れる切込溝を形成し、その切込溝に沿って分割すること
によって所定の大きさのセラミック基板を多数個得る、
いわゆる多数個取りの手法が採用されている。2. Description of the Related Art Conventionally, when manufacturing a ceramic substrate as described above, in order to improve the manufacturing efficiency, a notch called a snap line is formed on the surface of a ceramic substrate having a relatively large area, and the notch is formed. By dividing along the groove, a large number of ceramic substrates of a predetermined size can be obtained.
A so-called multi-cavity method is adopted.
【０００３】上記のような多数個取り用の切込溝を有す
るセラミック基板を製造するに当たっては、従来一般に
製造すべきセラミック基板の素材となるセラミックグリ
ーンシートの表面に、予めカッター刃や金型等で格子状
その他所望形状の切込溝を形成し、それを焼成すること
によって表面に切込溝を有するセラミック基板を作製す
る。その基板を上記切込溝に沿って分割することによっ
て所定大きさのセラミック基板が多数個得られるもので
ある。In manufacturing a ceramic substrate having a groove for cutting a large number of pieces as described above, a cutter blade, a mold or the like is previously formed on the surface of a ceramic green sheet which is a material of a ceramic substrate to be generally manufactured in the past. A notch groove having a lattice shape or other desired shape is formed by and is fired to produce a ceramic substrate having notch grooves on the surface. By dividing the substrate along the cut grooves, a large number of ceramic substrates of a predetermined size can be obtained.
【０００４】[0004]
【発明が解決しようとする課題】ところが、上記のよう
な切込溝を形成したセラミックグリーンシートを、その
まま焼成すると、その焼成時に往々にしてセラミックグ
リーンシートが不均一に収縮し、隣り合う切込溝の間隔
がずれて寸法精度にバラツキを生じ、所定寸法のセラミ
ック基板が得られず、歩留りが低下する等の不具合があ
った。However, when the ceramic green sheet having the above-described notch grooves is fired as it is, the ceramic green sheet often shrinks non-uniformly during the firing, and the adjacent notches are cut. There are problems that the intervals of the grooves are displaced and the dimensional accuracy is varied, a ceramic substrate having a predetermined dimension cannot be obtained, and the yield is reduced.
【０００５】本発明は上記の問題点に鑑みて提案された
もので、焼成時の不均一な収縮を抑制して寸法精度のよ
いセラミック基板を得ることのできる製造方法を提供す
ることを目的とする。The present invention has been proposed in view of the above problems, and an object thereof is to provide a manufacturing method capable of obtaining a ceramic substrate having good dimensional accuracy while suppressing non-uniform shrinkage during firing. To do.
【０００６】[0006]
【課題を解決するための手段】上記の目的を達成するた
めに本発明によるセラミック基板の製造方法は、以下の
ようにしたものである。即ち、表面に多数個取り用の切
込溝を有するセラミック基板を製造するに当たり、製造
すべきセラミック基板の素材となる第１のセラミックグ
リーンシートの少なくとも一方の表面に切込溝を形成
し、その第１のセラミックグリーンシートより高い焼結
温度を有する第２のセラミックグリーンシートを上記第
１のセラミックグリーンシートの両面に積層して加圧密
着させ、その積層体を上記第２のセラミックグリーンシ
ートの焼結温度より低くかつ上記第１のセラミックグリ
ーンシートの焼結温度より高い温度で焼成することによ
って上記第１のセラミックグリーンシートのみを焼結さ
せ、次いで未焼結の第２のセラミックグリーンシートを
除去して、少なくとも一方の表面に切込溝を有するセラ
ミック基板を得ることを特徴とする。In order to achieve the above object, the method of manufacturing a ceramic substrate according to the present invention is as follows. That is, in manufacturing a ceramic substrate having a plurality of notch grooves on its surface, a notch groove is formed on at least one surface of a first ceramic green sheet which is a material of the ceramic substrate to be manufactured, A second ceramic green sheet having a sintering temperature higher than that of the first ceramic green sheet is laminated on both surfaces of the first ceramic green sheet and pressed against each other, and the laminated body is bonded to the second ceramic green sheet. Only the first ceramic green sheet is sintered by firing at a temperature lower than the sintering temperature and higher than the sintering temperature of the first ceramic green sheet, and then an unsintered second ceramic green sheet is obtained. It is characterized in that it is removed to obtain a ceramic substrate having a cut groove on at least one surface.
【０００７】[0007]
【作用】上記のように製造すべきセラミック基板の素材
となる第１のセラミックグリーンシートの少なくとも一
方の表面に切込溝を形成し、その第１のセラミックグリ
ーンシートの両側に、それよりも焼結温度の高い第２の
セラミックグリーンシートを積層した状態、すなわち２
枚の第２のセラミックグリーンシート間に第１のセラミ
ックグリーンシートを挟んだ状態で加圧密着させて焼成
することにより、その焼成時に第１のセラミックグリー
ンシートが第２のセラミックグリーンシートに拘束され
て前記従来のように不均一に収縮するのが防止され、隣
り合う切込溝の間隔にバラツキが生じることなく寸法精
度のよいセラミック基板を得ることが可能となる。The notch groove is formed on at least one surface of the first ceramic green sheet, which is the material of the ceramic substrate to be manufactured as described above, and the notch is formed on both sides of the first ceramic green sheet. A state in which the second ceramic green sheets having a high binding temperature are laminated, that is, 2
When the first ceramic green sheet is sandwiched between the second ceramic green sheets and pressed and adhered to each other, the first ceramic green sheet is restrained by the second ceramic green sheet during the firing. As a result, it is possible to prevent nonuniform contraction as in the prior art, and to obtain a ceramic substrate with good dimensional accuracy without causing variations in the intervals between the adjacent cut grooves.
【０００８】[0008]
【実施例】以下、本発明によるセラミック基板の製造方
法を、図１に示す工程説明図に基づいて順に具体的に説
明する。先ず、図１の（ａ）に示すようにセラミック基
板の素材となる第１のセラミックグリーンシート１を用
意する。その第１のセラミックグリーンシート（以下、
第１のグリーンシートという）１は、例えばセラミック
粉末にバインダーや可塑剤および溶剤を加えて、ボール
ミルやアトラクター等で混合してスラリーとし、そのス
ラリーをドクターブレード法等の通常の方法によりシー
ト状に形成すればよい。EXAMPLES A method of manufacturing a ceramic substrate according to the present invention will be specifically described below in order with reference to the process diagram shown in FIG. First, as shown in FIG. 1A, a first ceramic green sheet 1 which is a material for a ceramic substrate is prepared. The first ceramic green sheet (hereinafter,
The first green sheet) 1 is, for example, a ceramic powder to which a binder, a plasticizer, and a solvent are added and mixed by a ball mill, an attractor, or the like to form a slurry, and the slurry is formed into a sheet by an ordinary method such as a doctor blade method. It may be formed in.
【０００９】なお上記のようにシート状に形成したもの
を複数枚積層し、それを加圧密着させたものを第１のグ
リーンシートとして用いてもよい。その場合、上記の加
圧密着させる手段は通常の方法でよく、例えば５０〜３
００ｋｇｆ／ｃｍ2 、温度６０〜９０℃でホットプレス
すればよい。また第１のグリーンシート１の厚さは特に
制限はないが、３０〜２００μｍ程度が好適である。It is also possible to stack a plurality of the sheet-shaped ones as described above and press-contact them to use as the first green sheet. In that case, the means for applying pressure and contact may be a usual method, for example, 50 to 3
Hot pressing may be performed at 00 kgf / cm 2 and a temperature of 60 to 90 ° C. The thickness of the first green sheet 1 is not particularly limited, but is preferably about 30 to 200 μm.
【００１０】前記のセラミック粉末としては、従来のセ
ラミック基板に用いられる通常の原料を使用できる。例
えばアルミノ硼珪酸ガラス、軟化点６００〜８００℃の
非晶質ガラス、結晶化温度６００〜１０００℃の結晶化
ガラス等が使用できる。又これらにアルミナ、ジルコ
ン、ムライト、コージェライト、アノーサイト、シリカ
等のセラミックフィラーを添加したものでもよい。As the above-mentioned ceramic powder, the usual raw materials used for conventional ceramic substrates can be used. For example, aluminoborosilicate glass, amorphous glass having a softening point of 600 to 800 ° C., crystallized glass having a crystallization temperature of 600 to 1000 ° C., and the like can be used. It is also possible to add a ceramic filler such as alumina, zircon, mullite, cordierite, anorthite or silica to these.
【００１１】また前記のバインダーとしては、例えばポ
リビニルブチラール、メタアクリルポリマー、アクリル
ポリマー等を用い、可塑剤としては例えばフタル酸の誘
導体等を用いればよい。さらに溶剤としては例えばアル
コール類、ケトン類、塩素系有機溶剤等通常のものを使
用すればよい。As the binder, for example, polyvinyl butyral, methacrylic polymer, acrylic polymer or the like may be used, and as the plasticizer, for example, a derivative of phthalic acid may be used. Further, as the solvent, for example, an ordinary solvent such as alcohols, ketones, and chlorine-based organic solvents may be used.
【００１２】上記のようにして作成した第１のグリーン
シート１を所定の大きさに切断し、必要に応じてスクリ
ーン印刷等で導体ペーストを塗布する。多層基板とする
ときは、スルーホールにペーストを充填し、さらに配線
を印刷する。そして、図１の（ｂ）に示すように上記第
１のグリーンシート１の少なくとも一方の表面、すなわ
ち片面もしくは両面に切込溝１１を形成するもので、そ
の形成手段は従来の通常の方法でよく、例えばカッター
刃をグリーンシートの表面に押し当てたり、回転刃で切
り込む方法等で形成すればよい。The first green sheet 1 produced as described above is cut into a predetermined size, and a conductor paste is applied by screen printing or the like if necessary. When a multilayer board is used, the through holes are filled with paste, and wiring is printed. Then, as shown in FIG. 1B, the notch 11 is formed on at least one surface of the first green sheet 1, that is, one surface or both surfaces. The forming means is a conventional ordinary method. Well, for example, a cutter blade may be pressed against the surface of the green sheet, or a rotary blade may be used for cutting.
【００１３】上記切込溝１１の断面形状は、図の場合は
Ｖ字状に形成したが、Ｕ字状もしくはスリット状、その
他任意であり、少なくとも焼結後にハンドリングする際
に不用意に割れが生じない形状を選べばよい。また、上
記切込溝１１の深さは、例えば第１のグリーンシート１
の厚さ（前記のように積層するものにあっては全体厚
さ）の１／２０〜８／２０程度とすればよい。Although the cross-sectional shape of the cut groove 11 is formed in a V shape in the figure, it may be a U shape, a slit shape, or any other shape, and may be inadvertently cracked at least during handling after sintering. Choose a shape that does not occur. The depth of the cut groove 11 is, for example, the first green sheet 1
1/20 to 8/20 of the thickness (total thickness in the case of stacking as described above).
【００１４】次に、図１の（ｃ）に示すように上記第１
のグリーンシート１の両面に、第２のセラミックグリー
ンシート（以下、第２のグリーンシートという）２を積
層する。その第２のグリーンシート２は、上記第１のグ
リーンシート１と同様の要領で作製すればよく、その厚
さは第１のグリーンシート１の場合と同様に特に制限は
ないが、３０〜２００μｍ程度が好適である。Next, as shown in FIG. 1C, the first
A second ceramic green sheet (hereinafter referred to as a second green sheet) 2 is laminated on both sides of the green sheet 1. The second green sheet 2 may be produced in the same manner as the first green sheet 1, and the thickness thereof is not particularly limited as in the case of the first green sheet 1, but is 30 to 200 μm. The degree is suitable.
【００１５】なお第２のグリーンシート２に用いるセラ
ミック粉末は、通常のセラミック粉末を使用できるが、
上記第１のグリーンシート１より焼結温度の高いもので
なければならない。例えば第１のグリーンシート１とし
て焼結温度が１１００℃以下のものを用いる場合には、
第２のグリーンシート２としては、例えばアルミナ、酸
化ジルコニウム、窒化アルミニウム、窒化ホウ素、ムラ
イト、酸化マグネシウム、炭化ケイ素等を使用すること
ができる。なお、これらの粉末の粒度が粗すぎると、セ
ラミック基板の表面粗さが粗くなるため、平均粒径０．
５〜４μｍ程度が好適である。The ceramic powder used for the second green sheet 2 may be ordinary ceramic powder.
The sintering temperature must be higher than that of the first green sheet 1. For example, when the first green sheet 1 having a sintering temperature of 1100 ° C. or lower is used,
As the second green sheet 2, for example, alumina, zirconium oxide, aluminum nitride, boron nitride, mullite, magnesium oxide, silicon carbide or the like can be used. If the particle size of these powders is too coarse, the surface roughness of the ceramic substrate will become rough, so that the average particle size of 0.
About 5 to 4 μm is suitable.
【００１６】次に、上記のように第１のグリーンシート
１の両面に第２のグリーンシート２を積層したものを両
側から加圧密着させる。その加圧密着させる手段は通常
の方法でよく、それによって図１の（ｄ）に示すように
第１のグリーンシート１に形成した切込溝１１内に第２
のグリーンシート２の一部が進入する。Next, as described above, the second green sheet 2 laminated on both surfaces of the first green sheet 1 is pressed and adhered from both sides. The means for contacting under pressure may be an ordinary method, whereby a second groove is formed in the cut groove 11 formed in the first green sheet 1 as shown in FIG.
Part of the green sheet 2 enters.
【００１７】次いで、上記の積層体を、例えば同図
（ｅ）に示すようにトレーＴ等に載せて焼成するもの
で、その焼成方法は通常の方法でよい。ただし、焼成温
度は第１のグリーンシート１のみが焼結し、第２のグリ
ーンシートが焼結しない温度、すなわち第２のグリーン
シート２の焼結温度より低くかつ第１のグリーンシート
１の焼結温度より高い温度で焼成しなければならない。
また上記の積層体を載せるトレーＴは、例えば通常のア
ルミナ板を使用すればよいが、通気性のよい気孔率の高
いアルミナ板を使用すれば、隣り合う切込溝の寸法精度
が更に良くなり好適である。Next, the above-mentioned laminated body is placed on a tray T or the like and fired as shown in FIG. 2 (e), and the firing method may be a usual method. However, the firing temperature is a temperature at which only the first green sheet 1 sinters and the second green sheet does not sinter, that is, lower than the sintering temperature of the second green sheet 2 and the firing of the first green sheet 1. It must be fired at a temperature higher than the setting temperature.
For the tray T on which the above-mentioned laminated body is placed, for example, a normal alumina plate may be used, but if an alumina plate having good air permeability and high porosity is used, the dimensional accuracy of the adjacent cut grooves is further improved. It is suitable.
【００１８】上記のようにして焼成した後に、未焼結の
第２のグリーンシート２をブラシ等で除去すれば、同図
（ｆ）に示すように表面に切込溝１１を有する焼結した
セラミック基板１０が作製される。その作製された基板
表面の切込溝１１はバラツキが少なく、その切込溝１１
に沿って分割すれば、寸法精度のよい所定大きさのセラ
ミック基板が得られるものである。After firing as described above, if the unsintered second green sheet 2 is removed with a brush or the like, it is sintered with a groove 11 on the surface as shown in FIG. The ceramic substrate 10 is manufactured. The cut grooves 11 formed on the surface of the substrate have little variation, and the cut grooves 11 are
If it is divided along with, a ceramic substrate of a predetermined size with good dimensional accuracy can be obtained.
【００１９】なお、上記実施例は第１のグリーンシート
１の片面に切込溝１１を形成した後に、その両面に第２
のグリーンシート２を積層したが、図２の（ａ）に示す
ように切込溝１１を形成しない側の面に、予め第２のグ
リーンシート２を積層してから、他方の面に切込溝１１
を形成し、その表面に同図（ｂ）のように別の第２のグ
リーンシート２を積層して加圧密着させるようにしても
よい。In the above-described embodiment, after the cut groove 11 is formed on one surface of the first green sheet 1, the second groove is formed on both surfaces of the cut groove 11.
2 is laminated, but the second green sheet 2 is previously laminated on the surface on which the cutting groove 11 is not formed as shown in FIG. 2A, and then the other surface is cut. Groove 11
Alternatively, another second green sheet 2 may be laminated on the surface thereof as shown in FIG.
【００２０】また第１のグリーンシートを複数枚積層し
て１枚のセラミック基板を作製する場合には、それらを
積層してから切込溝を形成し、その両面に第２のグリー
ンシートを積層してもよいが、例えば図３に示すように
複数枚の第１のグリーンシート１を積層する前に切込溝
１１を形成してから、それら複数枚の第１のグリーンシ
ート１および第２のグリーンシート２を積層するように
してもよい。When a plurality of the first green sheets are laminated to form one ceramic substrate, the notch grooves are formed after laminating them, and the second green sheets are laminated on both sides thereof. However, for example, as shown in FIG. 3, after forming the cut groove 11 before laminating the plurality of first green sheets 1, the plurality of first green sheets 1 and the second green sheets 1 The green sheets 2 may be laminated.
【００２１】さらに図４に示すように１つの基板を作製
するための第１のグリーンシート１を複数枚設け、その
隣り合う第１のグリーンシート１・１間に第２のグリー
ンシート２を介在させて積層すると共に、その積層体の
両側に第２のグリーンシート２を積層し、それらを加圧
密着させて焼成することによって、複数枚のセラミック
基板を同時に作製することもできる。Further, as shown in FIG. 4, a plurality of first green sheets 1 for producing one substrate are provided, and a second green sheet 2 is interposed between the adjacent first green sheets 1 and 1. It is also possible to fabricate a plurality of ceramic substrates at the same time by stacking them and stacking the second green sheets 2 on both sides of the stacked body, pressing them into close contact and firing.
【００２２】また上記各実施例は、いずれも製造すべき
セラミック基板の片側にのみ切込溝を形成したが、両側
に設けてもよい。In each of the above embodiments, the cut groove is formed only on one side of the ceramic substrate to be manufactured, but it may be provided on both sides.
【００２３】〔実験例１〕ＰｂＯを３０．７重量％、Ｓ
ｉＯ2 を５１．７重量％、Ａｌ2 Ｏ3 を８．４重量％、
Ｂ2 Ｏ3 を７．３重量％、ＣａＯを１．９重量％混合し
た平均粒径２・２μｍのガラス粉末と、平均粒径１．７
μｍのアルミナ粉末を等重量比率で混合した。その混合
粉末１００重量部に、ポリビニルブチラール９重量部、
フタル酸ジイソブチル７重量部、イソプロピルアルコー
ル４０重量部、およびトリクロロエタン２０重量部を加
え、ボールミルで２４時間混合してスラリーとした。[Experimental Example 1] 30.7 wt% of PbO and S
iO 2 is 51.7% by weight, Al 2 O 3 is 8.4% by weight,
Glass powder having an average particle size of 2.2 μm, in which 7.3% by weight of B 2 O 3 and 1.9% by weight of CaO are mixed, and an average particle size of 1.7
μm alumina powder was mixed in an equal weight ratio. 100 parts by weight of the mixed powder, 9 parts by weight of polyvinyl butyral,
Diisobutyl phthalate (7 parts by weight), isopropyl alcohol (40 parts by weight), and trichloroethane (20 parts by weight) were added and mixed in a ball mill for 24 hours to form a slurry.
【００２４】このスラリーをドクターブレード法により
延ばして厚さ１３１μｍのセラミックグリーンシートを
作製し、これを５枚積層して圧力１５０ｋｇｆ／ｃ
ｍ2 、温度８５℃で加圧密着させ、寸法８０ｍｍ角の第
１のグリーンシート１を得た。なお上記第１のグリーン
シート１の焼結温度は７２０℃であった。This slurry was spread by the doctor blade method to prepare a ceramic green sheet having a thickness of 131 μm, and five ceramic green sheets were laminated to form a pressure of 150 kgf / c.
The first green sheet 1 having a size of 80 mm square was obtained by press-contacting with m 2 at a temperature of 85 ° C. The sintering temperature of the first green sheet 1 was 720 ° C.
【００２５】一方、上記アルミナ粉末の代わりに平均粒
径１．３μｍの酸化ジルコニウム粉末を使用した以外は
上記第１のグリーンシート１と同材質とし、積層するこ
となく上記と同様の要領で厚さ１４５μｍの第２のグリ
ーンシート２を作製した。なお上記第２のグリーンシー
ト２の焼結温度は１６００℃であった。On the other hand, except that zirconium oxide powder having an average particle size of 1.3 μm was used instead of the alumina powder, the same material as that of the first green sheet 1 was used, and the thickness was the same as the above without stacking. A second green sheet 2 of 145 μm was produced. The sintering temperature of the second green sheet 2 was 1600 ° C.
【００２６】上記第１のグリーンシート１の片面に、カ
ッターを押し当てて深さ２００μｍの断面Ｖ字状の切込
溝１１を、シート全面に格子状に形成した。なお、隣り
合う切込溝１１・１１間の間隔は２０ｍｍとし、その寸
法精度は±１０μｍ以内であった。A cutter was pressed against one surface of the first green sheet 1 to form cut grooves 11 having a V-shaped cross section with a depth of 200 μm in a lattice pattern on the entire surface of the sheet. The interval between the adjacent cut grooves 11 was 20 mm, and the dimensional accuracy was within ± 10 μm.
【００２７】次に、上記第１のグリーンシート１の両面
に、第２のグリーンシート２を１枚ずつ重ね圧力１５０
ｋｇｆ／ｃｍ2 、温度８５℃で加圧密着させて積層体を
得た。その積層体を平面方向における単位長さ当たりの
反り量が０．０５％以下の平坦度を有する気孔率７０％
のアルミナ板よりなるトレーＴ上に置き、温度５２０℃
で３時間加熱したのち温度９００℃で１時間加熱するこ
とによって、第１のグリーンシート１のみを焼結させ
た。次いで、上記積層体の表面をナイロン製のブラシで
擦ることにより、未焼成の第２のグリーンシート２を除
去して表面に切込溝１１を有するセラミック基板を作製
した。Next, the second green sheets 2 are superposed on both sides of the first green sheet 1 one by one and the pressure 150 is applied.
A laminate was obtained by pressing and adhering at a temperature of 85 ° C. at a kgf / cm 2 . The laminated body has a flatness with a warp amount per unit length in the plane direction of 0.05% or less, and a porosity of 70%.
Place on a tray T made of alumina plate at a temperature of 520 ° C.
After heating for 3 hours at 900 ° C. for 1 hour, only the first green sheet 1 was sintered. Next, the surface of the laminate was rubbed with a nylon brush to remove the unfired second green sheet 2 to produce a ceramic substrate having a cut groove 11 on the surface.
【００２８】その結果、上記セラミック基板の隣り合う
切込溝１１・１１間の間隔のバラツキは、±０．０５％
以内であり、極めて寸法精度のよいセラミック基板が得
られた。As a result, the variation in the distance between the adjacent cut grooves 11 of the ceramic substrate is ± 0.05%.
Within this range, a ceramic substrate with extremely high dimensional accuracy was obtained.
【００２９】〔実験例２〕上記実験例１においてカッタ
ーにより切込溝を形成する代わりに、回転するダイアモ
ンドソーにより第１のグリーンシートの片面に深さ５０
μｍの断面Ｕ字状の切込溝をシート全面に格子状に形成
した。隣り合う切込溝の間隔は上記と同様に２０ｍｍと
し、その寸法精度は±１０μｍ以内であった。それ以外
は上記実験例１と同じ条件で表面に切込溝１１を有する
セラミック基板を作製した。その結果、上記実験例１ど
同様の結果が得られた。[Experimental Example 2] Instead of forming the notch with the cutter in Experimental Example 1 described above, a rotating diamond saw is used to form a depth of 50 on one side of the first green sheet.
Notch grooves having a U-shaped cross section of μm were formed in a lattice pattern on the entire surface of the sheet. The interval between the adjacent cut grooves was 20 mm as in the above, and the dimensional accuracy was within ± 10 μm. Other than that, a ceramic substrate having a cut groove 11 on the surface was produced under the same conditions as in Experimental Example 1 above. As a result, the same results as in Experimental Example 1 were obtained.
【００３０】〔比較例１〕上記各実験例における第２の
グリーンシート２を使用しなかった以外は、上記と同じ
条件で上記実験例１および実験例２と同様の２種類のセ
ラミック基板を作製した。その各セラミック基板の隣り
合う切込溝１１・１１間の間隔のバラツキは、いずれも
±０．５％程度あり、上記実験例の場合に比べて寸法精
度がかなり低下することがわかった。[Comparative Example 1] Two types of ceramic substrates similar to those in Experimental Example 1 and Experimental Example 2 were prepared under the same conditions as above except that the second green sheet 2 in each Experimental Example was not used. did. It was found that the variation in the interval between the adjacent cut grooves 11, 11 of each ceramic substrate was about ± 0.5%, and the dimensional accuracy was considerably reduced as compared with the case of the above experimental example.
【００３１】〔比較例２〕前記各実験例において第１の
グリーンシートに第２のグリーンシートを積層する前に
第１のグリーンシートに切込溝１１を形成する代わり
に、積層した後に、その一方の表面に第２のグリーンシ
ートを貫通させて第１のグリーンシートに切込溝１１を
形成した以外は、上記と同じ条件で上記実験例１および
実験例２と同様の２種類のセラミック基板を作製した。
その結果、各セラミック基板の隣り合う切込溝間の間隔
のバラツキは、いずれも±１％程度あり、上記比較例１
の場合によりも更に寸法精度が低下することがわかっ
た。[Comparative Example 2] Instead of forming the cut groove 11 in the first green sheet before laminating the second green sheet in the above-mentioned respective experimental examples, after laminating it, Two types of ceramic substrates similar to Experimental Example 1 and Experimental Example 2 under the same conditions as described above except that the second green sheet was penetrated to one surface to form the cut groove 11 in the first green sheet. Was produced.
As a result, the variation in the distance between the adjacent cut grooves of each ceramic substrate was about ± 1% in all cases.
It was found that the dimensional accuracy is further deteriorated even in the case of.
【００３２】以上の結果から明らかなように本発明に基
づく上記実験例によれば、隣り合う切込溝１１・１１間
の間隔のバラツキの少ない極めて寸法精度のよいセラミ
ック基板を作製できるもので、その理由としては、先ず
第１のグリーンシート１の両面に第２のグリーンシート
２を積層して焼成するようにしたことによって、第１の
グリーンシート１が、その両面に積層した第２のグリー
ンシート２に拘束されて、焼成時に厚さ方向には収縮す
るが、面方向の収縮は抑制されて収縮率自体および収縮
率のバラツキが少なくなるためと思われる。As is clear from the above results, according to the above experimental example according to the present invention, it is possible to manufacture a ceramic substrate having extremely small dimensional accuracy with little variation in the interval between the adjacent cut grooves 11. The reason is that first the second green sheets 2 are laminated on both sides of the first green sheet 1 and fired. Although it is constrained by the sheet 2 and contracts in the thickness direction during firing, it is considered that the contraction in the surface direction is suppressed and the contraction rate itself and the variation in the contraction rate are reduced.
【００３３】また本発明のように第１のグリーンシート
１の表面に切込溝１１を形成し、その表面に第２のグリ
ーンシート２を積層して加圧密着させることにより、上
記切込溝１１内に第２のグリーンシート２の一部が入り
込むため、その切込溝１１が開放されている場合よりも
前記面方向の収縮に対する抑制力が更に増大されて収縮
量およびバラツキが低減されるためと考えられる。Further, the notch groove 11 is formed on the surface of the first green sheet 1 as in the present invention, and the second green sheet 2 is laminated on the surface of the notch groove 11 and brought into pressure contact, whereby the notch groove is formed. Since a part of the second green sheet 2 enters into the inside 11, the suppressing force against the contraction in the surface direction is further increased as compared with the case where the cut groove 11 is opened, and the contraction amount and the variation are reduced. It is thought to be because.
【００３４】[0034]
【発明の効果】以上説明したように、本発明によるセラ
ミック基板の製造方法によれば、隣り合う切込溝１１・
１１間の間隔のバラツキの少ない極めて寸法精度のよい
セラミック基板を作製できるもので、歩留が向上し生産
効率を大幅に増大させることができる等の効果がある。As described above, according to the method for manufacturing a ceramic substrate according to the present invention, the adjacent cut grooves 11.
It is possible to manufacture a ceramic substrate having a very small dimensional accuracy with a small variation in the interval between the 11 and to bring about an effect such that the yield is improved and the production efficiency can be greatly increased.
【図１】本発明によるセラミック基板の製造方法の工程
説明図。FIG. 1 is a process explanatory view of a method for manufacturing a ceramic substrate according to the present invention.
【図２】製造プロセスの変更例を示す工程説明図。FIG. 2 is a process explanatory view showing a modified example of the manufacturing process.
【図３】第１のセラミックグリーンシートを複数枚積層
する場合の工程例の説明図。FIG. 3 is an explanatory view of a process example in the case of stacking a plurality of first ceramic green sheets.
【図４】複数枚のセラミック基板を同時に製造する場合
の程説明図。FIG. 4 is an explanatory diagram for a case where a plurality of ceramic substrates are manufactured simultaneously.
１ 第１のセラミックグリーンシート ２ 第２のセラミックグリーンシート １０ セラミック基板 １１ 切込溝 Ｔ トレー 1 First Ceramic Green Sheet 2 Second Ceramic Green Sheet 10 Ceramic Substrate 11 Notch Groove T Tray
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０４Ｂ 33/32 Ｈ０５Ｋ 1/02 Ｇ 3/00 Ｊ Ｘ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI Technical display location C04B 33/32 H05K 1/02 G 3/00 J X
Claims (1)
ラミック基板を製造するに当たり、製造すべきセラミッ
ク基板の素材となる第１のセラミックグリーンシートの
少なくとも一方の表面に切込溝を形成し、その第１のセ
ラミックグリーンシートより高い焼結温度を有する第２
のセラミックグリーンシートを上記第１のセラミックグ
リーンシートの両面に積層して加圧密着させ、その積層
体を上記第２のセラミックグリーンシートの焼結温度よ
り低くかつ上記第１のセラミックグリーンシートの焼結
温度より高い温度で焼成することによって上記第１のセ
ラミックグリーンシートのみを焼結させ、次いで未焼結
の第２のセラミックグリーンシートを除去して、少なく
とも一方の表面に切込溝を有するセラミック基板を得る
ことを特徴とするセラミック基板の製造方法。1. When manufacturing a ceramic substrate having a groove for collecting a large number on the surface, a groove is formed on at least one surface of a first ceramic green sheet which is a material of the ceramic substrate to be manufactured. And a second ceramic green sheet having a higher sintering temperature than the first ceramic green sheet.
Ceramic green sheets are laminated on both sides of the first ceramic green sheet and pressed against each other, and the laminated body is lower than the sintering temperature of the second ceramic green sheet and the first ceramic green sheet is baked. By firing at a temperature higher than the binding temperature, only the first ceramic green sheet is sintered, then the unsintered second ceramic green sheet is removed, and a ceramic having a cut groove on at least one surface. A method for manufacturing a ceramic substrate, which comprises obtaining a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5262984A JP2856045B2 (en) | 1993-09-27 | 1993-09-27 | Manufacturing method of ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5262984A JP2856045B2 (en) | 1993-09-27 | 1993-09-27 | Manufacturing method of ceramic substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0799263A true JPH0799263A (en) | 1995-04-11 |
| JP2856045B2 JP2856045B2 (en) | 1999-02-10 |
Family
ID=17383287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5262984A Expired - Fee Related JP2856045B2 (en) | 1993-09-27 | 1993-09-27 | Manufacturing method of ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2856045B2 (en) |
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| JP2002290040A (en) * | 2001-03-23 | 2002-10-04 | Kyocera Corp | Method of manufacturing ceramic board |
| EP1272020A1 (en) * | 2000-11-27 | 2003-01-02 | Murata Manufacturing Co., Ltd. | Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
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| JP2003192454A (en) * | 2001-09-10 | 2003-07-09 | Noritake Co Ltd | Production method of sheet member |
| WO2003072325A1 (en) * | 2002-02-26 | 2003-09-04 | Murata Manufacturing Co.,Ltd. | Ceramic multilayer substrate manufacturing method and unfired composite multilayer body |
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1993
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| EP1272020A4 (en) * | 2000-11-27 | 2007-07-04 | Murata Manufacturing Co | Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| JP2002185136A (en) * | 2000-12-19 | 2002-06-28 | Murata Mfg Co Ltd | Method of manufacturing multilayered ceramic board |
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| JP2002290040A (en) * | 2001-03-23 | 2002-10-04 | Kyocera Corp | Method of manufacturing ceramic board |
| US6938332B2 (en) | 2001-06-29 | 2005-09-06 | Murata Manufacturing Co., Ltd. | Method for manufacturing multilayer ceramic substrates |
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| JP2003192454A (en) * | 2001-09-10 | 2003-07-09 | Noritake Co Ltd | Production method of sheet member |
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