JPH02239151A - Dielectric porcelain composition for temperature compensation - Google Patents
Dielectric porcelain composition for temperature compensationInfo
- Publication number
- JPH02239151A JPH02239151A JP1059450A JP5945089A JPH02239151A JP H02239151 A JPH02239151 A JP H02239151A JP 1059450 A JP1059450 A JP 1059450A JP 5945089 A JP5945089 A JP 5945089A JP H02239151 A JPH02239151 A JP H02239151A
- Authority
- JP
- Japan
- Prior art keywords
- temp
- temperature
- ceramic composition
- dielectric ceramic
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 30
- 229910052573 porcelain Inorganic materials 0.000 title abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 20
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract description 6
- 238000009413 insulation Methods 0.000 abstract description 6
- 238000005245 sintering Methods 0.000 abstract description 4
- 239000003989 dielectric material Substances 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 238000002156 mixing Methods 0.000 abstract 1
- 238000010304 firing Methods 0.000 description 13
- 239000000843 powder Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- PLDDOISOJJCEMH-UHFFFAOYSA-N neodymium oxide Inorganic materials [O-2].[O-2].[O-2].[Nd+3].[Nd+3] PLDDOISOJJCEMH-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011656 manganese carbonate Substances 0.000 description 1
- 235000006748 manganese carbonate Nutrition 0.000 description 1
- 229910000016 manganese(II) carbonate Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は温度補償用誘電体磁器組成物に係り,特に高い
Q値を有し,高誘電率であり,誘電率温〔発明が解決し
ようとする課題〕
ところがこれらの電極材料は高価であるため,結果的に
積層チップコンデンサのコストを著しく高くすることに
なる。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a dielectric ceramic composition for temperature compensation, which has a particularly high Q value, a high dielectric constant, and a dielectric constant temperature [which the invention can solve]. However, since these electrode materials are expensive, they end up significantly increasing the cost of multilayer chip capacitors.
内部電極の電極材料として,コストの安い銀一パラジウ
ム(Ag−Pd)合金を使用すると,安いコストで積層
チップコンデンサの製造が可能である0この場合には,
誘電体材料の焼成温度はAgの蒸発等が起きないように
1200℃以下に下げる必要がある。By using a low-cost silver-palladium (Ag-Pd) alloy as the electrode material for the internal electrodes, it is possible to manufacture multilayer chip capacitors at low cost. In this case,
The firing temperature of the dielectric material must be lowered to 1200° C. or lower to prevent evaporation of Ag.
ところが,従来の誘電体材料では焼成温度を下げると訪
電率や絶縁抵抗(I.R)が低下し,素子の信頼性等で
満足な特性が得られないという問題点がある。However, conventional dielectric materials have a problem in that when the firing temperature is lowered, the contact rate and insulation resistance (IR) decrease, making it impossible to obtain satisfactory characteristics such as device reliability.
従って,本発明の目的は,高いQ値を有し,高誘電率,
高絶縁抵抗であってかつ,誘電率の温度係数が小さい誘
電体磁器組成物の本焼成温度を従来のものより約140
℃〜300℃低下させた焼結性良好な誘電体磁器組成物
を提供することである。Therefore, the object of the present invention is to have a high Q value, a high dielectric constant,
The main firing temperature of a dielectric ceramic composition with high insulation resistance and a small temperature coefficient of permittivity has been increased to approximately 140°C compared to conventional ones.
It is an object of the present invention to provide a dielectric ceramic composition with good sintering properties and a temperature lowered by 300°C to 300°C.
上記目的を達成するため,本発明においては誘電体磁器
組成物として,
BaO : 1、Qmol%〜1 5. Q mo
l%Ti02 : 5 0.O mol %〜6
7. 5 mol%Nd203 = 2 0.0m
Ol%〜4 7. 5 mol %の合計が100部
からなる主成分に対して,副成分とし−(,MnOを0
〜0. 3wt%, PbsGe30uを2〜20
wt%, SiO202をα’3〜10wt%添加含
有することを特徴とする誘電体磁器組成物を用いるもの
である0
〔作用〕
これにより,高誘電率,高絶縁抵抗である上,誘電率の
温度係数が小さく,焼成温度が従来より低いにも拘らず
,焼結性良好な誘電体磁器組成物を提供できる。In order to achieve the above object, the dielectric ceramic composition of the present invention contains BaO: 1, Qmol% ~ 1 5. Q mo
l%Ti02: 5 0. Omol%~6
7. 5 mol%Nd203 = 2 0.0m
Ol%~4 7. For the main component with a total of 5 mol % of 100 parts, the subcomponent -(, MnO is 0
~0. 3 wt%, 2 to 20 PbsGe30u
wt%, SiO2O2 is added at α'3 to 10 wt%. Although the temperature coefficient is small and the firing temperature is lower than conventional ones, it is possible to provide a dielectric ceramic composition with good sinterability.
本発明の実施例を詳細に説明する。 Examples of the present invention will be described in detail.
本発明の誘電体磁器組成物を得るため,出発原科としテ
, BaCOs, Ti02, Nd.03,
MnCO3, PbO,ceo., SiO20
.の各粉末を用いる。なお,これらの原料粉末は純度9
5%のNd203を除いて何れも純度98%以上のもの
を使用する。In order to obtain the dielectric ceramic composition of the present invention, starting materials such as Te, BaCOs, Ti02, Nd. 03,
MnCO3, PbO, CEO. , SiO20
.. Each powder is used. In addition, these raw material powders have a purity of 9
Except for 5% Nd203, all the materials used have a purity of 98% or higher.
次に,本発明の誘電体磁器組成物の主成分とな7) B
aCO3 , TiOz , Nd2 03と添加物と
なるMnCO ,の各粉末を後掲の第1表の組成範囲と
なるように秤量し,これをボールミル中で湿式混合処理
する。Next, the main component of the dielectric ceramic composition of the present invention7) B
Powders of aCO3, TiOz, Nd2O3, and MnCO as an additive are weighed so as to have the composition range shown in Table 1 below, and wet-mixed in a ball mill.
さらにこの混合物を脱水乾燥し,直径609!11,高
さ50+wの円柱状に加圧成形し,1100℃〜120
0℃の温度条件で,2時間空気中で仮焼成を行う。その
後,この仮焼成物をさらに粉砕する。Furthermore, this mixture was dehydrated and dried, pressure-molded into a cylindrical shape with a diameter of 609!11 and a height of 50+w, and
Preliminary firing is performed in air for 2 hours at a temperature of 0°C. Thereafter, this calcined product is further crushed.
この粉砕粉末に副成分としてpbs Ge3 011と
SiO202を第1表の組成範囲となるように秤量し,
これを再度ボールミル中で湿式混合処理を行う。PBS Ge3 011 and SiO202 as subcomponents were weighed to this pulverized powder so as to have the composition range shown in Table 1.
This is wet-mixed again in a ball mill.
脱水乾燥後に粘結剤としてポリビニルアルコール(PV
A)を適当量加え,約3トン/dの圧力を加えて直径1
6.5■,厚み0.6一の円板に加圧●成形する。この
後900℃〜1300℃の温度条件で2時間本焼成する
。Polyvinyl alcohol (PV) is added as a binder after dehydration and drying.
Add an appropriate amount of A) and apply a pressure of about 3 tons/d to a diameter of 1
Press and form into a disk with a thickness of 6.5cm and a thickness of 0.6mm. Thereafter, main firing is performed for 2 hours at a temperature of 900°C to 1300°C.
このようにして得られた各誘電体磁器組成物の両端面に
銀電極を焼きつけて磁器コンデンサとする。これらの磁
器コンデンサ試料の誘電率(’−),Q値,誘電率の温
度係数(T管C)PPM,/’c,絶縁抵抗(I−R)
等を測定し,得られた結果を第1表に示す。Silver electrodes are baked onto both end faces of each dielectric ceramic composition thus obtained to produce a ceramic capacitor. Dielectric constant ('-), Q value, temperature coefficient of dielectric constant (T tube C) PPM, /'c, insulation resistance (I-R) of these ceramic capacitor samples
etc., and the results obtained are shown in Table 1.
第1表においては,T−Cは+20℃を基準にして+2
0℃〜85℃の温度範囲で周波数I KHzの条件で測
定した。また,本焼成時の焼成温度及び焼結性について
も併記した。In Table 1, T-C is +2 with reference to +20℃.
Measurements were made at a frequency of I KHz in a temperature range of 0°C to 85°C. The firing temperature and sinterability during main firing are also listed.
さらに,第1表中,試料番号に○印のついたものは本発
明の実施例の範囲内のものであり,X印のついたものは
本発明の範囲外のものである。Further, in Table 1, the sample numbers marked with a circle are within the scope of the embodiments of the present invention, and those marked with an X are outside the scope of the present invention.
以下余白
第1表から,本発明の誘電体磁器組成物では誘電率(ε
.),Q値,絶縁抵抗(工・R)が高い上に,誘電率の
温度係数が小さク,シかも焼成温度が900℃〜116
0℃と従来のものよシ140℃〜400℃も低くするこ
とが出来,焼結性も良好なものが得られることが明白で
ある0
次に本発明の誘電体磁器組成物の組成範囲の限定理由に
ついて第1表と第1図を用いて説明する0第1図は本発
明の誘電体磁器組成物におけるPbsGesOuとSi
O20.の添加量と焼成温度の関係図である0
まず, BaOがl, Q mol%以下では訪電率ε
.Q値が小さくなり,誘電率の温度係数(T−C)が十
側へ大きくなり実用的でない(第1表階22〜24参照
)。From Table 1 in the margin below, it is clear that the dielectric ceramic composition of the present invention has a dielectric constant (ε
.. ), Q value, insulation resistance (work/R) are high, the temperature coefficient of dielectric constant is small, and the firing temperature is 900℃~116℃.
It is clear that the temperature can be lowered by 140 to 400 degrees Celsius compared to the conventional one, and a product with good sinterability can be obtained. The reason for the limitation will be explained using Table 1 and FIG. 1. FIG.
O20. This is a diagram showing the relationship between the addition amount of
.. The Q value becomes small and the temperature coefficient of dielectric constant (T-C) increases toward the 0 side, making it impractical (see floors 22 to 24 in Table 1).
一方, BaOが1 5. 0 mol%以上になる
と,Qが小さくなる(第1表順1〜3参照)。On the other hand, BaO is 15. When it becomes 0 mol% or more, Q becomes small (see order 1 to 3 in Table 1).
次にTie,が5 0. O mol%以下では焼結性
が悪く,誘電率ε.も低い(第1表Na9,15.21
参照)。Next is Tie, 50. Below O mol%, sinterability is poor and the dielectric constant ε. is also low (Table 1 Na9, 15.21
reference).
またTie.が6 7. 5 mol%以上でも誘電率
(C.)が小さ<.Q値が小さい(第1表Nα4,10
参照)○Nd20.が20.OmOA%以下ではQ値が
小さくなる(第1表階1,4参照)。Also Tie. 6 7. The dielectric constant (C.) is small even at 5 mol% or more. Q value is small (Table 1 Nα4,10
Reference)○Nd20. is 20. Below OmOA%, the Q value becomes small (see floors 1 and 4 in Table 1).
一方, Nd.03が4 7. 5 mol%以上で
は.焼結性が悪く,誘電率ε.も低い(第1表随21参
照)0またMnOが全く添加しなくても実用的には問題
がないが,0。3wt%まで添加することによって絶縁
抵抗(I−R)が向上し.訪電率の温度係数も有利にな
る。しかし,Q,3wt%以上添加すると焼結性が悪く
,緻密な磁器組成物が得られない(第1表Na5−3.
19−3参照)。On the other hand, Nd. 03 is 4 7. 5 mol% or more. Poor sinterability and dielectric constant ε. Although there is no practical problem even if MnO is not added at all, the insulation resistance (I-R) is improved by adding up to 0.3 wt%. The temperature coefficient of the power visit rate will also be advantageous. However, if more than 3 wt% of Q is added, the sinterability is poor and a dense porcelain composition cannot be obtained (Table 1 Na5-3.
(See 19-3).
Pb,,(}e30uとSiO202の添加量は焼成温
度に影響するが,第1図からも明らかな如< , Pb
6Qe3 0 I1 が2wt%以下では焼成温度が1
200℃以上と低くならず,本発明の目的に合致しない
(第1表INI 5 −4.5−5.19−4.19−
5および第1図参照)。Pb, , (} The amount of addition of e30u and SiO202 affects the firing temperature, but as is clear from Fig. 1, Pb
When 6Qe3 0 I1 is less than 2 wt%, the firing temperature is 1
The temperature is not lower than 200°C, which does not meet the purpose of the present invention (Table 1 INI 5-4.5-5.19-4.19-
5 and Figure 1).
またpbs Ge3 011の添加童が2 0 Wt
%以上トナルと,焼成温度は低下するが,焼結性が悪く
なるばかりでなく,電気特性も非常に悪くなり,緻密な
誘電体磁器組成物が得られなくなる(第1表『qα5−
10.19−10参照)。更にGeO2原料が高価なも
のであるため,裂品のコスト高につながる。In addition, the addition of pbs Ge3 011 was 20 Wt.
% or more, the firing temperature decreases, but not only does the sinterability worsen, but the electrical properties also become extremely poor, making it impossible to obtain a dense dielectric ceramic composition (Table 1 "qα5-
10.19-10). Furthermore, since the GeO2 raw material is expensive, this leads to high costs for split products.
またsio2はPb,Ge3011と併合して使用する
ことによシ,焼結温度の低下に寄与する。8 i0,が
0.3wt%以下では焼結温度低下の効果が得られず,
lQwt%以上では緻密な誘電体磁器組成物にならず,
誘電率が小さくなる(第1表NIl5−15.19−I
O,19−16参照)。Furthermore, when sio2 is used in combination with Pb and Ge3011, it contributes to lowering the sintering temperature. 8 If i0, is less than 0.3 wt%, the effect of lowering the sintering temperature cannot be obtained,
If it exceeds 1Qwt%, a dense dielectric ceramic composition cannot be obtained.
The dielectric constant becomes smaller (Table 1 NIl5-15.19-I
(See O, 19-16).
なお,第2図は本発明の誘電体磁器組成物の主成分の組
成範囲を示す成分図である。この主成分の範囲内に副成
分としてMnOを0〜Q, 3 wt%,Pbs Ge
s O uを2〜20Wt%, 8i0.をα’r=
1 0 wt 4o添加含有せしめたものが本発明で
ある。Note that FIG. 2 is a composition diagram showing the composition range of the main components of the dielectric ceramic composition of the present invention. Within the range of this main component, MnO is added as a subcomponent at 0 to Q, 3 wt%, Pbs Ge
s O u at 2 to 20 Wt%, 8i0. α'r=
The present invention is one in which 10 wt 4o is added.
従って,例えば8Q wt%Ag − 2 0 wt%
Pdの合金を内部電極とする温度補償用積層チップコン
デンサ等を低コストで製造することが可能となった0Therefore, for example, 8Q wt%Ag - 20 wt%
It has become possible to manufacture temperature-compensating multilayer chip capacitors using Pd alloys as internal electrodes at low cost.
第1図は本発明の誘電体磁器組成物のpb 5 Ge3
0 11と8i0,の添加量と焼成温度の関係図,第
2図は本発明の誘電体磁器組成物の主成分の組成範囲を
示す三成分系図である。
特許出願人 ティーディーケイ株式会社代理人弁理士
山 谷 晧 榮(外1名)〔発明の効果〕
本発明のような組成の誘電体磁器組成物を用いることに
より,温度補償用誘電体磁器組成物として優れた特性を
有する磁器組成物を,焼成温度が従来のものよυ140
℃〜400℃も低くしたまま得ることが出来る。
第2図
手続補正書
(自発)
補正の内容
1.事件の表示
平成1年特許願第5
50号
住所 東京都中央区日本橋一丁目13番1号名称 (3
06)ティーディーケイ株式会社代表者 佐 藤 博
4.代理人
住所 東京都千代田区神田淡路町1丁目19番8号6.
補正の対象
7.補正の内容
明細書の特許請求の範囲、発明の詳
細な説明の各欄及び図面
別紙の通り
1.明細書第1頁第4行〜第13行に記載の特許請求の
範囲を下記の通り全文補正する。
「温度補償用誘電体磁器組成物として、B a O
1.O molχ〜15.0IIlo]χT i
O 2 50.0 molχ〜67.5 molχN
d Osyt 20.0 notχ〜47.5 m
olχ以上の合計が100部から成る主成分に対して、
副成分として、MnO O 〜0,3w
tXとP b5G8so++ 2 〜2 0wt
χとS io20.3〜1 0wtχを
添加含有したことを特徴とする温度補償用誘電体磁器組
成物。」
2.同第4頁第2行に記載のrNdzozJを「Nd(
)1/zJと補正する。
3,同第5頁第3行に記載のrNdzozJを「Ndo
s/tJと補正する。
4.同頁第6行に記載の「直径609niJを「60N
Mφ」と補正する。
?.同第10頁第2行に記載のrNdzOJをrNdo
zz■」と補正する。
6.同頁第4行に記載のrNdzo*JをrNdo37
■」と補正する。
7,第2図を別紙の通り補正する。
以上
万Q2Figure 1 shows the pb 5 Ge3 dielectric ceramic composition of the present invention.
FIG. 2 is a ternary component diagram showing the composition range of the main components of the dielectric ceramic composition of the present invention. Patent Applicant TDC Co., Ltd. Representative Patent Attorney Akira Yamatani (and 1 other person) [Effects of the Invention] By using a dielectric ceramic composition having a composition as in the present invention, a dielectric ceramic composition for temperature compensation can be obtained. The firing temperature of the porcelain composition, which has excellent properties as a product, is υ140 mm compared to the conventional one.
It can be obtained at temperatures as low as 400°C to 400°C. Figure 2 Procedural amendment (voluntary) Contents of amendment 1. Display of the incident 1999 Patent Application No. 5 50 Address 1-13-1 Nihonbashi, Chuo-ku, Tokyo Name (3
06) TDC Co., Ltd. Representative Hiroshi Sato 4. Agent address: 1-19-8-6, Kanda-Awajicho, Chiyoda-ku, Tokyo.
Target of correction 7. Contents of the amendment As per the claims of the specification, each column of the detailed description of the invention, and the attached drawings, 1. The full text of the claims set forth in lines 4 to 13 of page 1 of the specification is amended as follows. “As a dielectric ceramic composition for temperature compensation, B a O
1. O molχ~15.0IIlo]χT i
O2 50.0 molχ~67.5 molχN
d Osyt 20.0 notχ~47.5 m
For principal components whose total is 100 parts over olχ,
As a subcomponent, MnO O ~0.3w
tX and P b5G8so++ 2 ~ 2 0wt
A dielectric ceramic composition for temperature compensation, characterized in that it additionally contains χ and Sio20.3 to 10wtχ. ” 2. The rNdzozJ described in the 2nd line of page 4 of the same page is changed to “Nd(
)1/zJ. 3. rNdzozJ described on page 5, line 3 of the same page is “Ndo
Correct it as s/tJ. 4. The “diameter 609niJ” written on the 6th line of the same page is “60N”
Mφ”. ? .. The rNdzOJ described on page 10, line 2 of the same
zz■" and correct it. 6. rNdzo*J described in the 4th line of the same page as rNdo37
■” and correct it. 7. Correct Figure 2 as shown in the attached sheet. More than 10,000 Q2
Claims (1)
50.0mol〜67.5mol%Nd_2O_5
20.0mol%〜47.5mol% 以上の合計が100部から成る主成分に対して,副成分
として,MnO 0〜0.3wt%とPb_5Ge_3
O_1_1 2〜20wt%とSiO_2 0.3〜1
0wt%を 添加含有したことを特徴とする温度補償用誘電体磁器組
成物。[Claims] As a dielectric ceramic composition for temperature compensation, BaO 1.0 mol% to 15.0 mol% TiO_2
50.0mol~67.5mol%Nd_2O_5
For the main component consisting of 100 parts in total of 20.0 mol% to 47.5 mol%, MnO 0 to 0.3 wt% and Pb_5Ge_3 as subcomponents.
O_1_1 2~20wt% and SiO_2 0.3~1
A dielectric ceramic composition for temperature compensation, characterized in that it contains 0 wt%.
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JP1059450A JP2753311B2 (en) | 1989-03-10 | 1989-03-10 | Dielectric ceramic composition for temperature compensation |
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JP1059450A JP2753311B2 (en) | 1989-03-10 | 1989-03-10 | Dielectric ceramic composition for temperature compensation |
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JPH02239151A true JPH02239151A (en) | 1990-09-21 |
JP2753311B2 JP2753311B2 (en) | 1998-05-20 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02263761A (en) * | 1989-04-04 | 1990-10-26 | Murata Mfg Co Ltd | Ferroelectric ceramic composition and piezoelectric element utilizing the same |
US5310710A (en) * | 1991-04-09 | 1994-05-10 | Ngk Spark Plug Company, Ltd. | Microwave dielectric ceramic composition |
JP2002338342A (en) * | 2001-05-17 | 2002-11-27 | Aiomu Technology:Kk | Dielectric ceramic composition |
-
1989
- 1989-03-10 JP JP1059450A patent/JP2753311B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02263761A (en) * | 1989-04-04 | 1990-10-26 | Murata Mfg Co Ltd | Ferroelectric ceramic composition and piezoelectric element utilizing the same |
US5310710A (en) * | 1991-04-09 | 1994-05-10 | Ngk Spark Plug Company, Ltd. | Microwave dielectric ceramic composition |
JP2002338342A (en) * | 2001-05-17 | 2002-11-27 | Aiomu Technology:Kk | Dielectric ceramic composition |
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Publication number | Publication date |
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JP2753311B2 (en) | 1998-05-20 |
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