JPH02225327A - 半導体素子封止材用充填材および中空球状シリカガラスの製造方法 - Google Patents
半導体素子封止材用充填材および中空球状シリカガラスの製造方法Info
- Publication number
- JPH02225327A JPH02225327A JP4393989A JP4393989A JPH02225327A JP H02225327 A JPH02225327 A JP H02225327A JP 4393989 A JP4393989 A JP 4393989A JP 4393989 A JP4393989 A JP 4393989A JP H02225327 A JPH02225327 A JP H02225327A
- Authority
- JP
- Japan
- Prior art keywords
- gel
- spherical silica
- hollow
- temperature
- silica glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 239000000945 filler Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000003566 sealing material Substances 0.000 title abstract description 10
- 239000002612 dispersion medium Substances 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 14
- -1 silicic acid ester Chemical class 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 230000003301 hydrolyzing effect Effects 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 32
- 238000010304 firing Methods 0.000 claims description 7
- 239000000565 sealant Substances 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 10
- 239000007787 solid Substances 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 3
- 230000020169 heat generation Effects 0.000 abstract description 2
- 238000001354 calcination Methods 0.000 abstract 1
- 230000003111 delayed effect Effects 0.000 abstract 1
- 239000000499 gel Substances 0.000 description 26
- 239000011240 wet gel Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000007863 gel particle Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 238000003828 vacuum filtration Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/10—Forming beads
- C03B19/107—Forming hollow beads
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Melting And Manufacturing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4393989A JPH02225327A (ja) | 1989-02-23 | 1989-02-23 | 半導体素子封止材用充填材および中空球状シリカガラスの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4393989A JPH02225327A (ja) | 1989-02-23 | 1989-02-23 | 半導体素子封止材用充填材および中空球状シリカガラスの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02225327A true JPH02225327A (ja) | 1990-09-07 |
| JPH0550447B2 JPH0550447B2 (enrdf_load_stackoverflow) | 1993-07-29 |
Family
ID=12677669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4393989A Granted JPH02225327A (ja) | 1989-02-23 | 1989-02-23 | 半導体素子封止材用充填材および中空球状シリカガラスの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02225327A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001342010A (ja) * | 2000-05-30 | 2001-12-11 | Kyocera Corp | 無機質中空粉体とその製造方法 |
-
1989
- 1989-02-23 JP JP4393989A patent/JPH02225327A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001342010A (ja) * | 2000-05-30 | 2001-12-11 | Kyocera Corp | 無機質中空粉体とその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0550447B2 (enrdf_load_stackoverflow) | 1993-07-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |