JPH0222495A - Method for plating mold for continuous casting - Google Patents
Method for plating mold for continuous castingInfo
- Publication number
- JPH0222495A JPH0222495A JP17087088A JP17087088A JPH0222495A JP H0222495 A JPH0222495 A JP H0222495A JP 17087088 A JP17087088 A JP 17087088A JP 17087088 A JP17087088 A JP 17087088A JP H0222495 A JPH0222495 A JP H0222495A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- mold
- cathode
- continuous casting
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 48
- 238000009749 continuous casting Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 7
- 239000010949 copper Substances 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 238000005266 casting Methods 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
- B22D11/059—Mould materials or platings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Continuous Casting (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は連続鋳造用モールド表面をメッキする方法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of plating the surface of a continuous casting mold.
従来、連続鋳造用のモールドをメッキするに際しては、
連続鋳造用モールドの水冷箱を取付けたま一全体を電解
槽の中に入れてメッキする方法と、モールドの銅板を水
冷箱から取外してモールドのみをメッキする方法がある
。Conventionally, when plating molds for continuous casting,
There are two methods: one is to attach the continuous casting mold's water-cooled box and place the entire mold in an electrolytic bath and plate the mold, and the other is to remove the mold's copper plate from the water-cooled box and plate only the mold.
上記従来法のうち、水冷箱を付けたt−モールドにメッ
キする場合には、(1)全体の汚れを完全に除去しなけ
ればならない、(2)メッキ部以外をメッキ防止する作
業及びメッキ後のメッキ防止剤を除去する作業が必要で
ある、(3)全体を浸漬してメッキするため大きなメッ
キ槽が必要である、(4)陽極、陰極の極間距離を均一
にしにくい、(5)メッキ速度が遅いなどの不具合があ
った。Among the conventional methods mentioned above, when plating a T-mold with a water-cooled box, (1) the entire dirt must be completely removed, (2) work to prevent plating other than the plated part and after plating. (3) A large plating tank is required because the entire plate is immersed in plating; (4) It is difficult to make the distance between the anode and cathode uniform; (5) There were problems such as slow plating speed.
また、銅板であるモールドを水冷箱から取外してモール
ドのみをメッキする場合にも、(1)銅板であるモール
ドのマスキング前後の作業時間が長時間必要である、(
2)メッキ速度が遅いなどの不具合があった。In addition, when removing the copper plate mold from the water-cooled box and plating only the mold, (1) a long time is required before and after masking the copper plate mold;
2) There were problems such as slow plating speed.
本発明は上記技術水準に鑑み、上記従来法のような不具
合のない連続鋳造用モールドのメッキ方法を提供しよう
とするものでおる。In view of the above-mentioned state of the art, the present invention aims to provide a method for plating continuous casting molds that does not have the disadvantages of the conventional methods described above.
本発明は連続鋳造用の銅製モールドを陰極とし、これに
対向する陽極との極間距離を狭くかつ、等間隔になるよ
うに設置し、該極間にメッキ液を1 m / sec以
上の流速で供給して陰極側のメッキ面に乱流を発生させ
て高電流密度でメッキすることを特徴とする連続鋳造用
モーμドのメッキ方法である。In the present invention, a copper mold for continuous casting is used as a cathode, and an anode facing the cathode is installed so that the distance between the electrodes is narrow and evenly spaced, and a plating solution is applied between the electrodes at a flow rate of 1 m/sec or more. This is a μ mode plating method for continuous casting, which is characterized by plating with a high current density by supplying the plating surface with a high current density to generate turbulent flow on the plating surface on the cathode side.
本発明はメッキ液がメッキ液槽→電解槽(メッキ槽)→
メッキ液槽と循環するよりにメッキ液をポンプで循環さ
せ、モーμドを陰極とし、例えばT1にpt t−ライ
ニングした電極を陽極とし、これら両極の極間を、でき
るだけ狭くしてモールド表面のメッキ液に乱流が生ずる
ようにメッキ液がこの極間を1 m / sec以上の
速度で流れるようにして高電流密度でモールド表面をメ
ッキするようにすることt好ましい態様とするものであ
る。In the present invention, the plating solution is plating solution tank → electrolytic tank (plating tank) →
The plating solution is circulated by a pump rather than being circulated through the plating solution tank, the mode μ is used as the cathode, and the electrode lined with T1 is used as the anode, and the distance between these two electrodes is made as narrow as possible to maintain the surface of the mold. A preferred embodiment is to allow the plating solution to flow between the electrodes at a speed of 1 m/sec or more so as to cause turbulence in the plating solution, thereby plating the mold surface with a high current density.
〔作用〕
陰極面であるモー〃ド表面におけるメッキ液の流速を1
m / sec以上にすることにより乱流とし拡散層
を狭くすることによう、通常の5〜1゜倍のメッキ速度
とすることができる。[Operation] The flow rate of the plating solution on the mode surface, which is the cathode surface, is reduced to 1
m/sec or more, the plating speed can be 5 to 1 times the normal plating speed by creating a turbulent flow and narrowing the diffusion layer.
以下、本発明の一実施態様を第1図によって説明する。 Hereinafter, one embodiment of the present invention will be explained with reference to FIG.
メッキ液槽1からポンプ2で電解槽7に送られたメッキ
液が、水冷箱3にボルトで取付られた銅板(陰極)4と
陽極乙の間のメッキ液通路5を通シ、配管8によシメッ
キ液槽1にもどる循環方式でメッキを行なう。The plating solution sent from the plating solution tank 1 to the electrolytic tank 7 by the pump 2 passes through the plating solution passage 5 between the copper plate (cathode) 4 and the anode B, which are attached to the water cooling box 3 with bolts, and then enters the piping 8. Plating is performed by a circulation method that returns to the plating liquid tank 1.
本発明は銅板(陰極)4と陽極6間を狭く(10〜15
箇)、等間隔で固定されたメッキ液通路5での流速を1
m / sec以上することによシ高電流密度(10
A〜50 A / dm” )で短時間にメッキができ
るものである。In the present invention, the distance between the copper plate (cathode) 4 and the anode 6 is narrow (10 to 15
), the flow velocity in the plating liquid passages 5 fixed at equal intervals is 1
m/sec or more, high current density (10
Plating can be done in a short time at A~50 A/dm").
本発明により、下記のような効果が奏される。 The present invention provides the following effects.
1、高電流密度によシメッキ時間の短縮ができる
2、極間距離が一定であるので均一な模厚になる
3、メッキ防止部分が少なくてすむ
4、水冷箱を取付けたまま、モール1表面のメッキがで
きるので作業性がよくな夛コストダウンとなる。1. The plating time can be shortened due to the high current density. 2. The distance between the electrodes is constant, resulting in uniform thickness. 3. There are fewer areas to prevent plating. Since it can be plated, it is easy to work and reduces costs.
第1図は本発明の一実施趨様を説明するための説明図で
ある。FIG. 1 is an explanatory diagram for explaining one implementation trend of the present invention.
Claims (1)
陽極との極間距離を狭くかつ、等間隔になるように設置
し、該極間にメッキ液を1m/sec以上の流速で供給
して陰極側のメッキ面に乱流を発生させて高電流密度で
メッキすることを特徴とする連続鋳造用モールドのメッ
キ方法。A copper mold for continuous casting is used as a cathode, and an anode facing the cathode is installed so that the distance between the electrodes is narrow and evenly spaced, and a plating solution is supplied between the electrodes at a flow rate of 1 m/sec or more. A continuous casting mold plating method characterized by generating turbulence on the plating surface on the cathode side and plating with high current density.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17087088A JPH0222495A (en) | 1988-07-11 | 1988-07-11 | Method for plating mold for continuous casting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17087088A JPH0222495A (en) | 1988-07-11 | 1988-07-11 | Method for plating mold for continuous casting |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0222495A true JPH0222495A (en) | 1990-01-25 |
Family
ID=15912840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17087088A Pending JPH0222495A (en) | 1988-07-11 | 1988-07-11 | Method for plating mold for continuous casting |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0222495A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003099490A1 (en) * | 2002-05-27 | 2003-12-04 | Concast Ag | Method for the galvanic coating of a continuous casting mould |
US7560015B2 (en) | 2002-05-27 | 2009-07-14 | Concast Ag | Process for electrolytic coating of a strand casting mould |
-
1988
- 1988-07-11 JP JP17087088A patent/JPH0222495A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003099490A1 (en) * | 2002-05-27 | 2003-12-04 | Concast Ag | Method for the galvanic coating of a continuous casting mould |
JP2005527705A (en) * | 2002-05-27 | 2005-09-15 | コンカスト アクチェンゲゼルシャフト | Method for electrolytic coating of continuous casting mold |
US7560015B2 (en) | 2002-05-27 | 2009-07-14 | Concast Ag | Process for electrolytic coating of a strand casting mould |
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