JPH0222495A - Method for plating mold for continuous casting - Google Patents

Abstract

PURPOSE:To form a uniform plating layer on the surface of a copper mold at a high speed when the surface of the mold for a continuous casting apparatus is plated with a metal, by narrowing the interval between the mold as the cathode and the anode and supplying electric current at a high current density while feeding a plating soln. between both the electrodes at a high velocity. CONSTITUTION:When a metal plating layer is formed on the surface of a Cu plate 4 for a continuous casting mold used in an apparatus for continuously casting a molten metal, a Ti or Pt clad insoluble electrode as the anode 6 is put in a plating vessel 7 and the Cu plate 4 as the cathode is set over the anode 6 at a narrow interval, e.g., of 10-15mm. While a plating soln. in a plating soln. vessel 1 is circulated by passing through the narrow path 5 between the electrodes 4, 6 by a pump 2 at >=1m/sec velocity and by returning to the vessel 1 through a pipe 8, electric current is supplied between the Cu plate 4 as the cathode and the anode 6 at a high current density, e.g., of 10-50A/dm<2> to form a uniform plating layer on the surface of the Cu plate 4 at a high speed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of plating the surface of a continuous casting mold.

[Conventional technology]

Conventionally, when plating molds for continuous casting,
There are two methods: one is to attach the continuous casting mold's water-cooled box and place the entire mold in an electrolytic bath and plate the mold, and the other is to remove the mold's copper plate from the water-cooled box and plate only the mold.

[Problem to be solved by the invention]

Among the conventional methods mentioned above, when plating a T-mold with a water-cooled box, (1) the entire dirt must be completely removed, (2) work to prevent plating other than the plated part and after plating. (3) A large plating tank is required because the entire plate is immersed in plating; (4) It is difficult to make the distance between the anode and cathode uniform; (5) There were problems such as slow plating speed.

In addition, when removing the copper plate mold from the water-cooled box and plating only the mold, (1) a long time is required before and after masking the copper plate mold;
2) There were problems such as slow plating speed.

In view of the above-mentioned state of the art, the present invention aims to provide a method for plating continuous casting molds that does not have the disadvantages of the conventional methods described above.

[Failure to “decide” the issue]

In the present invention, a copper mold for continuous casting is used as a cathode, and an anode facing the cathode is installed so that the distance between the electrodes is narrow and evenly spaced, and a plating solution is applied between the electrodes at a flow rate of 1 m/sec or more. This is a μ mode plating method for continuous casting, which is characterized by plating with a high current density by supplying the plating surface with a high current density to generate turbulent flow on the plating surface on the cathode side.

In the present invention, the plating solution is plating solution tank → electrolytic tank (plating tank) →
The plating solution is circulated by a pump rather than being circulated through the plating solution tank, the mode μ is used as the cathode, and the electrode lined with T1 is used as the anode, and the distance between these two electrodes is made as narrow as possible to maintain the surface of the mold. A preferred embodiment is to allow the plating solution to flow between the electrodes at a speed of 1 m/sec or more so as to cause turbulence in the plating solution, thereby plating the mold surface with a high current density.

[Operation] The flow rate of the plating solution on the mode surface, which is the cathode surface, is reduced to 1
m/sec or more, the plating speed can be 5 to 1 times the normal plating speed by creating a turbulent flow and narrowing the diffusion layer.

〔example〕

Hereinafter, one embodiment of the present invention will be explained with reference to FIG.

The plating solution sent from the plating solution tank 1 to the electrolytic tank 7 by the pump 2 passes through the plating solution passage 5 between the copper plate (cathode) 4 and the anode B, which are attached to the water cooling box 3 with bolts, and then enters the piping 8. Plating is performed by a circulation method that returns to the plating liquid tank 1.

In the present invention, the distance between the copper plate (cathode) 4 and the anode 6 is narrow (10 to 15
), the flow velocity in the plating liquid passages 5 fixed at equal intervals is 1
m/sec or more, high current density (10
Plating can be done in a short time at A~50 A/dm").

〔Effect of the invention〕

The present invention provides the following effects.

1. The plating time can be shortened due to the high current density. 2. The distance between the electrodes is constant, resulting in uniform thickness. 3. There are fewer areas to prevent plating. Since it can be plated, it is easy to work and reduces costs.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram for explaining one implementation trend of the present invention.

Claims (1)

[Claims] A copper mold for continuous casting is used as a cathode, and an anode facing the cathode is installed so that the distance between the electrodes is narrow and evenly spaced, and a plating solution is supplied between the electrodes at a flow rate of 1 m/sec or more. A continuous casting mold plating method characterized by generating turbulence on the plating surface on the cathode side and plating with high current density.