JPH0222493A - Working equipment - Google Patents

Abstract

PURPOSE:To easily form a patternlike plating part having a complex shape by irradiating the surface of a material to be plated with laser beams passed through a mask having a patternlike hole in the case of irradiating the surface of the above material immersed in plating liquid with laser beams in a patternlike state to form the patternlike plating part. CONSTITUTION:When voltage is impressed between a cathode consisting of a material 7 to be plated and an anode 8 if a counter electrode by a power source 9 in plating liquid 6 contained in a plating vessel 5 and plating of a complex pattern is applied on the surface of the material 7 to be plated, the laser beams 2 emitted from a laser oscillator 1 are passed through a working head 12 which consists of both a mask 11 formed with a hole of a prescribed pattern and a condenser lens 4 of the laser beams. Thereby the pattern 14 of the mask 11 is formed on the surface of the material 7 to be treated and activated to form the patternlike plating. In this case, when the working head 12 is transferred to the direction of the laser beams 2, the patternlike plating part having different size can be formed. Further this method can be utilized even for an electroless plating equipment and also used even for etching instead of plating.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a processing device that selectively performs plating or etching using a laser.

[Prior art]

Conventionally, for example, as a plating device of this type, there has been one shown in the groove diagram in FIG. In the figure, (1) is a laser oscillator, (2) is a laser beam emitted from the laser oscillator (1), (3) is a reflector that changes the traveling direction of the laser beam (2), and (4) is a laser beam ( 2) A condensing lens that condenses (
5) is a plating pot made of a material that transmits the laser beam (2), (6) is a plating solution, (7) is the object to be plated, (8)
is a counter electrode, and (9) is a power source that applies voltage and current to the object to be plated (7) and the counter electrode (8).

2 is a plan view showing a plating pattern on an object to be plated to be produced by the plating apparatus shown in FIG. 1. FIG.

In the figure (10 is the formed slanting pattern).

Next, the operation will be explained. Between the object to be plated (7) immersed in the plating solution (6) and the counter electrode (8),
[# (91 gives a predetermined potential difference and sets a state in which minute ion exchange occurs. In this state, the laser oscillator (1) emits laser light (2), and the laser light (2) The direction is changed by the reflection M (3) of the sheet, and then the object to be plated (7
) The irradiation is focused on the surface. Plated object (7
), the electrochemical equilibrium state of the irradiated part of the laser beam (2) is disrupted, and the potential state becomes more base than that of the non-irradiated part, and furthermore, the electrochemical equilibrium state of the irradiated part of the laser beam (2) above the irradiated part is disrupted, resulting in a more base potential state than the non-irradiated part. Combined with the effect, it will be selectively plated.

Figure 2 shows the plating target (7
) The plating pattern αQ is formed on the object to be plated (7), but if the pattern shape is complex or the plating width or area is large, the reflector shown in Fig. 1 should be operated. A focused laser beam must be oscillated above.

Conventional local plating equipment using a laser is configured as described above, so for complex shapes, large plating widths, and large plating areas, the reflector (3) and condensing lens (4) are used. A complicated drive machine FN (not shown) is required to move the plating according to the predetermined shape, and when plating the same pattern shape, the same drive must be repeated, which takes a huge amount of time. There were drawbacks.

[Summary of the invention]

This invention was made in order to eliminate the drawbacks of the conventional ones as described above, and allows laser light to pass through a mask with holes in a desired pattern and be focused by a condensing lens.
A plating (or etching) object placed opposite the mask is irradiated in a plating (or etching) solution, so that the laser beam irradiation area of the plating (or etching) object is selectively plated (or etched). It is an object of the present invention to provide a processing device that can easily and efficiently perform plating (or etching) processing of complex patterns.

DESCRIPTION OF THE PREFERRED EMBODIMENTS A plating apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the configuration diagram in Figure 3, (1, 1) is a mask with holes in a predetermined pattern, @ is a processing head equipped with a mask (6) and a condensing lens (4), and (to) is a condensing lens. This is a drive mechanism that moves the processing head opening in the optical axis direction of the laser beam (2) by changing the distance between the lens (4) and the object to be plated (7).

Further, FIG. 4 is a plan view of the mask (b), in which six holes of similar shape to a predetermined plating pattern are bored.

Next, the operation of the apparatus of the present invention will be explained. As in the past, the object to be plated (
7) and the counter electrode (8), a predetermined potential difference is applied by a power source (9), and a state is set in which minute ion exchange occurs.

In this state, a part of the laser beam (2) emitted from the laser oscillator (1) is blocked by a mask (b) placed on the optical path, and a hole made in the mask is blocked. The hole-shaped laser beam that has passed through α~ is transmitted through the condenser lens (4), is condensed, and is irradiated onto the surface of the object to be plated (7). Laser light (
Only the predetermined pattern-shaped portions irradiated with 2) are activated and selectively plated, resulting in a desired plating pattern. When changing the dimensions of the plating pattern, the drive mechanism (to) moves the processing head 4 in the same axis direction as the laser beam (2), thereby changing the relationship between the condenser lens (4) and the object to be plated (7). The size of the plating pattern on the surface of the object to be plated (7) can be arbitrarily set by changing the interval.

In the above embodiment, the mask a was placed closer to the laser oscillator (1) than the condenser lens (4), but it may be placed at any position as long as it is on the optical axis of the laser beam (2). .

In addition, in order to change the distance between the condenser lens (4) and the object to be plated (7), we used a method of moving the processing head @, but the mask α, the condenser lens (4), and the object to be plated ( 7) may be moved independently. In the above embodiment, an example was shown in which the laser beam (2) is irradiated from the side of the plating bath (5), but it is also possible to irradiate it from the liquid surface side of the plating solution. good. Further, in the above embodiments, an example of electrolytic plating has been described, but electroless plating may also be used.

Furthermore, the same effect can be achieved in etching removal processing by changing the polarity of the plating solution and power supply.

〔Effect of the invention〕

As described above, the present invention (according to this invention) allows laser light that passes through a mask with holes in a desired pattern and is focused by a condensing lens to be placed in a plating (or etching) solution facing the mask. Plating (or etching) of complex patterns can be achieved by selectively plating (or etching) the laser beam irradiation area of the wave-plated (or etched) object. ) This has the effect of providing a processing device that can perform processing easily and efficiently.

[Brief explanation of the drawing]

Fig. 1 is a block diagram showing a conventional plating device using a laser, Fig. 2 is a plan view showing a plating pattern formed on an object to be plated, and Fig. 3 is a plating device according to an embodiment of the present invention. FIG. 4 is a plan view showing an embodiment of the mask according to the present invention. In the figure, (1) is a laser oscillator, (2) is a laser beam, (4) is a condensing lens, (5) is a plating pot, (6) is a plating solution, (7) is a plated object, (8) is the counter electrode, (9
) is the power supply, (b) is the mask, and Q is the driver groove of the condenser lens. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (4)

[Claims] (1) Laser light that passes through a mask with holes in a desired pattern and is focused by a condensing lens is applied to a plating (or etching) plate placed opposite the mask in a plating (or etching) solution. A processing device that irradiates an object to selectively plate (or etch) the laser beam irradiation area of the object to be plated (or etched). (2) The processing apparatus according to claim 1, further comprising means for changing the distance between the condenser lens and the plated (or etched) object. (3) The processing device according to claim 2, wherein the condenser lens is moved along the optical axis direction. (4) Plating is electroless plating Claim 1
The processing device according to any one of Items 1 to 3.