JPH0222255Y2 - - Google Patents
Info
- Publication number
- JPH0222255Y2 JPH0222255Y2 JP2368783U JP2368783U JPH0222255Y2 JP H0222255 Y2 JPH0222255 Y2 JP H0222255Y2 JP 2368783 U JP2368783 U JP 2368783U JP 2368783 U JP2368783 U JP 2368783U JP H0222255 Y2 JPH0222255 Y2 JP H0222255Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- block
- chase
- chase block
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2368783U JPS59129512U (ja) | 1983-02-19 | 1983-02-19 | モ−ルド金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2368783U JPS59129512U (ja) | 1983-02-19 | 1983-02-19 | モ−ルド金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59129512U JPS59129512U (ja) | 1984-08-31 |
| JPH0222255Y2 true JPH0222255Y2 (instruction) | 1990-06-15 |
Family
ID=30154760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2368783U Granted JPS59129512U (ja) | 1983-02-19 | 1983-02-19 | モ−ルド金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59129512U (instruction) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59134509U (ja) * | 1983-02-25 | 1984-09-08 | ロ−ム株式会社 | 半導体装置用モールド金型 |
| JP2802272B2 (ja) * | 1986-05-17 | 1998-09-24 | トーワ株式会社 | 多品種少量生産に適した半導体装置の製造方法 |
| JP2916677B2 (ja) * | 1996-05-23 | 1999-07-05 | 道男 長田 | 多品種少量生産に適した半導体装置の製造用金型装置 |
-
1983
- 1983-02-19 JP JP2368783U patent/JPS59129512U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59129512U (ja) | 1984-08-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0222255Y2 (instruction) | ||
| JPH0136582Y2 (instruction) | ||
| CN221793643U (zh) | 一种内置铁块的注塑模具结构 | |
| JPH032638U (instruction) | ||
| JPS6262435U (instruction) | ||
| JPS6343056Y2 (instruction) | ||
| JPS5912621U (ja) | 射出成形用金型 | |
| JPH0639463Y2 (ja) | 発光ダイオード素子の樹脂封止用リードフレーム | |
| JPS649713A (en) | Resin molding die | |
| JPH03350Y2 (instruction) | ||
| JPH0313737U (instruction) | ||
| JPS6337221Y2 (instruction) | ||
| JPH0521385Y2 (instruction) | ||
| JPS6144646B2 (instruction) | ||
| JPH0191516U (instruction) | ||
| JPH0518115Y2 (instruction) | ||
| JPS5926322U (ja) | 射出成形用金型 | |
| JPH023299B2 (instruction) | ||
| JPS5915522U (ja) | 成形用金型 | |
| JPH065931U (ja) | モータのロータにおけるコアカバー用金型 | |
| JPS59187431U (ja) | 射出成形金型構造 | |
| JPS6248514U (instruction) | ||
| JPS6339526U (instruction) | ||
| JPH0167013U (instruction) | ||
| JPS6024519U (ja) | 射出成形用金型 |