JPH0222255Y2 - - Google Patents
Info
- Publication number
- JPH0222255Y2 JPH0222255Y2 JP2368783U JP2368783U JPH0222255Y2 JP H0222255 Y2 JPH0222255 Y2 JP H0222255Y2 JP 2368783 U JP2368783 U JP 2368783U JP 2368783 U JP2368783 U JP 2368783U JP H0222255 Y2 JPH0222255 Y2 JP H0222255Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- block
- chase
- chase block
- runner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2368783U JPS59129512U (ja) | 1983-02-19 | 1983-02-19 | モ−ルド金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2368783U JPS59129512U (ja) | 1983-02-19 | 1983-02-19 | モ−ルド金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59129512U JPS59129512U (ja) | 1984-08-31 |
JPH0222255Y2 true JPH0222255Y2 (cs) | 1990-06-15 |
Family
ID=30154760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2368783U Granted JPS59129512U (ja) | 1983-02-19 | 1983-02-19 | モ−ルド金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59129512U (cs) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59134509U (ja) * | 1983-02-25 | 1984-09-08 | ロ−ム株式会社 | 半導体装置用モールド金型 |
JP2802272B2 (ja) * | 1986-05-17 | 1998-09-24 | トーワ株式会社 | 多品種少量生産に適した半導体装置の製造方法 |
JP2916677B2 (ja) * | 1996-05-23 | 1999-07-05 | 道男 長田 | 多品種少量生産に適した半導体装置の製造用金型装置 |
-
1983
- 1983-02-19 JP JP2368783U patent/JPS59129512U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59129512U (ja) | 1984-08-31 |
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