JPH02222199A - Automatic installation apparatus for electronic component - Google Patents

Abstract

PURPOSE:To attain positive fetching by comparing the recognition-positional data on a component and an fetch-center positional data stored in a storage device and moving a fetch head section on the basis of the quantity of the displacement of the data. CONSTITUTION:The position of the centers of each suction nozzle are recognized by a recognition device composed of a CCD camera, etc., before mounting operation, and stored previously in a RAM. A component supply base 5 is moved, and a desired tape let-off motion 6 is stood by at the location of fetching components. A rotary disc 12 is turned intermediately, the chip component housed in the device 6 is sucked under a vacuum by a suction station 17, and the state of suction is recognized by the recognition device in a recognition station 18. The stored positional data and the center-positional data of the suction nozzle are compared, and the quantity of displacement is computed and alignment is conducted by a nozzle rotational-regulating station 19. The quantity of displacement is compensated through a second recognition device by a recognition station 21, and set up onto a substrate 22. Accordingly, position extraction is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Industrial Application Field The present invention takes out a chip-shaped electronic component supplied to a component take-out position by a chip component supply device with a take-out tool of a take-out head, and recognizes the take-out state. The present invention relates to an automatic electronic component mounting device that recognizes the device, corrects the positional deviation between the ejector and the component, and mounts the component onto a printed circuit board.

(b) Prior art As a prior art, the patent application filed in 1986 by the applicant
The specification attached to No. 28558 includes a chuck for taking out electronic components from a tape containing electronic components, a tape feeding means for feeding the tape, and a tape feeding drive means coupled to the tape feeding means. In the automatic mounting device for electronic components, a regulating means for regulating the stroke of the tape feeding drive means is provided in the fixed part, the position of the regulating means is made variable, and the stroke is adjusted according to the size of the component. Correspondingly, a technique has been disclosed that allows the amount to be set to a desired amount.

If the above technology is applied to the present invention, regardless of the method of supplying chip components, the purpose of which is to ensure that the pick-up position of the chip component with the pick-up tool is always at the center of the component,
The position of the restriction means must be changed frequently.

(c) Problems to be Solved by the Invention Therefore, the present invention provides a method for easily aligning the center of the take-out tool and the center of the component to ensure reliable take-out when taking out the chip-shaped electronic component from the chip component supply device. be.

(d) Means for Solving the Problems Therefore, the present invention takes out a chip-shaped electronic component supplied to a component take-out position by a chip component supply device with a take-out tool of a take-out head section, and recognizes the take-out state with a recognition device. , in an automatic electronic component mounting device that corrects positional deviation between the pick-up tool and the component and mounts it on a printed circuit board, a storage device that stores center position data of the pick-up tool; a comparison device that compares the center position data and the recognition position take of the component recognized by the recognition device; a calculation device that calculates the amount of wear between the pick-up tool center and the component center compared by the comparison device; The device is provided with a take-out head extrusion device that allows the take-out head portion to move by the amount of deviation, and a control device that drives the take-out head extrusion device in accordance with the amount of deviation before taking out by the take-out tool.

(E) Effect With the above configuration, the recognition position data of the part recognized by the recognition device and the pick-up tool center position data stored in the storage device are compared by the comparison device, and the size of the pick-up tool center and the parts center is compared. The amount of displacement is calculated by the calculation device.Then, based on the amount of deviation, the control device drives the take-out head extrusion device to move the take-out head before the take-out tool takes out.

(F) Example Hereinafter, an example of the present invention will be described in detail based on the drawings.

(1) is a base on which various constituent devices of the automatic electronic component mounting apparatus of the present invention are placed, and in which various control systems are built-in.

(2) is an XY that is moved in the X direction and Y direction by the drive of the
The child table and the printed circuit board (P) on which chip-shaped electronic components (w) (hereinafter referred to as chip components (W)) can be mounted are obstructed.

<5) is a tape feeding device (
6) are arranged in parallel, and are moved in the X direction by rotation of a ball screw (8) driven by a component supply section servo motor (7).

(9) places the printed circuit board (P) conveyed by the supply conveyor (10) onto the XY child table 2);
Printed circuit board (P) after component mounting on child table 2)
) onto the discharge conveyor (11).

(12) is a suction head part (14) provided with a plurality of suction nozzles (13) as a pick-up tool for picking up and conveying the chip component (enemy) from the tape feeding device (6) on the lower surface.
A rotary disk with a large number of rotary disk servo motors (15
) is intermittently rotated via the index unit (12A). This rotation is controlled by the rotary disk encoder (1
6) is detected.

(17> is a suction station for taking out the chip component (W) from the tape feeding device (6).

(18) is a first recognition station that recognizes the state of the chip component (W) being sucked by the suction nozzle (13).

(19) is a nozzle rotation regulation station that corrects the angle of the chip component (W) recognized by the first recognition station (18), and the nozzle (
13) The nozzle rotating part of the nozzle rotating means, which is completely moved by a drive system (not shown) to the outer diameter part and rotates when it comes into contact with the nozzle (13), due to the rotation of the servo motor (20), the nozzle (13) is rotated to perform rotational positioning so that the chip component is mounted at an appropriate position on the printed circuit board (P).

(21) is a second recognition station that recognizes the chip part (W) after the work at the nozzle rotation regulation station (19) is completed, and determines whether the chip part (W) has been rotated to the rotation position accurately. Detect.

(22) is a mounting station for mounting headgear parts (W>) on the printed circuit board (P).

(23) is a nozzle selection station that selects a suction nozzle (13) corresponding to the chip component (W) to be suctioned by the suction station (17>), which is a gear ( A desired selection is made by the rotation of the drive gear (25) as a nostle selection means by the rotation of the drive gear zarpo motor (24) which is moved by a drive system (not shown) to the gear and is rotated after meshing with the gear. The suction nozzle (13) is selected.

Next, the rotary disk (12) and suction head section (14) will be described in detail based on FIG. 2.

(26) is a cylindrical part (
The index unit (12) surrounds the top of the index unit (27).
This is a hollow cylindrical rotary disk guiding cylindrical cam member that is suspended and fixed to the mounting base (28) in A). The cam member (26
) The cam (29) has a discontinuity at the part where the upper and lower rails (29A) are arranged, and there is a significant difference in the vertical positional relationship between one end and the other end of the discontinuity. A vertical rail (29A) is disposed at the interrupted portion to move it up and down. Then, a roller (31) serving as a sliding part provided at the upper end of each suction head part (14) is pressed against the upper surface of the cam 29 by a spring (30) and rotates, so that the shape of the cam (29) is rotated. Each suction head section (14) rotates together with the rotary disk (12) while moving up and down. That is, in each suction head part (14), a pair of guide bodies 32) are vertically movably penetrating through the rotary disk (12), and a roller (31) is installed at the upper end of the core body (32).
) is fixed. Therefore, each suction head section (14) has a rotary disk (12
) is supported so that it can move up and down.

Next, the first and second recognition stations (1g) (21
) The recognition devices (34) and (35) as recognition means will be explained using the sectional view shown in FIG. 5 showing the principle of the recognition device.

(36) is a COD camera that recognizes the state in which the chip component (W) is attracted to the suction nozzle (13).
The image obtained using the reflection of two mirrors (3g>(39) installed in a box (37) waiting below the station is recognized through the lens (40). Recognition station <21) The device has a similar configuration.

(41) is a suction head extrusion device that moves the suction head (14) in the opposite direction to the tape feeding direction based on the recognition result from the first recognition station (18). The suction head extrusion device (41) will be described in detail below with reference to FIG. 2.

Reference numeral (42) denotes a base portion of the suction head portion (14), which is slidably attached to the mounting block (43) via a guide body (not shown) only in the left and right directions in the figure.

(44) is a spring that biases the base portion (42) to the left, and this biasing force causes the base portion (42) to come into contact with a portion of the stopper (45) of the mounting block (43). There is.

(46) is connected to the pole screw (46) via the coupling (48>) by the drive of the pusher drive pulse motor (47>) when the suction head (14) has descended to a predetermined position.
9) pushes out the suction head (14) with the pusher that is moved forward in the direction of the suction head (14).

Here, the pulse motor (47) can be driven at the same time as the suction head (14) is lowered, so that the suction head <14)
may move forward while descending.

This shortens the moving time of the suction head (14). At this time, the tip of the pusher (46) that comes into contact with the end surface (42A) of the base portion (42) is moved by the roller (46A).
) to weaken the frictional resistance during contact and push q − (46
) on the end surface (42A). Furthermore, by setting the rotational speed of the pulse motor (47) at a constant speed, the speed change of the horizontal movement of the suction head section (14) can also be controlled by the cam (
26), smooth movement can be obtained in proportion to the change in descending speed, and there is little vibration.

(50) shown in FIG. 4 is an interface;
and the second recognition device (34), (35) and the rotary disk encoder (16) are connected, while each of these control elements is program-controlled by a CPU (51) serving as a control device. It has become.

(52) is a RAM as a storage device, and each suction nozzle (
13> center position data, 1st. The second recognition device (
34), Recognition position data of each chip component (W) according to (35) and mounting position data (X direction, X direction, θ direction) on each chip component (Rinopudding 1 to board (P))
etc. are stored in each predetermined area.

Note that the set position of the center of the suction nozzle (13) may shift due to temperature changes, changes over time, etc., so if a certain set temperature is exceeded or a certain period of time has elapsed, the position of the center of the suction nozzle (13) may be shifted. The suction nozzle (13) is recognized by the first recognition device (34) and the suction nozzle (13)
Calculate the amount of deviation of the center and set the amount of deviation to RAM<52
), or the shift amount may be added to the center position data of the suction nozzle (13).

Further, a drive circuit (53) is connected to the CPU (51), and the drive circuit (53) is connected to the X-axis servo motor (
3), Y-axis servo motor (4), parts supply section servo motor (7), rotary disk servo motor (15), nozzle rotary disk servo motor 20), drive gear servo morph (24)
and a drive pulse motor <47) are connected to the pushbutton.

The operation will be explained in detail below based on the drawings.

First, before performing the mounting operation, the first recognition device (34) recognizes the center position of each suction nozzle (13) (based on a reference point such as the image center of the CCD camera (36)), and Center position data is stored in RAM (52).

Note that the work of recognizing the center position of the suction nozzle (13) is performed by an operator using a jig and a magnifying glass.
(52) may be input using an input device.

Furthermore, we actually test punched the chip component (W) while changing the mounting angle, measured the amount of deviation between the mounting position and the center of each suction nozzle (13), and input the value to R using the input device.
It may also be input into A M (52).

Then, the component supply table (5) is moved by the drive of the component supply section servo motor (7), and a desired tape feeding device (6) is placed on standby at the component removal position.

The rotary disk (12) is driven by the rotary disk servo motor (15).
> is rotated intermittently, and first, the nozzle selection station (2
In step 3), after the drive gear (25) meshes with the gear (not shown) on the outer diameter of the suction head (14), as it is rotated, the head (14>) is rotated and the suction head (14) is rotated. The suction nozzle (13) corresponding to the chip component (W) supplied from the tape feeding device (6) is selected, and rotation is started again.

At the next suction station (17), the suction nozzle (13) moves the chip component (W> ) is lowered to vacuum-adsorb the chip component (W), and then raised again to start rotating.

Next, at the first recognition station (18), the first recognition device (34) recognizes the suction state of the chip component (W) in the suction nozzle (13), and uses the recognized position data.
The recognized position data (Yl, θl) is stored in the RAM (52) as a storage device, and indicates the orientation in the X direction and the plane direction.
) and the center position data (Yo, θ,) indicating the orientation of the suction nozzle (13) in the X direction and the plane direction stored in the RAM (52) using a comparison device (not shown) to determine the amount of deviation. If there is, the amount of scratch (ΔY, -Y,
, eighty. -01 is calculated using a calculation device (not shown), and the amount of deviation (ΔY, -Y,

Δθ. -θ, ) is stored in the RA M (52).

Then, of the amount of deviation (ΔYoY+, Δθ0θl),
Amount of deviation (80.-) from the set angle position data (θ.)
〇, ) at the next nozzle rotation regulating station (19), the nozzle (13) is rotated as the nozzle rotating means described above contacts the nozzle (13) and rotates. ) is rotated to align the chip component (W), and the rotation of the rotary disk (12) is started again. Note that alignment regarding the amount of deviation (ΔY0yr) will be described later.

Next, at the second recognition station (21), the positioning of the chip component (W) at the nozzle rotation regulation station (19) is performed accurately, and the chip component (W) is set to the nozzle (13). It is recognized whether or not it is attracted by position data (Yo, θ.), and the recognized position data (Y2.
θ, ) is stored in the RAM (52), and the comparison device compares the recognized position data (Y2.θ2) with the set position data (y,, θ.) in the RAM (52) to determine the deviation. If there is an amount (in this case, a very slight deviation), the calculation device calculates the amount of deviation (ΔYo-Y2.80.-02), and then calculates the amount of deviation (Yo-Y). ,-Y,,
The deviation amount (80.-02) from the set angle position data (θ.) is decomposed into the X component and the X component, and the values of the X component and the Δyo yz
) is calculated and stored in the RAM (52).

Then, based on the value, the XY table (2) is moved in the XY direction.

Further, a mechanism for rotating the XY table (2) by θ may be provided to correct the amount of scratching (80.-0.).

Then, at the next mounting station (22), the chip component (W) is mounted at a set position on the printed circuit board (P).

For the convenience of explaining the present invention, the following description will proceed assuming that chip components 4) are suctioned one after another from the same tape feeding device (6).

When receiving the third and subsequent chip parts (W) from the tape feeding device (6), the deviation amount (8) recognized by the first recognition station (18) and stored in the RAM (52) is The amount of deviation in the Y direction (8Y, -Y,) of Yo yl, 80.-01) is corrected in advance before the chip component ('w) is picked up. That is, when the suction head section (14) holding the first chip component (W) has been fully conveyed to the nozzle rotation regulation station (19), the suction head section 14 that comes to the suction station (17)
is moved in the opposite direction to the tape feeding direction so that the center of the chip component (W) is directly below the suction nozzle (13). In other words, the correction movement of the amount of scratching in the Y direction (8Y, -Yl) is as shown in FIG.
When the pusher (
46) is moved in the direction of the suction head (14) and comes into contact with the base (42), and the amount of deviation (ΔYo-Y,
), and the suction head part (14) is moved by the spring <
44> by moving it while resisting the urging force.

Alternatively, the amount of deviation (8Y, -Y,) may be recognized multiple times (n times), and the Y correction may be performed based on the average of the n times. That is, first, the amount of deviation of n times is stored in RAM (52), and based on the amount of deviation, a calculation device calculates the average amount of deviation, and it is stored in RAM (52). The supply position of chip parts (W) up to the first time is as follows:
The position is corrected by the average deviation amount. and,
When the supply of the chip parts (W) for n times with the correction operation is completed, the deviation amount for the next n times is calculated again, and the average is calculated. It is also possible to use the thread amount.

In addition, in the above explanation, for convenience, it has been explained that the chip components <W) are supplied from the same tape feeding device (6), but as in the actual operation of the electronic component automatic mounting device,
When chip components (W) are sequentially supplied from a plurality of tape delivery devices (6) each storing a plurality of types of chip components (W), each tape delivery device (6) stores a plurality of types of chip components (W).
6) Separately store the amount of shift in RAM (52). When the same tape feeding device (6) is recognized n times by the recognition counter in the CPU (51), the calculation device calculates the average of the n deviation amounts, and performs Y correction based on the average deviation amount. You can do it as well.

Furthermore, work to recognize the center position and deviation amount of each suction nozzle (13) is performed for each tape feeding device (6) before the start of automatic operation of the mounting operation, and after the start of operation, the RA
The correction may be made based on the data in M(52).

(G) Since the configuration is more than the effect of the invention, there is no shock caused by having to stop in the middle of the cam curve when Y correction is performed by controlling the feeding drive by the cam of the tape feeding device, and the ejecting tool The suction rate is improved because the center of the part can be reliably suctioned.

[Brief explanation of the drawing]

1, 3, and 4 are a plan view, a side view, and a configuration circuit diagram showing an electronic component automatic mounting device according to an embodiment of the present invention; FIG. 2 is a side view of a suction head extrusion device; Fifth
The figure shows the principle of the recognition device, and FIGS. 6 to 8 show flowcharts showing the Y-direction correction operation. (14)...Suction head part, (41)...Suction head part extrusion device, (46)...Push~-(47)...
...button drive pulse motor.

Claims (1)

[Claims] (1) The chip-shaped electronic component supplied to the component take-out position by the chip component supply device is taken out by the take-out tool of the take-out head section, the take-out state is recognized by the recognition device, and the positional deviation between the take-out tool and the component is detected. In an automatic electronic component mounting device that corrects and mounts electronic components onto a printed circuit board, there is a storage device that stores center position data of the pick-up tool, and a center position data stored in the storage device that is recognized by the recognition device. a comparator that compares the recognized position data of the component, a calculation device that calculates the amount of deviation between the pick-up tool center and the component center compared by the comparison device, and a pick-up device that moves the pick-up head portion by the amount of deviation. An automatic electronic component mounting apparatus comprising: a head extrusion device; and a control device that drives the ejection head extrusion device according to the amount of deviation before the extraction device takes it out.