JPH02226800A - Automatic mounting apparatus of electronic parts - Google Patents

Abstract

PURPOSE:To surely take out parts by comparing stored center position data of a taking-out tool with recognized position data of parts, computing the deviation amount, and correcting the taking-out position of a taking-out head. CONSTITUTION:Before mounting operation, the center position of each of the sucking nozzles 5A, 5B, 5C, 5D of each rotary head 3 is recognized by a recognizing apparatus 11, without sucking parts 6, and the center position data are stored. Next, a parts supplying stand 9 is moved; a sucking nozzle corresponding with a parts 6 to be sucked, e.g. a nozzle 5B is selected; the rotary held 3 is moved to a working station I for taking out parts by pivotally turning of an index shaft 1. The stored center position data of the sucking nozzle 5B in use are compared with taking-out position data, and the deviation amount is obtained by a computer. After the deviation amount is stored, the rotary head 3 is transferred to the next working station III for mounting parts. At the time of transferring, the stored deviation amount and the parts mounting position data are taken into account, thereby executing the objective correction.

Description

Detailed Description of the Invention (a) Industrial Application Field The present invention takes out a chip-shaped electronic component supplied to a component take-out position by a chip component supply device with a take-out tool of a take-out head, and recognizes the take-out state. The present invention relates to an automatic electronic component mounting device that recognizes the device, corrects the positional deviation between the ejector and the component, and mounts the component onto a printed circuit board.

(b) Prior art As a prior art, the patent application filed in 1986 by the applicant
The specification attached to No. 28558 includes a chuck for taking out electronic components from a tape containing electronic components, a tape feeding means for feeding the tape, and a tape feeding driving means coupled to the tape feeding means. In the automatic mounting device for electronic components, a regulating means for regulating the stroke of the tape feeding drive means is provided in the fixed part, the position of the regulating means is variable, and the stroke corresponds to the size of the component. A technique has been disclosed that allows setting the amount to a desired amount.

However, when applied to the present invention, which does not care about the method of supplying chip components, which aims to reduce component extraction errors by making the center of the chip-shaped electronic component the center of extraction with the extraction tool, the above-mentioned regulations apply. The means must be repositioned frequently.

(c) Problems to be Solved by the Invention Therefore, the present invention provides a method for easily aligning the center of the take-out tool and the center of the component when taking out the chip-shaped electronic component from the chip-component supply device, thereby ensuring reliable take-out. be.

(d) Means for Solving the Problems Therefore, the present invention takes out a chip-shaped electronic component supplied to a component take-out position by a chip component supply device with a take-out tool of a take-out head section, and recognizes the take-out state with a recognition device. , an electronic component automatic mounting device that corrects a positional deviation between the pick-up tool and the component and mounts it on a printed circuit board; a storage device that stores center position data of the pick-up tool; a comparison device that compares the center position data and the recognition position data of the component recognized by the recognition device; and a calculation device that calculates the amount of shift between the pick-up tool center and the component center compared by the comparison device. , and a control device that drives the rotation means of the take-out head part by the amount of deviation before the take-out tool takes out the parts. The recognized position data and the pick-up tool center position data stored in the storage device are compared by a comparison device, and the amount of deviation between the pick-up tool center and the component center is calculated by a calculation device. Then, based on the amount of scratching, the control device drives the rotating means of the take-out head part to rotate the take-out head part before taking out the workpiece with the take-out tool.

(F) Example Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

(1) through an index unit (not shown)
It is an index shaft that rotates intermittently every 0 degrees, and arms (2) protrude in four directions that are moved up and down by a mechanism (not shown). At the tip of each arm (2), a mounting shaft (not shown) from which a rotary head (3) serving as an extraction head protrudes from the upper surface passes through the arm (2>) and rotates the rotary head (3). It is rotatably attached by being connected to an output shaft (not shown) of a rotary head rotation motor (4) which is a rotating means for moving.

(5) is a suction nozzle as a removal tool provided on the lower surface of the rotary head (3), and one rotor no head (3) has multiple types of nozzles (5A) (5B) (5C).
By providing (5D), it is possible to handle different types of chip-shaped electronic components (6).

(7) is a tape feeding device serving as a chip component feeding device that feeds the component (6) to its component ejection port <8).

Reference numeral 9) denotes a component supply table on which a large number of the tape feed devices (7) are placed, which is horizontally moved by the drive of the component feed table servo motor (10), and moves the desired tape feed device (7) to the suction nozzle. 5) parts extraction work station (1
).

(IF> is a component recognition work station that recognizes the positional shift of the component (6) sucked by the suction nozzle (5) using a recognition device 11 installed below the movement trajectory of the suction nozzle (5). It is.

Hereinafter, the recognition device (11) will be explained using the cross-sectional view shown in FIG. 3 showing the principle of the recognition device.

(12) is a CCD camera that recognizes the state in which the part (6) is picked up by the suction nozzle (5), and the box that is waiting under the part (6) that is being transported to the part recognition work station (I[). (13) Two pieces of I installed inside
(t4) An image obtained using the reflection of (ts>) is recognized through the lens (16).

(If[) is the part (6) transferred to the printed circuit board (20) on the XY child table 19 which is moved in XY by the drive of the X-axis servo motor (17) and the Y-axis servo motor (18).
This is a parts mounting station where parts are mounted.

(IV) The nozzle switching device (21) transfers the suction nozzle (5)' used just now to the next parts removal work station (
Either suction nozzle (5A) (5B) (
5C) (5D) Nozzle switching operation is in progress.

Here, for example, when using the suction nozzle (5A), the other suction nozzles (5B>(5C) <5D) are moved upwards by a mechanism not shown so as not to interfere with the work of the suction nozzle <5A). Lifted and rotary head (3)
held on the side.

In FIG. 4, (22) is an interface to which the rotary head (3), component supply table (9), recognition device (11) and XY child table 19) are connected, while each of these Control element is CP as control device
It is designed to be program controlled by U (23).

(24) is a RAM as a storage device, and each suction nozzle (
Center position data of 5A) (5B) (5C) (5D), removal position data of component (6) sucked by suction nozzle (5), and printed circuit board (20) of each component (6)
The upper mounting position data (X direction, Y direction, θ direction), etc. are stored in each predetermined area.

In addition, the suction nozzle (5A) (5B) <5C) (5D)
Since the center position of the suction nozzle (5A) (5B>( 5C) (5D) is recognized by the recognition device 11) and the suction nozzle (5A) (5B)
(5C) (5D) The amount of deviation of the center may be calculated and the amount of deviation may be stored in the RAM (24) again, or the amount of deviation may be calculated by the suction nozzle (5A) (5B>(5C)
5D) It may be added to the center position data.

Further, a drive circuit (25) is connected to the CPU (23), and the drive circuit (25) includes the rotary head rotation motor (4), the component supply stand servo motor (10), and the
Axis servo motor (17) and Y-axis servo motor (18)
is connected.

The operation will be explained in detail below based on the drawings.

First, before performing the mounting operation, rotate the index unit four times without suctioning the parts 6), and use the recognition device (11) to select each suction nozzle (5A) (5) of each rotary head (3).
B>(5C) Center position of (5D) (based on a reference point such as the image center of the COD camera (12))
is recognized and its center position data is stored in the RAM (24).

In addition, the suction nozzles (5A) (5B) (5C) (5
D) The center position recognition work may be performed by an operator using a jig and a magnifying glass, and may be input into the RAM (24) using an input device.

Furthermore, we actually tested the chip parts (Ka) while changing the mounting angle to determine the mounting position and each suction nozzle (5A) (
The amount of deviation from the center of 5B), 5C, and 5D may be measured, and the value may be input into the RAM (24) using an input device.

Then, the component supply table (9) is moved by the drive of the component supply table servo motor (10), and while the desired tape feeding device (7) is being sent to the component extraction work station (I), the nozzle switching work station ( IV), the nozzle switching device (21) selects which suction nozzle (5A) (5B>(5CX5D)) corresponding to the next component (6) to be suctioned.
The selected rotary head (3) is moved to the component extraction work station (I) by rotation of the index shaft (1).

The following description will be made assuming that the suction nozzle (5B) has been selected during the nozzle selection (see FIG. 2).

At the next parts removal work station (1), the suction nozzle (
5B) is moved upwards from the component (6) stored in the tape feeding device (7) while it is on standby, and is moved through the rotary head (3) to the suction nozzle (
5A) descends and vacuum-chucks the component (6) from the component removal port (8).

Then, the rotary head (3) is raised again and rotated 90 degrees by the rotation of the rotary head rotation motor (4), and then moved to the next component recognition work station (II).

Next, at the component recognition work station (II), the recognition device (11) picks up the component (6) in the suction nozzle (5B).
) is recognized and the extraction position data is RA.
Store in M(24).

Among the center position data of each suction nozzle (5A) (5B) (5C) (5D>) stored in the RAM (24), the center position data of the suction nozzle (5B) in use and the take-out position data are compared with a comparison device (not shown), the amount of deviation (positional deviation of the center of the component (6) with respect to the center of the suction nozzle (5B)) is determined by a calculation device (not shown), and the amount of deviation (ΔYI.

After storing Δθl) in the RAM (24), the rotary head (3) can move to the next component mounting work station (III).

During this movement, the rotary head (3) and the XY child table (19
) to move. That is, based on the amount of deviation (ΔYllΔθl) and the mounting position data (X direction, Y direction, θ direction),
Correction movement in the direction and Y direction is performed using X-axis and Y-axis servo motors (1
7) The correction movement in the θ direction is performed by moving the XY child table 19) driven by (18), and the correction movement in the θ direction is performed by the rotation of the rotary head (by rotating the rotary head rotation motor (4)).
This is done by rotating 3).

Then, the suction nozzle (5B) is lowered and the component (6) is mounted on the printed circuit board (20).

Next, the rotary head (3) is rotated in the opposite direction by the amount of rotation during the θ direction correction and returned to the initial setting position, and is then moved to the next nozzle switching work station (IV) to be used next time, for example, for suction. Switched to nozzle (5A).

Naturally, the nozzle switching device (21) does not operate unless there is a need to switch.

Hereinafter, in order to explain the present invention, for the sake of convenience, we will proceed assuming that parts (6) are suctioned one after another from the same tape feeding device (7).

The third and subsequent parts (6) from the tape feeding device e (7)
When taking out the component, the suction nozzle recognized by the component recognition work station (I) and stored in the RAM (24)
5A) Center and parts (6> Misalignment fi (Δ
Y1. The deviation amount (ΔY, ) of Δθl) is corrected in advance before the component (6) is picked up. That is, the deviation ff
Since 1 (ΔY1) is an extremely small amount, correction movement in the Y direction can be performed by rotating the rotary head (3). In other words, the rotary head (3) may be rotated to perform a corrective movement in the Y direction, and the amount of deviation in the X direction caused by this rotation may be compensated for by horizontal movement of the component supply table (9).

Alternatively, the amount of deviation (ΔY,) may be recognized a plurality of times (n times), and the correction may be performed based on the average of the n times. That is, first, the amount of deviation n times is stored in the RAM (24), and based on the amount of deviation, the average amount of deviation is determined by a calculation device.
It is stored in the RAM (24), and the suction of the component (6) from the n+1st to the 2nth time is performed after being corrected by the average deviation amount. Then, when the n-time suction of component (6) accompanied by the correction operation is completed, the amount of deviation for the next n times is calculated again, and the average is calculated. It is also possible to use an average amount.

In addition, in the above explanation, for convenience, the same tape feeding device (7) has been described as sucking the component (6), but as is the case with the operation of the actual electronic component automatic mounting device, multiple types of components (6) ) in order to pick up parts (6) from a plurality of tape sending devices (7) each housed therein, the amount of deviation is stored in the RAM (24) for each tape feeding device (7). When the same tape feeding device (7) is recognized n times by a recognition counter (not shown) in the CPU (23), the calculation device calculates the average of the n deviation amounts,
Correction may be performed based on the average amount of deviation.

Furthermore, the center position of the suction nozzle (5) and the amount of deviation are recognized on each tape feeding device (7) before the installation operation starts.
), and after the start of operation, the RAM (24
) may be corrected based on the data within ).

(G) Effects of the Invention With the above-described configuration, the center of the pick-up tool and the center of the parts can be easily aligned, and parts can be taken out reliably.

[Brief explanation of the drawing]

1 and 4 are perspective views and configuration circuit diagrams of essential parts of an automatic electronic component mounting device according to an embodiment of the present invention, FIG. 2 is a plan view of a rotary head, and FIG. 3 shows the principle of a recognition device. A cross-sectional view is shown. (1)... Index shaft, (3)... Rotary head)', (4)... Rotary head rotation motor. Figure 1 Figure 2

Claims (1)

[Claims] (1) The chip-shaped electronic component supplied to the component take-out position by the chip component supply device is taken out by the take-out tool of the take-out head section, the take-out state is recognized by the recognition device, and the positional deviation between the take-out tool and the component is detected. In an automatic electronic component mounting device that corrects and mounts electronic components onto a printed circuit board, there is a storage device that stores center position data of the pick-up tool, and a center position data stored in the storage device that is recognized by the recognition device. a comparator that compares the recognized position data of the component, a calculation device that calculates the amount of deviation between the pick-up tool center and the component center compared by the comparison device; An electronic component automatic mounting apparatus comprising: a control device for driving a rotating means of the ejecting head section.