JPH02216818A - Light application thin-film manufacturing device - Google Patents

Abstract

PURPOSE:To enable accumulation of a thin film and etching of the thin film onto a substrate to be made uniformly by placing a light-transmission window which allows light to be scattered. CONSTITUTION:After a reaction room 1 is discharged to a specified conditions by a discharging means. a reaction gas 4 is introduced into the reaction room 1. Also, a substrate 5 is heated to a specified temperature through a susceptor 9. In this state, ultraviolet ray is irradiated from a light source 2, excites and decomposes the reaction gas 4 introduced into the reaction room 1, and then a reacted product is accumulated on the substrate 5. The reacted substance and non-reacted gas (discharge gas 10) are discharged from a discharge port 8 to the outside of the reaction room 1. In this kind of film-formation operation, light radiated from the light source 2 transmits through a light-transmission window 6 and is scattered on the surface with surface roughness, and then irradiated at a uniform irradiation strength for the surface of the substrate 5.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an optical thin film manufacturing apparatus, and more particularly to an optical thin film manufacturing apparatus suitable for uniformizing the intensity of light irradiation onto a substrate to form a uniform film. .

[Conventional technology]

It is known that the energy intensity of broad light (light irradiation intensity) has a large effect on the film deposition rate and film etching rate in equipment that uses light energy to deposit thin films on a substrate or to etch thin films. ing. Furthermore, in order to uniformly form a film on a substrate, it is necessary to make the irradiation intensity distribution of light onto the substrate surface of the thin film uniform.

Normally, when multiple linear light sources are arranged to irradiate light onto a substrate, the irradiation intensity of the light is thicker toward the center of the light source.
If a film is formed in this state, the film thickness at the center of the substrate becomes thicker, making it difficult to form a uniform film.

In order to eliminate such disadvantages, various optical thin film manufacturing apparatuses have been proposed.

FIG. 3 shows an optical thin film manufacturing apparatus according to Japanese Patent Application Laid-open No. 61-129811, in which 31 is a reaction chamber, 32
is a heater, 33 is a susceptor, 34 is a substrate, 35 is a light transmission window, 36 is a light source, 37 is a guide plate, 38 is a support plate, 39 is a connecting portion, 40 is a pole screw nut, 41
is a ball screw, 42 is a motor, 43 is a bracket, 44
4 is a light source moving mechanism; 45 is a gas supply port; 46 is an exhaust port;
7 indicates a reaction gas, and 48 indicates an exhaust gas.

In this optical thin film manufacturing apparatus, it is disclosed that during a film forming operation, the light source 36 is moved via the light source moving mechanism 44 to make the intensity of light irradiated onto the surface of the substrate 34 uniform.

FIG. 4 shows an optical thin film manufacturing apparatus according to Japanese Patent Application Laid-Open No. 61-128517, in which 51 is a reaction chamber;
2 is a heater, 53 is a moving table, 54 is a substrate, 55 is a light transmission window, 56 is a light source, 57 is a connector, 58 is a ball screw, 59 is a motor, 60 is a gas supply port, 61.62 is an exhaust port, 63 64 indicates a reaction gas, and 64 indicates an exhaust gas, respectively.

In this optical thin film manufacturing apparatus, uniform film formation is achieved by changing the relative position of the substrate 54 with respect to the light source 56 via a substrate moving mechanism consisting of a connector 57, a ball screw, a motor 59, and the like.

FIG. 5 shows an optical thin film manufacturing apparatus according to Japanese Patent Application Laid-Open No. 61-129814, in which 71 is a reaction chamber, 72
73 is a heater, 73 is a susceptor, 74 is a substrate, 75 is a light transmission window, 76 is a light source, 77 is a gas supply port, 78 is an exhaust port, 7
9 indicates a reaction gas, and 80 indicates an exhaust gas.

In this optical thin film manufacturing apparatus, the arrangement interval of the plurality of linear light sources 76 is made larger toward the center, and the arrangement interval of the linear light sources 76 is made smaller in the periphery (to make the irradiation intensity uniform). .

FIG. 6 shows an optical thin film manufacturing apparatus according to JP-A-61-129819, in which 91 is a reaction chamber, 92 is a heater, 93 is a susceptor, 94 is a substrate, and 95 is an optical thin film manufacturing apparatus. 96 is a light source, 97 is a gas supply port, 98 is an exhaust port, 99 is a reaction gas, and 100 is an exhaust gas.

In this optical thin film manufacturing apparatus, a plurality of light sources 96
As for the arrangement state, the distance from the substrate 94 is increased toward the center, and the distance from the substrate 94 is decreased toward the periphery, thereby making the irradiation intensity uniform.

[Problem to be solved by the invention]

In the conventional optical thin film manufacturing apparatus described above, the number of movable parts in the reaction chamber increases, making the apparatus more complicated and requiring more maintenance. Furthermore, the structure of the light source section becomes complicated, and the cost of the device increases.

An object of the present invention is to solve the problems of the prior art described above, and to provide an optical thin film manufacturing apparatus that can be easily maintained and reduce costs without complicating the apparatus.

[Means to solve the problem]

The above purpose is achieved by fixing and arranging inexpensive linear light sources as light sources, and making the light transmitting window that transmits the light from the light sources have a surface roughness that allows light scattering. achieved.

C Effect] Light transmitted from the light source through the light transmission window is scattered by a portion having surface roughness formed in the light transmission window, and is uniformly irradiated onto the substrate. This results in uniform deposition of the thin film on the substrate.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is a longitudinal sectional view showing an embodiment of the optical thin film manufacturing apparatus of the present invention. This photo-applied thin film manufacturing apparatus includes a reaction chamber 1 in which a photochemical reaction is carried out using light energy;
A light source 2 that emits light, a susceptor 9 on which a substrate 5 is placed, a heater 3 that heats the substrate 5 via the susceptor 9, a gas supply lower that supplies a reaction gas 4 into the reaction chamber 1, and a reaction generation An exhaust port 8 for exhausting exhaust gas 1O consisting of substances and unreacted gases, and a light transmission window 6 disposed between the reaction chamber 1 and the light source 2 for allowing light to enter the reaction chamber 1. There is.

The surface of the light transmission window 6 located on the reaction chamber 1 side has surface roughness necessary to scatter light. The surface having this surface roughness can be adjusted to a predetermined roughness by employing any roughening means such as sandblasting or glass bead blasting.

In the light transmitting window 6, it is desirable that the surface having surface roughness be provided on the surface located on the reaction chamber 1 side.

When the rough surface of the light transmission window 6 is located outside the reaction chamber 1, the proportion of light from the light source 2 that is scattered outside the reaction chamber 1 before entering the reaction chamber 1 is , is larger than the light scattered inside the reaction chamber 1.

Next, the operation of the optical thin film manufacturing apparatus described above will be explained.

After the inside of the reaction chamber 1 is evacuated to a predetermined condition by an exhaust means (not shown), a reaction gas 4 is introduced into the reaction chamber 1. Further, the substrate 5 is heated to a predetermined temperature by the heater 3 via the susceptor 9.

In this state, ultraviolet light is irradiated from the light source 2 to excite and decompose the reaction gas 4 introduced into the reaction chamber 1, and the reaction products are deposited on the substrate 5. 10) is discharged from the reaction chamber 1 through the exhaust port 8.

In such a film-forming operation, the light emitted from the light source 2 is transmitted through the light transmission window 6, scattered by the surface having surface roughness, and is irradiated onto the surface of the substrate 5 with uniform irradiation intensity.

Figure 2 shows the light irradiation intensity distribution (example) when used in the optical thin film manufacturing apparatus shown in Figure 1, and the light irradiation intensity in the optical thin film manufacturing apparatus equipped with a transparent light transmission window. This is a comparison of distributions (conventional example). In the example, the light transmitting window 6 was blasted with glass beads having a particle size of 150 μm, and in the conventional example, the light transmitting window 6 was optically polished.

As is clear from FIG. 2, in the conventional example, when the irradiation intensity at the center of the substrate 5 is 100, the irradiation intensity at the edges of the substrate 5 drops to 50 or less.

On the other hand, in the example, the irradiation intensity at the center of the substrate 5 is about 80, but the irradiation intensity is also about 70 at the edges of the substrate 5, and the irradiation intensity is uniform with respect to the in-plane distance of the substrate. Further, it was confirmed that the integral value of the irradiation intensity on the surface of the substrate 5 was the same in both the example and the conventional example, and it was found that there was almost no difference in the total amount of energy of the light reaching the substrate 5.

In the above-mentioned embodiment, an example was explained in which the light source 2 was installed outside the reaction chamber 1, but in the present invention, the light source is built inside the reaction chamber,
Needless to say, the present invention can also be applied to an optical thin film manufacturing apparatus having a structure in which light from this light source is irradiated through a light transmission window.

〔Effect of the invention〕

As described above, according to the present invention, by installing a light-transmitting window capable of light scattering, it is possible to uniformize the light energy to the substrate surface without complicating the device structure, while making maintenance easy. , it is possible to uniformly deposit a thin film on a substrate and to etch a thin film uniformly.

[Brief explanation of the drawing]

FIG. 1 is a vertical cross-sectional view showing one embodiment of the optical thin film manufacturing apparatus of the present invention, and FIG. 2 is a vertical cross-sectional view showing an optical thin film manufacturing apparatus equipped with a light-scattering type light transmission window according to the present invention, and a conventional transparent thin film manufacturing apparatus. A graph showing the irradiation intensity distribution with an optical thin film manufacturing apparatus equipped with a light transmitting window of the type, FIG. 3a, FIG. 4, FIG. 5, and FIG. be. 1...Reaction chamber, 2...Light source, 3...
...Heater, 4...Reaction gas, 5...
・Substrate, 6...Light transmission window, 7...Gas supply port, 8...Exhaust port, 9...Susceptor, 10...・Exhaust gas. Agent Masaru Nishimoto, Patent Attorney - Figure 2 Figure 2 Sea urchin to round meat Figure 4 Figure 3 Figure 5

Claims (2)

[Claims] (1) Light from a light source is introduced into the reaction gas in the reaction chamber through a light-transmitting window, causing a photochemical reaction to deposit or etch a thin film on a substrate placed in the reaction chamber. An applied thin film manufacturing apparatus, wherein the light transmitting window surface has a surface roughness necessary to scatter light. (2) The optical thin film manufacturing apparatus according to claim 1, wherein the surface having the surface roughness is a light-transmitting window surface located on the substrate side.