JPH0221674A - Optical semiconductor device and its manufacture - Google Patents

Abstract

PURPOSE:To make it possible to attain simultaneously a high airtightness obtainable by a resistance welding and a high-accuracy and high-reliability three- dimensional optically adjusting fixation property obtainable by a laser beam welding in an optical semiconductor device by a method wherein the resistance welding and the laser beam welding are used in combination with each other. CONSTITUTION:Welds 12 for an inner cap are provided on a stem 1 mounted with a light-emitting diode chip 4 by a resistance welding to secure the hermetic seal of a container. Then, an outer cap 3 is put oven the cap 2 and doubled adjusting rods 13 and 14 are made to pass through an internal cap position adjusting hole 9 in the sidewall of the cap 3. The cap 3 is pressed by the rod 13 in the direction F to deform a bellows part 6 of the cap 2, the sidewall of the cap 2 is pressed by the rod 14 in the directions f and f', the relative position (d) of a spherical lens 7 and the chip 4 is adjusted and the position is monitored by a vision 15 to find the optimum position. Then, the cap 3 is superposed on the cap 2 and welding fixing parts 10b are formed by a laser for welding use.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to an optical semiconductor device and a method for manufacturing the same.

[Conventional technology]

FIG. 4 is a sectional view of an example of a conventional optical semiconductor device.

The optical semiconductor device includes a stem 1.A stem 1.A light emitting diode chip 4 is mounted above the stem with external leads. Then, a cylindrical cap 23 having a ball lens 7 at the center of the upper surface can be placed over the side surface of the stem 16, and a sealing resin part 12 is placed in the gap between the two.
．． It is configured with

First, optical adjustment fixing and sealing methods using this type of container include resistance welding, resin sealing, solder sealing laser beam welding, and the like.

Among these, resin sealing and solder sealing are methods for fixing and sealing three-dimensional optical adjustment by filling the gap between the stem 1a and the cap 24 with resin or solder, which requires conventional optical adjustment. Most commonly used for containers.

[Problem to be solved by the invention]

In the conventional optical semiconductor device described above, there are various methods for fixing and enclosing optical adjustment in the manufacturing process, but each of them has the following problems.

First, when resin sealing and solder sealing are used, there is a drawback that not only the reliability of airtightness is lacking, but also the reliability of stability after optical adjustment and fixation is low.

In addition, resistance welding has very stable airtightness, but since the cap and stem are welded while being crimped, the relative position of the stem and cap before and after welding tends to shift, making it unsuitable for highly accurate optical axis adjustment and fixing. At the same time, it also had the disadvantage that it was difficult to fix the three-dimensional optical adjustment.

In addition, laser beam welding has high relative position accuracy before and after welding and can perform three-dimensional optical adjustment and fixing, but it takes time to weld the entire circumference of the stem and cap due to spot welding.
Further, there were drawbacks such as the need for a rotation function in the fixing system of the stem and the cap.

An object of the present invention is to provide an optical semiconductor device that is easy to fix and encapsulate for optical adjustment and has high reliability in airtightness, and a method for manufacturing the same.

[Means to solve the problem]

The optical semiconductor device of the present invention has a bellows-like shape in the middle between a stem on which an optical semiconductor chip is mounted and an upper side wall having a bottom surface hermetically welded to the upper surface of the periphery of the stem and having a smaller diameter than the lower side wall. an inner cap having a movable part and an opening for providing a light introduction part in the center of the upper surface; and an outer cap having a lower inner wall welded to the lower part of the side wall and having a plurality of inner cap position adjustment holes in the upper side wall. It is composed of:

Furthermore, the method for manufacturing an optical semiconductor device of the present invention is as follows: (B) pressurizing the side wall of the inner cap through the inner cap position adjustment hole in the side wall of the outer cap to deform the movable portion; (C) fixing the inner wall of the outer cap and the outer wall of the inner cap by laser spot welding.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1(a) to 1(C) are a top view, a side view, and a sectional view taken along the line AA' of a first embodiment of the present invention.

The optical semiconductor device includes a stem 1 on which a light emitting diode chip 4 is mounted, an inner cap 2 that is hermetically sealed in combination with the stem 1, and an outer cap 3 that can be covered by the inner cap 2.

The internal cap 2 has a cylindrical shape and has a cap flange 5 at the bottom for resistance welding to the upper surface of the peripheral edge of the stem 1. The inner cap 2 has a thin bellows part 6, and a ball lens 7 is sealed in an opening at the center of the upper part of the inner cap 2 with low melting point glass.

The outer cap 3 is a cylinder of a size that is inscribed in the lower side wall of the inner cap 2. A guide hole 8 is formed in the upper surface of the cap 3 through which light passes through the ball lens 7, and the inner cap is also formed on the upper side wall. Position adjustment hole L9 is open.

FIG. 2 is a schematic cross-sectional view of a container and a manufacturing jig for an optical semiconductor device for explaining the method for manufacturing the optical semiconductor device shown in FIG.

First, a welding part 12 is attached to the inner cap 2 by resistance welding to the stem 1 on which the light emitting diode chip 4 is mounted to ensure an airtight seal of the container.

Next, the outer cap 3 is placed over the inner cap 2, and the double adjustment rod 1 is inserted into the inner cap position adjustment hole 9 on the side wall.
Pass 3.14.

By pushing down the outer cap 3 in the F direction with the adjustment rod 13, the bellows part 6 of the inner cap 2 is deformed in the Z-axis direction, and by pushing the inner cap 2 in the direction of the side walls f, f', etc. with the adjustment rod 14. The position in the X and Y directions is moved to adjust the relative position ID between the ball lens 7 and the light emitting diode chip 4, and this is monitored by the vidicon 15 to find the optimum position.

Once the optimum positional relationship between the ball lens 7 and the light emitting diode chip 4 has been determined, by irradiating the pulse beam e of the welding laser through the laser beam guide 16, the inner cap 2 and the outer cap 3 are overlapped and welded to the fixing part 10. ．．
form.

In this way, hermetic sealing can be achieved with the inner cap 2 and optical adjustment can be achieved by welding the outer cap 3.

FIG. 3 is a sectional view of a second embodiment of the invention.

The basic structure of the container is the same as that of the first embodiment, but in this example, a surface emitting diode 4a is used as the optical semiconductor element, and a selfoc lens 7a is used as the light guide.

This embodiment differs from the first embodiment in that the inner cap 2 is provided with a ferrule 11 for fixing the lens.

The manufacturing method is the same as in the first embodiment, but since the optical semiconductor device container with this structure has a ferrule 11 attached to the optical element, it is easier to combine it with an optical fiber than in the first embodiment. It has the advantage of being able to be combined with parts with similar structures.

〔Effect of the invention〕

As explained above, the present invention uses a combination of resistance welding and laser beam welding to provide optical semiconductor devices with high airtightness due to resistance welding and the highly accurate and reliable three-dimensional optical properties of laser beam welding. The effect of achieving adjustment and fixity at the same time is obtained.

...Top surface welding part, 11...Ferrule, 13.14
...adjustment rod, l...laser beam.

[Brief explanation of the drawing]

FIGS. 1(a) to (C) are a top view, a side view, and a cross-sectional view taken along line A-A' of the first embodiment of the present invention, and FIG. 2 illustrates a method for manufacturing the optical semiconductor device of FIG. 1. FIG. 3 is a cross-sectional view of a second embodiment of the present invention, and FIG. 4 is a cross-sectional view of an example of a conventional optical semiconductor device. DESCRIPTION OF SYMBOLS 1... Stem, 2... Internal cap, 3... External cap, 4... Light emitting diode chip, 5... Cap brim, 6... Bellows part, 7... Ball lens, 7a.
・Self Onitsuku Cleanse, 8...Guide hole, 9...
Internal cap position adjustment hole, 10.・・・Side wall welded part, 1
0b(b) ManzutC) Voice diagram

Claims (2)

[Claims] (1) A bellows-shaped movable part is provided between the stem on which the optical semiconductor chip is mounted and the upper part of the side wall whose bottom surface has a return part hermetically welded to the upper surface of the periphery of the stem and whose diameter is narrower than the lower part of the side wall. and an inner cap having an opening for providing a light introduction part in the center of the upper surface, and an outer cap having a lower inner wall welded to the lower part of the side wall and having a plurality of inner cap position adjustment holes in the upper side wall. Optical semiconductor device. (2) (A) Pressure is applied to the upper part of an internal cap, the bottom of which is hermetically welded to the upper surface of the periphery of the stem on which the optical semiconductor chip is mounted, and which has a movable part in the middle of the side wall, through the external cap to deform the movable part. (B) applying pressure to the side wall of the inner cap through the inner cap position adjustment hole in the side wall of the outer cap to deform the flexible part and adjusting the light sensitivity position in the horizontal direction; A method for manufacturing an optical semiconductor device, comprising: (C) fixing an inner wall of the outer cap and an outer wall of the inner cap by laser spot welding.