JPH01181488A - Semiconductor laser device - Google Patents

Abstract

PURPOSE:To decrease mandays of working and assembling processes, and even to adjust positions easily by fitting a support member to a cap to form a hermetically sealed package. CONSTITUTION:A laser chip 3 is supplied with operating current, laser oscillation is started, and a cap 4 with a collimator lens is inserted into a support member 2. A laser device is set up onto the optical axis of an optical-axis adjusting jig being composed of an imaging lens 9, a camera 10 and a waveform monitor 11 and monitoring imaging beams. When the end face of the laser chip 3 reaches the focal position of the collimator lenses 5, a light beam diameter on the waveform monitor is minimized and brightness is maximized, thus positioning the cap 4 while the cap 4 is moved before and behind on the optical axis by utilizing the minimization of the light beam diameter and the maximization of brightness. Adhesives 6 are injected from an opening 13 shaped in one part on the circumference of the cap 4, and the laser support member 2 and the cap 4 are unified and fixed. Accordingly, the laser support member 2 and the cap 4 are fitted, and the optical axis is adjusted only by shifting the cap cylinder 4 in the direction of the optical axis, thus facilitating adjustment.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a semiconductor laser device.

[Conventional technology]

Conventionally, in a semiconductor laser device having a cylindrical package using a metal cap, a semiconductor laser chip is fixed so as to be located at the end of a heat sink such as a submount and at the center of the cylinder. The cap was placed on top of the steam pace, and the laser chip was aligned with the lower (bottle side) surface of the stem as a reference.

[Problem that the invention seeks to solve]

The conventional semiconductor laser device described above has the following drawbacks.

1. The shape of the component is complex, resulting in high processing and assembly costs. 2. Variations in the parallelism of the heat sink, or setting errors, or variations in the position of the stem base and heat sink, or errors in the chip fixing position. This affects the parallelism of the chip with respect to the reference plane. As a result, the reference plane and the emitted light may not be perpendicular to each other, resulting in a decrease in quality.

3. When optically aligning the laser chip with an optical system such as a collimator lens (integrated with the cap), it is necessary to move the cap or adjust the optical system itself. It's a hassle. A similar problem occurs when coupling with an optical fiber or the like.

[Means for solving problems]

In the semiconductor laser device of the present invention, the stem, heat sink, etc. have an integrated structure, and this constitutes a chip support section. Moreover, this chip support part has a rotatable shape mainly having a circular shape. In addition, the cap for protecting the chip has a mainly circular shape that fits into the chip support part, and the chip support part and the cap are fitted and the joint is fixed with adhesive etc. A hermetically sealed package is constructed.

[For production]

Since the chip support part (stem, heat sink, etc.) has a hollow structure, the number of processing steps is reduced, and assembly is easy because the chip support part and the cap are fitted and fixed together. . Therefore, cost reduction can be achieved.

Furthermore, alignment of the chip and the optical system is simple, as it is only necessary to adjust the relative relationship between the chip support and the cap.

Further, by adjusting the relative relationship between the chip support portion and the cap, it becomes easy to change the direction of the emitted beam.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

Embodiment 1 FIG. 1 is a perspective view of the first embodiment of the present invention, FIG. 2 is a sectional view of this embodiment, and FIGS. 3(a) and 3(b) are, respectively,
A perspective view and a plan view of the chip support member in this embodiment, FIGS. 4(a) and 4(b) are respectively a perspective view and a plan view of the cap in this embodiment, and FIG. 5 explains the assembly method of this embodiment. This is a diagram for

This embodiment includes a laser chip 3, an integrated support member 2 made of a material with good heat dissipation properties that supports the laser chip 3, a cylindrical cap 4 for protecting the laser chip 3, and a laser chip. It has a collimator lens 5 that collimates the radially spread laser light emitted from the laser beam 3 . As shown in the figure, the cylindrical cap 4 is provided with an opening 13, in which the support member 2
An adhesive 6 made of resin is injected to fix the bonding surface with. The support member 2 is shown in FIG. 3(a).

As shown in (b), one half of the cylinder is cut out to form a flat surface, and a laser chip is placed on this end. An electrode 1 for energizing the chip 3 passes through the center of this support member 2 and is integrally fixed thereto. Further, as shown in FIGS. 4(a) and 4(b), the cap 4 has a cylindrical shape, and its inner diameter fits with the inner diameter of the support member 2 with a clearance of about 20 to 300 scales. It looks like this.

Next, the assembly method of this embodiment will be explained using FIG. 5.

First, an operating current is supplied to the laser chip 3 to start laser oscillation. Next, the cap 4 with a collimator lens is inserted into the support member 2. Then, the laser device of this embodiment is installed on the optical axis of an optical axis adjustment jig, which is composed of an imaging lens 9, a camera IO, and a waveform monitor 11, and is used to monitor the imaging beam. When the end face of the laser chip comes to the focal point of the collimator lens, the diameter of the light beam on the waveform monitor will be at its minimum and the brightness will be at its maximum.Use this fact to position the cap by moving it back and forth on the optical axis. . Thereafter, adhesive 6 is injected through an opening 13 provided in a part of the circumference of the cap, and the laser support member 2 and the cap 4 are integrally fixed. In this way, the laser support member 2 and the cap 4 are fitted together, and the cap tube 4 is moved in the optical axis direction.
Adjustment is extremely easy as the optical axis can be adjusted simply by moving the .

Note that when placing ordinary optical glass instead of a collimator lens in the laser beam emitting part of the cap, the above-mentioned precise adjustment is not required, and it is sufficient to simply solidify the adhesive at an arbitrary position.

Embodiment 2 FIG. 6 is a sectional view of a second embodiment of the present invention, FIG. 7 is a perspective view thereof, FIG. 8 is a diagram for explaining the assembly method of this embodiment, and FIG. 9(a) , (b) are a perspective view and a plan view of the support member 2 in this embodiment, respectively, and FIG.
) and (b) respectively represent the cap 4 in this example.
FIG. 1C is a perspective view and a plan view of a modified example of the cap 4. FIG.

The feature of this embodiment is that the support member 2 is spherical and the cap 4 is
The inner diameter is tapered. Further, the laser beam is led out to the outside via an optical fiber 7, and this optical fiber 7 has a cylindrical shape and is fixed through a connector 8 having a screw on a part of the inner diameter of the cylinder. The connector 8 is integrated with the cap 4 by a screw.

Next, FIGS. 6 and 8 show how to assemble this embodiment.
This will be explained using figures.

First, the support member 2, the cap 4, and the connector 8 with the optical fiber 7 are connected. Next, laser chip 3
A current is applied to the device to cause laser oscillation. Then, as shown in FIG. 8, a power meter 12 is installed at the other end of the optical fiber 7. When most of the power of the laser beam emitted from the kip 3 enters the fiber 7 when connected to the optical fiber 7, the value of the power meter 12 becomes maximum, and when it does not enter the fiber 7, the value of the power meter I2 becomes the minimum. , Utilizing this fact, the optimum position is detected by moving the spherical support member 2 up and down, left and right within the cap 4 with a cylindrical inner taper, and by turning the screw attached to the connector. Appropriate coupling with the optical fiber 7 can be obtained. After that, adhesive is injected from the electrode side of the cap 4 to integrate the laser support member 2 and the cap 4.

In this way, the laser support member 2 is made into a sphere, and the cap 4
By making the cylinder tapered, it is possible to easily connect to the fiber 7 and change the direction of the emitted beam, making it easier to connect.

Note that the inner cylinder of the cap 4 does not necessarily have to be tapered, and may have a normal cylindrical shape as shown in FIG. 10(C).

Embodiment 3 FIG. 11 is a perspective view of the third embodiment of the present invention, and FIG. 12 (
a), (b), and (c) are a perspective view, a plan view, and an enlarged plan view of the support member 2, respectively.

In this embodiment, the support member 2 is formed into a conical shape, which makes it easier to install the chip 3 at the center of the support member 2 compared to a cylindrical support member. In other words, since the support member 2 is triangular as shown in FIG. 12(C), if the chip 3 is set at point b where the two sides touch, it will naturally be easier to determine the position of point a, making it easier to position the chip. Moreover, the chip 3 can be easily installed parallel to the cylinder. By using a conical stem in this way, the chip can be installed at the center of the support member 2, and the position and parallelism of the chip in the front and back direction can be easily adjusted.

〔Effect of the invention〕

As explained above, according to the present invention, the following effects can be obtained.

(1) Costs can be reduced by reducing the number of processing steps and assembly steps.

(2) Since it is an integral piece, it is easy to achieve chip position accuracy and position adjustment is also easy.

(3) The direction of the emitted beam can be easily adjusted.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the first embodiment of the present invention, FIG. 2 is a sectional view of the first embodiment, and FIGS. 3(a) and 3(b) are chip supports in the first embodiment. A perspective view and a plan view of the members, FIGS. 4(a) and 4(b) are a perspective view and a plan view of the cap in the first embodiment, and FIG. 5 is a perspective view and a plan view of the cap in the first embodiment.
Figure 6 is a sectional view of the second embodiment of the present invention, Figure 7 is a perspective view of the second embodiment, and Figure 8 is a diagram of the second embodiment. FIGS. 9(a) and 9(b) are a perspective view and a plan view of the support member 2 in the second embodiment, respectively, and FIGS.
Figures (a) and (b) are respectively a perspective view and a plan view of the cap 4 in the second embodiment, and Figure 10 (C) is
A perspective view of a modified example of the cap 4, FIG. 11 is a third embodiment of the present invention.
A perspective view of the embodiment of FIG. 12 (a), (b),
(c) is a perspective view, a plan view, and an enlarged plan view of the support member of the third embodiment, respectively. 1... Electrode, 2... Support member (stem/heat sink), 3
... Laser chip, 4 ... Protective cap, 5 ... Glass (optical system, lens), 6
...Adhesive (resin), 7...Optical fiber, 8...Connector, 9...
・Imaging lens, lO...TV camera, 11
-------- Waveform monitor, 12... Power meter. Figure 1 Figure 2 (a) Figure 3 (a) Figure 4? Figure 7 Figure 8 (a) (b) Figure 9 (a) (b) (C) Figure 10! A11 diagram (a) (b) 1
Electric gong (C) Figure 12

Claims (1)

[Claims] 1. A semiconductor laser chip, a support member that supports the semiconductor laser chip and has a heat dissipation function, an electrode for supplying current to the semiconductor laser, and a support member for protecting the laser chip. A semiconductor laser device having a cap, wherein the support member is fitted with the cap, thereby forming a hermetically sealed package. 2. Claim 1, wherein the support member has a cylindrical shape, and the cap has a cylindrical shape that can fit into the support member.
The semiconductor laser device described in . 3. Claim 1, wherein the support member has a conical shape.
The semiconductor laser device described in . 4. The semiconductor laser device according to claim 1, wherein a portion of the support member is spherical. 5. The semiconductor laser device according to any one of claims 1 to 4, wherein the cap has a tapered inner diameter.