JPH022097A - Memory module - Google Patents

Abstract

PURPOSE:To reduce the thickness of a memory or IC card and to increase the capacity thereof while facilitating constitution, assembling and manufacturing by assembling and unifying respective memory modules constituted so as to be preliminarily divided into two or more blocks. CONSTITUTION:Memory modules 1, 2 are constituted by mounting IC element groups 1a, 2a on a chip-on-board structure and integrated by opposing the surfaces of thin substrates 3, 4 not loaded with the IC element groups 1a, 2a to each other to adhere both of them by an adhesive. A module circuit is constituted so that the divided circuits of the modules are connected by a flat conductor cable 5. By this method, the memory module can be constituted in good yield and an increase in capacity, the reduction in thickness and miniaturization can be also achieved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a memory module that has been improved to be suitable for, for example, downsizing or increasing the capacity of a memory card.

(Prior Art) Memory cards or IC cards that have a built-in memory module in which IC elements including memory IC elements are mounted on a thin substrate surface in a chip-on-board structure are widely used in practical use, and this type of memory Cards and the like are desired to be thinner and have larger capacity. By the way, in the memory module of the above-mentioned chip-on-board structure, the IC
Since it only mounts one or two elements, it is not fully satisfactory in terms of making memory cards thinner and larger in capacity. In other words, in a chip-on-board structure, if the number of IC elements mounted is about 8 at most, there will be almost no problem in mass production, but if the number of mounted IC elements exceeds 8, the yield will be low and it will no longer be practical. has not yet been reached.

(Problems to be Solved by the Invention) In order to address the above-mentioned circumstances, the present invention is a memory that is not only suitable for making memory cards or IC cards thinner and larger in capacity, but also is easy to configure and assemble, and can be mass-produced with high yield. The purpose is to provide modules.

[Structure of the Invention] (Means for Solving the Problems) The present invention provides a memory module with a chip-on-board structure in which a memory circuit composed of a large number of IC element groups including memory IC elements is divided into a plurality of blocks. The present invention is characterized in that the divided memory modules are integrally combined and electrically connected using a thin flat conductor cable to form a memory module having a desired function.

(Function) As described above, the present invention (this memory module has a structure in which memory modules which are divided into a plurality of blocks in advance are assembled and integrated).

In other words, when the memory modules constituting each divided block circuit are constructed in a chip-on-board structure, the number of mounted IC elements is relatively small, so that each memory module can be obtained at a high yield. Furthermore, since the integration of these memory modules is carried out by bonding the surface portions on which the IC element group is not mounted, a compact structure is achieved.

(Example) An example of a memory module of the present invention will be described below with reference to FIG.

Figure 1 shows 256 byte SRAs in a chip-on-board structure.
This is a side view of a 516-byte memory module configured by integrally combining two M modules.
．． 2 are each divided into 256 byte SRAM modules. However, these 256 bits SRAM
(IC Element) It is constructed by mounting a memory module body or a group of eight IC elements 1a and 2a on a chip-on-board structure. Further, both of these memory modules 1.2 are integrated with, for example, an epoxy resin adhesive, with the surfaces of the thin substrate 3.4 on which the IC element group 18% 2a is not mounted facing each other. Furthermore, 5 is a flat conductor cable that electrically connects the memory modules 1 and 2; 6 is a flat conductor cable that electrically connects the memory modules 1 and 2;
2, for example, an external connection connector installed in the memory module 2. In other words, 5 according to the present invention
The circuit of the byte SRAM module 12 is the same as the circuit of the byte SRAM module 1 at 256 (it is divided into the circuit of the byte SRAM module 2 at 256), and is connected by a flat conductor cable 5.

In the above, in order to configure the required memory module circuit, two memory modules obtained by dividing the circuit into two are placed side by side in a plane and integrated. It is also possible to have an integrated configuration. Further, the configuration of the required memory module circuit may be achieved by combining and integrating circuits divided into three or more parts, and furthermore, the means for integrating the divided memory modules is limited to the adhesive. Of course, other means than adhesive may also be used.

[Effects of the Invention] As described above, the memory module of the present invention is constructed by combining and integrating chip-on-board structures that are divided into a plurality of circuits or capacitors. In other words, not only can a memory module with a large memory capacity be constructed arbitrarily and with a high yield, but also a reduction in thickness can be easily achieved. For example, a byte SRAM module 512 which adopts the structure of the above embodiment has a length of 8011111, a width of 70cm, and a height of 2.5cm, and a structure in which the back sides of a byte SRAM module 1.2 are bonded to each other in 256. In that case, the length is 40ff.
111 Width: 70 mm 5 Height: approximately 5 mm. Thus, the memory module of the present invention can be constructed with high yield, has a large capacity, and can be made relatively thin or compact, so it can be said that it brings many practical advantages.

[Brief explanation of the drawing]

FIG. 1 is a side view showing an example of the configuration of a memory module according to the present invention. 1.2... Divided memory modules 1a, 2a.
・・IC element group 3.4 ・Board 5 ・・・Flat type conductor cable 6
·········connector

Claims (1)

[Claims] At least two or more memory modules each having an IC element group including a memory IC element mounted on a substrate surface in a chip-on-board structure; and a flat conductor cable for electrically connecting the memory modules, and an external connection connector installed in one of the memory modules. memory module.