JPH0220839Y2 - - Google Patents
Info
- Publication number
- JPH0220839Y2 JPH0220839Y2 JP5139382U JP5139382U JPH0220839Y2 JP H0220839 Y2 JPH0220839 Y2 JP H0220839Y2 JP 5139382 U JP5139382 U JP 5139382U JP 5139382 U JP5139382 U JP 5139382U JP H0220839 Y2 JPH0220839 Y2 JP H0220839Y2
- Authority
- JP
- Japan
- Prior art keywords
- stem
- lead
- gears
- carrier
- positioning jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 description 12
- 235000014676 Phragmites communis Nutrition 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011295 pitch Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 244000089486 Phragmites australis subsp australis Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5139382U JPS58153443U (ja) | 1982-04-08 | 1982-04-08 | ステム挿入装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5139382U JPS58153443U (ja) | 1982-04-08 | 1982-04-08 | ステム挿入装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58153443U JPS58153443U (ja) | 1983-10-14 |
JPH0220839Y2 true JPH0220839Y2 (enrdf_load_stackoverflow) | 1990-06-06 |
Family
ID=30062110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5139382U Granted JPS58153443U (ja) | 1982-04-08 | 1982-04-08 | ステム挿入装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58153443U (enrdf_load_stackoverflow) |
-
1982
- 1982-04-08 JP JP5139382U patent/JPS58153443U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58153443U (ja) | 1983-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4782589A (en) | Process of connecting lead frame to a semi-conductor device and a device to effect same | |
JPH0220839Y2 (enrdf_load_stackoverflow) | ||
US3918144A (en) | Bonding equipment and method of bonding | |
KR102430473B1 (ko) | 이젝터 핀 및 이를 포함하는 다이 이젝팅 장치 | |
US6193130B1 (en) | Bump bonding apparatus | |
US4109373A (en) | Method for manufacturing semiconductor devices | |
US3978579A (en) | Automatic assembly of semiconductor devices | |
KR900001623Y1 (ko) | 스템(stem) 삽입장치 | |
CN116469958A (zh) | 电池片抓取反弯工装、搬运装置及电池片的矫正方法 | |
US3941532A (en) | Apparatus for manufacturing semiconductor devices | |
US4846700A (en) | Lead frame for semi-conductor device | |
US5319847A (en) | Method and apparatus for conditioning leads of packaged electronic devices | |
JPH07214440A (ja) | ブレード等弾性特性加工品のチャッキング装置 | |
US3992770A (en) | Automatic assembly of semiconductor devices | |
US5715872A (en) | Process and device for the shaping of leads of integrated circuits | |
JPH06304823A (ja) | 軸用サークリップ自動組付け装置 | |
CN118629881B (zh) | 基于芯片装配的自动化工艺 | |
JP2834092B2 (ja) | Icの外部リード成形装置および成形方法 | |
CN216324786U (zh) | 一种振子整形机 | |
JPH0697342A (ja) | 半導体装置などの加工、製造方法及びその装置 | |
JPS6317249Y2 (enrdf_load_stackoverflow) | ||
CN115424852B (zh) | 电感组件自动组装机 | |
JPS6259456B2 (enrdf_load_stackoverflow) | ||
CN117102677B (zh) | 一种电阻件激光焊接及整形一体化设备 | |
US2820486A (en) | Hook forming assembly for automatic stem and mount making machines |