JPH02205584A - Magazine - Google Patents

Abstract

PURPOSE:To permit a continuous reception and feeding of can package type products under a specific orientation by providing a magazine with supporting pieces and auxiliary guide pieces and positioning leads in a guide space between the supporting pieces in a pair. CONSTITUTION:A tubular magazine 2 for keeping therein the semiconductor laser devices 5 of can package type is rectangular in cross section and supporting pieces 26 and auxiliary guide pieces 27 are provided on the inner surface of the opposite side walls 25 of the magazine in the longitudinal direction thereof. A slit 28 is formed between the supporting pieces 26 in a pair. The supporting piece 26 on the left side A extends longer than then one on the right side B to conform the position of a laser lead unsymmetrical about the center of the magazine so as to hold the laser device 5 under controlled orientation. Three leads 13 are inserted in the slit 28. The laser device 5 is so dimensioned as to avoid contact with the side walls 25 and the auxiliary guide pieces 27 of a stem 6 and a cap 7, when it is slidably moved with the stem 6 in contact with the supporting pieces 26.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magazine, and particularly to a stick-shaped magazine suitable for accommodating articles such as can-package type semiconductor laser devices.

[Conventional technology]

Semiconductor laser devices are widely used as light sources for optical communications or information processing devices such as compact discs and laser beam printers. The package form of these semiconductor laser devices is a can package type, nine box type, or the like.

Semiconductor laser devices such as No. 2 are packaged and shipped in a dish-shaped tray case inside the shell. for example,
A transparent square case made of styrene is introduced in the November 1988 issue of "Electronic Materials" published by Kogyo Kenkyukai, November 1, 1988, document page 205. This corner case is composed of a main body and a lid that closes the main body, and it is stated that it can be used as a case or a container case for products such as semiconductor parts.

On the other hand, IC (integrated circuit), LSI (large scale integrated circuit)
, diodes, hybrid integrated circuits, square chip parts, Melf parts, coils, volumes, switches, trimmers, resistors, etc., published by Kogyo Kenkyukai, "Electronic Materials J, March 19B3 issue, March 1982. As described on page 291 of the document published on the 1st, a stick-shaped extrusion molded magazine is used.
No. 92016 discloses a semiconductor device storage container (stick-shaped magazine) that accommodates a dual in-line type IC.

(Problems to be Solved by the Invention) As described above, a can package type semiconductor laser device has a metal disk-shaped stem (flange) and a cap-shaped stem that is airtightly attached to the main surface of the stem. A package is formed by the metal cap, and has a structure in which three leads protrude from the bottom surface of the stem.Furthermore, the ceiling portion of the cap is provided with an opening hole, and A transparent glass plate is airtightly attached to this opening hole to form a light transmission window.Furthermore, a heat sink is fixed to the main surface of the stem, and a semiconductor laser is connected to the heat sink via a submount. The device is fixed.Laser light emitted from this semiconductor laser device is emitted to the outside of the package through the light transmission window.

Incidentally, such semiconductor laser devices are packaged and shipped in dish-shaped trays as described above.
With such a tray packaging method, it takes a lot of time to pack the semiconductor laser device, it cannot be packed compactly, and it takes a lot of time to take out the product (semiconductor laser device) from the package, making it impossible to take it out continuously. Difficult to automate.

Therefore, the present inventor proposed that the can-package type semiconductor laser device can accommodate one row of semiconductor laser devices using the stem, and that the lead arrangement can be arranged asymmetrically on the circular stem. The present invention was created by focusing on the fact that specification is possible.

SUMMARY OF THE INVENTION An object of the present invention is to provide a magazine suitable for automation that can continuously accommodate and unload can-packaged products with their direction specified.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows: The stick-shaped magazine of the present invention includes a magazine body made of an elongated cylinder, and both ends of the magazine body. It consists of a removable stopper that blocks the Further, the magazine main body has a rectangular frame-like cross section, and a support piece and an auxiliary guide piece protrude from both inner walls of the magazine body, and a guide space (sliding space) is provided between the support pieces. A can package type semiconductor laser device (product) that has a cap on the main surface of the stem and has leads protruding from the back surface of the stem has a structure in which the stem is placed on the support piece and the leads are are accommodated in such a way that they protrude into the guide space.Since the protruding lengths of the pair of support pieces are asymmetrical, the guide space position is offset from the center of the cross section of the magazine body. Therefore, the semiconductor laser device is housed with a specific directionality.Furthermore, auxiliary guide pieces face each other at a predetermined interval on the main surfaces of the stem on both sides of the cap, and the stem is attached to the auxiliary guide pieces. The top surface of the cap does not touch the ceiling surface of the magazine body even if the cap contacts the ceiling surface of the magazine body.Also, this magazine is made of a conductive and light-shielding material, and the side wall has product markings. An opening along the housing direction is provided.

[Effect]

According to the above-mentioned means, the magazine of the present invention can be packed by accommodating the semiconductor laser devices sequentially from the end of the cylindrical magazine body and then attaching a removable stopper to the end of the magazine body, thereby simplifying the packing work. This is extremely easy and reduces work time. Furthermore, the magazine of the present invention has a cylindrical structure that accommodates the semiconductor laser devices in a row, and since the position of the guide space is eccentric, it is possible to accommodate the semiconductor laser devices with their orientation specified. , it is possible to automate the loading and unloading of semiconductor laser devices by attaching the magazine body to a mounting machine or the like. In particular, since this magazine has an opening in the side wall of the magazine body, the transfer claw of the mounting machine can be inserted into this opening, so that the semiconductor laser device can be sent out using the transfer claw. Further, since the magazine of the present invention has a structure in which semiconductor laser devices are arranged in a line, it becomes compact. In addition, the magazine of the present invention is configured such that the upper and lower sides of the semiconductor laser device are regulated by the support piece and the auxiliary guide piece so that the top surface of the cap of the semiconductor laser device does not come into contact with the ceiling surface of the magazine body. The light transmitting window of the magazine will not be contaminated, and since the magazine of the present invention is made of a light-shielding and conductive material, it is possible to prevent the semiconductor laser device from deterioration due to light and from being damaged by electrostatic discharge. .

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a magazine according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view, FIG. 3 is a plan view of the magazine body with the upper part cut away, and FIG. 4 is a magazine according to the present invention. FIG. 2 is a partially cutaway perspective view of a semiconductor laser device housed in the semiconductor laser device.

The magazine l of this embodiment is as shown in FIG.
It consists of an elongated cylindrical magazine body 2 and stoppers 3 that are detachably attached to both ends of the magazine body 2. Products to be accommodated, that is, semiconductor laser devices as shown in FIG. 4, are housed in a line in this magazine body 2. The magazine body 2 is formed by extrusion molding using a resin that is electrically conductive and colored to have a light-shielding property.

Further, the stopper 3 is made of rubber so as to act elastically.

Here, the semiconductor laser device 5, which is a product housed in the magazine body 2, will be explained.

As shown in FIG. 4, the can package type semiconductor laser device 5 includes a plate-shaped stem 6, which is the main component of the assembly, and a hat-shaped cap 7 that is hermetically fixed to the main surface of the stem 6. It consists of The stem 6 is a circular metal plate with a thickness of several mm, and a heat sink 8 made of copper is fixed to the center of its main surface (upper surface) with a brazing material or the like. A semiconductor laser element 10 is fixed to the side surface of this heat sink 8 via a submount 9. The semiconductor laser element 10 is configured to emit laser light 11 from its both ends, that is, its upper and lower ends.

On the other hand, the main surface of the stem 6 receives the laser beam 11 emitted from the lower end of the semiconductor laser element 10, and receives the laser beam 11 emitted from the lower end of the semiconductor laser element 10.
A light receiving element 12 for monitoring the light output of the light receiving element 1 is fixed. This light receiving element 12 is fixed to an inclined surface provided on the main surface of the stem 6 via a bonding material (not shown).

On the other hand, three beam parts 13 are fixed to the stem 6. One lead 13 is electrically and mechanically fixed to the back surface of the stem 6, and the other two leads 13 are attached to the stem 6.
It penetrates through the stem 6 and is electrically insulated and fixed to the stem 6 via an insulator 14 such as glass. As shown in FIG. 3, these leads 13 are about 90
Since the leads 13 are arranged at intervals of 30 degrees, the leads 13 are not present on the half circumference side of the stem 6. Therefore, the arrangement positions of the leads 13 of the semiconductor laser device 5 are asymmetrical with respect to a line (reference line 15) connecting the outsides of the two beam parts 13 attached to the stem 6 via the insulator 14. This asymmetric lead arrangement is then utilized in the magazine structure of the present invention.

Furthermore, two leads 13 protrude from the main surface of the stem 6.
One end of a wire 16, the other end of which is connected to the electric bridge of the semiconductor laser element 10 or the light receiving element 12, is connected to the upper end of each of the wires.

Further, a metal cap 7 is airtightly fixed to the main surface of the stem 6 to seal the semiconductor laser element IO and the heat sink 8. Further, an opening hole is provided on the upper surface of the cap 7, and this opening hole is hermetically closed with a transparent glass plate 17, thereby forming a light transmission window 18. Therefore, the laser beam 11 emitted from the upper end of the semiconductor laser device 10 passes through the transparent glass plate 17 and is emitted outside the package formed by the stem 6 and the cap 7.

In addition, the outer circumferential portion of the stem 6 includes a pair of single-shaped notches 19 and a rectangular notch 20, which are provided facing each other.
is provided and used for positioning during assembly. Further, the one piece 13 detached from the wire 15 is provided on the rectangular cutout 20 side.

The cylindrical magazine body 2 that accommodates the semiconductor laser device 5 is formed by extrusion molding using a resin that is electrically conductive and colored to have a light-shielding property.

The magazine body 2 has a rectangular frame shape in cross section, and
A support piece 26 and an auxiliary guide piece 27 are provided on the inner surfaces of both side walls 25, respectively, along the longitudinal direction of the magazine body 2, that is, along the arrangement direction of the semiconductor laser devices (products) 5, which are the objects to be accommodated. A guide space (slit) 28 with a width of W is formed between the pair of support pieces 260, and the protruding length of the pair of support pieces 26 forming this guide space 28 is as shown in FIG. As can be seen, in the case of the left support piece 26, the protrusion length is A, which is longer than the protrusion length B of the right support piece 26. This corresponds to the fact that the lead positions of the semiconductor laser device 5 are asymmetrical as described above, and the semiconductor laser device 5 is housed with directionality.

That is, three rods 13 are inserted into this slit 28. As mentioned above, the rod 13 protruding from the back surface of the stem 6 is 18 as shown in FIG.
Since it has a structure in which three leads are arranged at 90" intervals in the 0° region, the width W of the slit 28 is equal to the base il that connects the outside of the two leads 13 arranged at 180" intervals.
#LA15 and the distance a between the auxiliary reference line 29 that is parallel to the reference line 15 and in contact with the outside of the remaining leads 13,
The dimensions are such that the three leads 13 do not get caught, taking into account errors in the mounting position of the leads and errors in the machining dimensions of the magazine body 2.

On the other hand, the auxiliary guide piece 27 provided at the upper stage of the support piece 26 extends to the side of the cap 7 of the semiconductor laser device 5 . Then, the semiconductor laser device 5 is connected to the stem 6.
The dimensions of each part are set so that the stem 6 and the cap 7 do not come into contact with the side walls 25 of the magazine body 2 and the auxiliary guide piece 27 when the stem 6 and the cap 7 slide while contacting the support piece 26. Further, the distance between the upper surface of the cap 7 and the ceiling surface of the magazine body 2 is set wide, so that the flange 30 of the stem 6 or the camp 7 is placed on the auxiliary guide piece 27 when the magazine body 2 is turned over. Even though
The top surface of the cap 7 is dimensioned so as not to come into contact with the ceiling surface of the magazine body 2.

This is to prevent the light transmitting window 18 of the cap 7 from coming into contact with the ceiling surface of the magazine body 2 and sitting thereon.

On the other hand, slit-shaped openings 35 are provided at both end portions of one side wall 25 of the magazine body 2. This opening 35 is formed in a region corresponding to the lower side of the support piece 26 and extends along the longitudinal direction of the magazine body 2, in other words, along the arrangement direction of the products 5. Since this magazine body 2 is a cylindrical stick-like magazine, it can also be attached to a mounting machine that mounts the semiconductor laser device 5 or a characteristic sorter or marking machine that sorts the characteristics of the semiconductor laser device 5. Become. At this time, a transfer claw 36 of a transfer mechanism of these machines, etc. can be inserted into the opening 35. Therefore, by the tact movement of the transfer claw 36, the semiconductor laser devices 5 are sent out one by one from the magazine body 2 (loading), or the semiconductor laser devices 5 are accommodated one by one in the magazine body 2 (unloading). be able to.

The stopper 3 constituting the magazine 1 is entirely made of rubber, and includes a block-shaped clamp portion 37,
Fitting portion 3 extending from the upper end to the side of this clamp portion 37
It consists of 8. Further, this fitting portion 38 is partially provided with protrusions 39 on its upper and lower surfaces. The fitting portion 38 connects the support piece 26 of the magazine body 2 and the magazine body 2.
It is fitted between a pair of auxiliary guide pieces 27 between the ceiling surface and the ceiling surface.

At this time, since the stopper 3 is made of rubber, the protruding protrusion 39 is elastically deformed, thereby attaching the stopper 3 to the magazine body 2 so as not to fall off.

According to such an embodiment, the following effects can be obtained.

(1) The magazine of the present invention consists of a cylindrical stick-shaped magazine body that accommodates semiconductor laser devices in one row, and stoppers that are detachably attached to both ends of the magazine body. A certain semiconductor laser device can be continuously accommodated or carried out, and the effect of good loading/unloading workability can be obtained.

(2) The magazine of the present invention is a cylindrical stick-like magazine that accommodates semiconductor laser devices in one row, and
Since the structure is such that the semiconductor laser device is accommodated so as to have a specific directionality due to the specificity of the lead arrangement, it is possible to perform loading and unloading with directionality.

(3) According to (2) above, the magazine of the present invention can load and unload products with directionality, and since the magazine body is an elongated cylindrical body, it is possible to select characteristics of semiconductor laser devices. Attached to the loading/unloading part of a special marking machine,
The effect is that loading and unloading of the semiconductor laser device can be automatically performed.

(4) The magazine of the present invention can be packed by accommodating the semiconductor laser devices sequentially from the end of the magazine body and then attaching a removable stopper to the end of the magazine body, making the packing work extremely easy and reducing the work time. This has the effect of being done.

(5) Since the magazine of the present invention has a cylindrical structure that accommodates semiconductor laser devices in a row, it can be made compact.

(6) The magazine of the present invention is configured so that the top surface of the cap of the semiconductor laser device does not come into contact with the ceiling surface of the magazine body, and is sealed with a stopper after being accommodated in the magazine body. This has the effect that the light transmitting window of the light transmitting window is not contaminated.

(7) Since the magazine of the present invention is made of a light-shielding and conductive material, it is possible to prevent deterioration of the semiconductor laser device due to light and damage caused by electrostatic discharge.

(8) Since the magazine body of the present invention is formed by extrusion molding using resin as a raw material, it is possible to achieve the effect of reducing manufacturing costs.

(9) According to the above (1) to (8), according to the present invention, a synergistic effect can be obtained in that it is possible to provide a magazine at a low cost that facilitates product packaging work and can also be automated.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, in the embodiment described above, the openings 35 were provided at both ends of the magazine body 2, but the same effect as in the embodiment described above can be obtained even if the openings 35 are provided over the entire length of the magazine body 2.

Furthermore, although the structure of the above embodiment is such that the products are accommodated in one row, a multi-row structure such as two rows or a multi-stage structure can further increase the storage capacity. Further, in the present invention, for a semiconductor laser device with a rectangular stem shape or a similar semiconductor laser device of a resin package type, the cross-sectional structure of the magazine body is adjusted to match the dimensions of the semiconductor laser device. Of course, it is only necessary to select the shape and dimensions.

In the above explanation, the invention made by the present inventor was mainly applied to a magazine for housing a semiconductor laser device, which is the background field of application, but the invention is not limited thereto. The present invention can be similarly applied to a magazine for housing a diode device or a semiconductor laser device.

The present invention is applicable to at least a packaging technique for a product having a structure in which protrusions protrude from the package portion and the bottom of the package.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

The magazine of the present invention has a structure in which a semiconductor laser device can be housed with a specified direction inside the cylindrical magazine body, so it can be attached to the loading/unloading part of various devices, and the magazine can be It becomes possible to automate the loading and unloading work. Further, after the semiconductor laser device is housed in the magazine body, packaging is completed by simply fitting a stopper to the end of the magazine body, so that automation of the packaging work and reduction in packaging time can be achieved. Furthermore, since the magazine body that accommodates the semiconductor laser device is made of a light-shielding and conductive resin, it is possible to prevent the housed semiconductor laser device from being degraded by light or damaged by electrostatic discharge.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a magazine according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view, FIG. 3 is a plan view of the magazine body with the upper part cut away, and FIG. 4 is a magazine according to the present invention. FIG. 2 is a partially cutaway perspective view of a semiconductor laser device housed in the storage device. DESCRIPTION OF SYMBOLS 1...Magazine, 2...Magazine body, 3...Stopper, 5...Semiconductor laser device W (product), 6...
Stem, 7... Cap, 8... Heat sink, 9
...Submount, 10...Semiconductor laser element, 1
DESCRIPTION OF SYMBOLS 1... Laser light, 12... Light receiving element, 13... Lead, 14... Insulator, 15... Reference line, 16...
・Wire, 17...Glass plate, 18...Light transmission window,
19... 1-character-shaped notch, 20... rectangular notch, 2
5... Side wall, 26... Support piece, 27... Auxiliary guide piece, 28... Guide space (slit), 29...
Auxiliary reference line, 30... flange, 35... opening,
36... Transfer claw, 37... Clamp part, 38...
Fitting portion, 39...projection.

Claims (4)

[Claims] 1. A magazine that accommodates a can-package type product consisting of a plate-shaped stem, a cap attached to the main surface of the stem, and a plurality of leads attached to the back surface of the stem in a protruding state. consists of a cylindrical magazine body and stoppers that are detachably attached to both ends of the magazine body, and the magazine body includes a support piece that supports the back surface of the stem, and a support piece that faces the side of the main surface of the stem. It has an auxiliary guide piece that faces the main surface of the stem with a desired gap therebetween, and is configured such that the lead is located in the guide space between the pair of support pieces. Magazine to do. 2. 2. The magazine according to claim 1, wherein the guide space is provided at a position offset from the center of the cross section of the magazine so as to define the directionality of the product. 3. Between the top surface of the cap and the magazine ceiling surface,
2. The magazine according to claim 1, wherein a gap is provided at a height such that the top surface of the cap does not come into contact with the ceiling surface of the magazine even if the product moves to the maximum extent. 4. 2. The magazine according to claim 1, wherein an opening is provided in at least a portion of the side wall of the magazine along the product storage direction.