JPH02205585A - Magazine - Google Patents

Abstract

PURPOSE:To permit a continuous reception and feeding of can package type products under a specific orientation by providing a magazine with supporting pieces and auxiliary guide pieces, positioning a plurality of leads in a guide space between the supporting pieces in a pair and forming a projection to prevent the rotation thereof. CONSTITUTION:A magazine 2 is provided with supporting pieces 26 and auxiliary guide pieces 27 in the arranging direction of semiconductor laser devices 5 and a slit 28 is formed between the supporting pieces 26 in a pair. The supporting piece 26 on the right side A extends longer than the one on the left side B and the laser devices 5 are received in the magazine in such direction as to conform the position of laser leads unsymmetrical about its center. Three leads 13 are inserted in the slit 28. A lead rotation preventive projection 46 is provided in a position facing the slit 28 and between the two leads 13 along a reference line 15 and the one lead 13 along an auxiliary reference line 29 parallel to the reference line 15 so as to control the lead orientation. In this way, there is no loading of the leads in a guide space between the supporting pieces, thereby permitting a smooth movement of the laser devices 5.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a magazine, and particularly to a stick-shaped magazine suitable for accommodating articles such as can-package type semiconductor laser devices.

[Conventional technology]

Semiconductor laser devices are widely used as light sources for optical communications or information processing devices such as compact discs and laser beam printers.The package format of these semiconductor laser devices is a can package type, two-box type, etc. .

Such semiconductor laser devices are packaged and shipped in a dish-shaped tray case inside the shell. for example,
A transparent square case made of polystyrene is introduced in the November 1988 issue of Electronic Materials J, published by Kogyo Research Association, November 1, 1988, document page 205. It is stated that it consists of a lid that closes and can be used as a case or container case for products such as semiconductor parts.

On the other hand, IC (integrated circuit), LSI (large scale integrated circuit),
As a magazine containing diodes, hybrid integrated circuits, square chip parts, Melf parts, coils, volumes, switches, trimmers, resistors, etc., published by Kogyo Kenkyukai, "Electronic Materials J, March 1983 issue, March 1, 1983. A stick-shaped extrusion molded magazine is used as described in the Japanese publication, document page 291.
Publication No. 2016 describes a semiconductor device storage container (stick-shaped magazine) that accommodates an in-line type IC.
It is shown.

(Problems to be Solved by the Invention) In recent years, in order to automate the mounting of semiconductor laser devices on the customer side, there has been a demand for a magazine from which semiconductor laser devices can be automatically taken out.

During product removal, i.e. product supply (loading)
One of the basic performance requirements of magazines is that the products always come out of the magazine facing in a fixed direction.

On the other hand, in a can package type semiconductor laser device, the package is formed by, for example, a metal disk-shaped stem (flange) and a cap-shaped metal cap that is airtightly attached to the main surface of the stem. Additionally, the stem has a structure in which three leads protrude from the lower surface of the stem. Further, a light transmitting window is provided in the ceiling portion of the cap, and the structure is such that a laser beam is emitted from this light transmitting window.

Such semiconductor laser devices are packaged and shipped in dish-shaped trays as described above, but with such tray packaging, it takes a lot of time to pack the semiconductor laser devices, and It cannot be packed compactly, and it takes a lot of time to take out the product (semiconductor laser device) from the package, making it difficult to take out the product continuously, making it difficult to automate.

SUMMARY OF THE INVENTION An object of the present invention is to provide a magazine suitable for automation that can continuously accommodate and unload can-packaged products with their direction specified.

Another object of the present invention is to provide a magazine that can be stably loaded and unloaded without causing products to get caught in the middle and become jammed.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows: The stick-shaped magazine of the present invention includes a magazine body made of an elongated cylinder, and both ends of the magazine body. It consists of a removable stopper that blocks the Further, the magazine main body has a rectangular frame-like cross section, and has a support piece and an auxiliary guide piece protruding from the opposite side wall thereof, and a guide space (slit) between the support piece and the support piece. It has a structure that forms. Since the protruding lengths of the pair of support pieces are asymmetrical, the guide space position is offset from the center in the cross section of the magazine body. Therefore, the semiconductor laser device is housed with a specific orientation. Further, a rotation prevention protrusion is provided along the center of the guide space. A can-package type semiconductor laser device (product) having a cap on the main surface of the stem and having leads protruding from the rear surface of the stem is arranged so that the stem is placed on the support piece and the leads protrude into the guide space. be accommodated. Furthermore, one and two of the three leads are partitioned by the rotation prevention protrusion, so that the leads as a whole cannot be rotated.

This anti-rotation ridge is provided to prevent clogging due to rotation during movement of the lead due to dimensional error in the width of the guide space when the magazine main body is formed by extrusion molding.

[Effect]

According to the above means, the magazine of the present invention has a cylindrical structure that accommodates the semiconductor laser devices in a row, and the guide space into which the leads of the semiconductor laser devices are placed is eccentric. Since the directionality is specified, the semiconductor laser device moves within the magazine body with directionality, and since the width dimension of the guide space is formed by extrusion molding, there is a large variation in the width dimension of the guide space for lead guidance. Even if a large gap occurs between the guide spaces, the leads are partitioned and regulated by the anti-rotation ridge provided along the center of the guide space, so that the guide spaces n and 't' rotate and become clogged. Loading and unloading of products can be performed stably without any problems. Therefore, by attaching the magazine body to a mounting machine or the like, it becomes possible to automate the loading and unloading of the semiconductor laser device. In particular, since this magazine has an opening in the side wall of the magazine body, the transfer claw of the mounting machine can be inserted into this opening, so that the semiconductor laser device can be sent out using the transfer claw. Furthermore, the magazine of the present invention can be packed by accommodating the semiconductor laser devices sequentially from the end of the cylindrical magazine body, and then attaching a removable stopper to the end of the magazine body, making the packing work extremely easy. Time is reduced.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

Fig. 1 is a front view showing a magazine according to an embodiment of the present invention, Fig. 2 is a partially enlarged perspective view, Fig. 3 is an enlarged sectional view, and Fig. 4 is a cutaway of the upper part. FIG. 5 is a partially cutaway perspective view of a semiconductor laser device accommodated in the magazine of the present invention.

The magazine 1 of this embodiment, as shown in FIG.
It consists of an elongated cylindrical magazine body 2 and stoppers 3 that are detachably attached to both ends of the magazine body 2. Products to be accommodated, that is, semiconductor laser devices as shown in FIG. 5, are housed in a line in this magazine body 2. The magazine body 2 is formed by extrusion molding using a resin that is electrically conductive and colored to have a light-shielding property. Further, the stopper 3 is made of rubber so as to act elastically.

Here, the semiconductor laser device 5, which is a product housed in the magazine body 2, will be explained.

As shown in FIG. 5, the can-package type semiconductor laser device 5 includes a plate-shaped stem 6, which is the main component of the assembly, and a hat-shaped cap 7 that is hermetically fixed to the main surface of the stem 6. It consists of The stem 6 is a circular metal plate with a thickness of several mm, and a copper heat sink 8 is fixed to the middle part of the main surface (upper surface) with solder material or the like. A semiconductor laser element 10 is fixed to the side surface via a submount 9. The semiconductor laser element 1o emits laser light 11 from both ends, that is, from the upper and lower ends.

On the other hand, the main surface of the stem 6 receives the laser beam 11 emitted from the lower end of the semiconductor laser element 10, and receives the laser beam 11 emitted from the lower end of the semiconductor laser element 10.
A light receiving element 12 for monitoring the light output of the light receiving element 1 is fixed. This light receiving element 12 is fixed to an inclined surface provided on the main surface of the stem 6 via a bonding material (not shown).

On the other hand, three leads 13 are fixed to the stem 6. One lead 13 is electrically and mechanically fixed to the back surface of the stem 6, and the other two leads 13 are attached to the stem 6.
It penetrates through the stem 6 and is electrically insulated and fixed to the stem 6 via an insulator 14 such as glass. As shown in FIG. 4, these leads 13 have approximately 90
Since they are arranged at intervals of 100 degrees, there is no beam 13 on the half circumference side of the stem 6. Therefore, the arrangement positions of the leads 13 of the semiconductor laser device 5 are asymmetrical with respect to a line (reference line 15) connecting the outer sides of the two leads 13 attached to the stem 6 via the insulator 14. This asymmetric lead arrangement is then utilized in the magazine structure of the present invention.

Further, two rods 13 protruding from the main surface of the stem 6
One end of a wire 16, the other end of which is connected to the electrode of the semiconductor laser element 10 or the light receiving element 12, is connected to the upper end of each of the wires.

Further, a metal cap 7 is airtightly fixed to the main surface of the stem 6 to seal the semiconductor laser element 10 and the heat sink 8. Further, an opening hole is provided on the upper surface of the cap 7, and this opening hole is hermetically closed with a transparent glass plate 17, thereby forming a light transmission window 18. Therefore, the laser beam 11 emitted from the upper end of the semiconductor laser device 10 passes through the transparent glass plate 17 and is emitted outside the package formed by the stem 6 and the cap 7.

The outer peripheral portion of the stem 6 includes a pair of V-shaped notches 19 and a rectangular notch 20, which are provided facing each other.
is provided and used for positioning during assembly. Further, one wire 13 detached from the wire 15 is provided on the rectangular cutout 20 side.

The cylindrical magazine body 2 that accommodates the semiconductor laser device 5 is formed by extrusion molding using a resin that is electrically conductive and colored to have a light-shielding property. The magazine main body 2 has a rectangular frame shape in cross section, and the inner surfaces of both side walls 25 are provided with grooves along the longitudinal direction of the magazine main body 2, that is, along the arrangement direction of the semiconductor laser devices F (products) 5 that are accommodated. Support piece 26 and auxiliary guide piece 2
7 is provided. Between the pair of support pieces 26,
A guide space (slit) 28 with a width of W is formed, and the protruding length of the pair of support pieces 26 forming this guide space 28 is longer than that of the support piece 26 on the right side, as shown in Figure 2. In case 4, it becomes A, which is longer than the protruding length B of the left support piece 26. This corresponds to the fact that the lead positions of the semiconductor laser device 5 are asymmetrical as described above, and the semiconductor laser device 5 is housed with directionality.

That is, three rods 13 are inserted into this slit 28. As mentioned above, the rod 13 protruding from the back surface of the stem 6 is 18 as shown in FIG.
Since it has a structure in which three leads are arranged at 90" intervals in the 0° area, the radius W of the slit 28 is equal to the reference line 15 that connects the outside of the two leads 13 arranged at 1801 intervals. Then, three leads 13 are set at intervals a of the auxiliary reference line 290 parallel to the reference line 15 and in contact with the outside of the remaining lead 13, taking into consideration errors in the mounting position of the leads and errors in machining dimensions of the magazine body 2. The dimensions are such that it does not get caught.

Furthermore, a rotation prevention protrusion (rotation prevention portion) 46 is provided in a portion of the bottom plate 45 of the main body of the magazine body 2 that faces the guide space (slit) 28 . When the semiconductor laser device 5 is housed in the magazine main body 2, the anti-rotation protrusion 46 is arranged such that two of the three guide portions 13 that enter the guide space 28 are located along the reference line 15. It is located between the main lead 13 and the remaining lead 13 along the auxiliary reference line 29 parallel to the reference llA15,
The positional accuracy of the lead 13 with respect to the stem 6 plays a role of regulating the directionality of the pair of leads constituted by the book and one lead.
is fixed to the stem 6 by welding or by welding to the stem 6 with an insulator 14 made of glass. Since the dimensional accuracy of the forming process is not very high and the tolerance is large, the dimension of W is designed with sufficient margin.As a result, the dimension of W is large and the distance a between the pair of leads is In this case, when the semiconductor laser device 5 slides on the support piece 26 in the direction of the arrow, as shown in FIG. The lead 13 (rotating lead 4) along the auxiliary reference line 29 on the opposite side rotates using the fulcrum lead 47 as a fulcrum, and the rotating lead 48 and the fulcrum lead 4 rotate.
The angle between the line connecting the lead 13 and the edge of the support piece 26 becomes more obtuse, and the lead 13 bites between the pair of support pieces 26 and becomes distorted, making it difficult for the semiconductor laser device 5 to slide. In the worst case, the semiconductor laser device 5
movement will stop. Therefore, by providing the rotation prevention protrusion 46, the rotation lead 4
8 attempts to rotate around the fulcrum lead 47, the rear lead 13, that is, the rear lead 49 along the reference line 15 hits the anti-rotation protrusion 46, and the rotation lead 48 no longer rotates. As a result, the leads 13 will no longer become clogged between the guide spaces 28, and the semiconductor laser device 5 can be moved smoothly.

On the other hand, the auxiliary guide piece 27 provided at the upper stage of the support piece 26 extends to the side of the cap 7 of the semiconductor laser device 5. Then, the semiconductor laser device 5 is connected to the stem 6.
The dimensions of each part are set so that the stem 6 and cap 7 do not come into contact with the side walls 25 of the magazine body 2 and the auxiliary guide piece 27 when the stem 6 and the cap 7 slide while contacting the support piece 26. Further, the distance between the top surface of the cap 7 and the ceiling surface of the magazine body 2 is set wide, so that when the magazine body 2 is turned over, the stem 6 or the flange 30 of the cap 7 is placed on the auxiliary guide piece 27. Even though
The top surface of the cap 7 is dimensioned so as not to come into contact with the ceiling surface of the magazine body 2.

This is to prevent the light transmitting window 18 of the cap 7 from coming into contact with the ceiling surface of the magazine body 2 and sitting thereon.

On the other hand, as shown in FIGS. 1 to 3, one side wall 25 of the magazine body 2 is provided with a slit-shaped opening 35 over its entire length. This opening 35 is formed in a region corresponding to the lower side of the support piece 26 and extends along the longitudinal direction of the magazine body 2, in other words, along the arrangement direction of the products 5. Since this magazine body 2 is a cylindrical stick-like magazine, it can also be attached to a mounting machine that mounts the semiconductor laser device 5 or a characteristic sorter or marking machine that sorts the characteristics of the semiconductor laser device 5. Become.

At this time, a transfer claw 36 of a transfer mechanism of these machines, etc. can be inserted into the opening 35. Therefore, by the tact movement of the transfer claw 36, the semiconductor laser devices 5 are sent out one by one from the magazine body 2 (loading), or the semiconductor laser devices 5 are accommodated one by one in the magazine body 2 (unloading). be able to.

The stopper 3 constituting the magazine l is entirely made of rubber, and includes a block-shaped clamp portion 37,
Fitting portion 3 extending from the upper end to the side of this clamp portion 37
It consists of 8. Further, this fitting portion 38 is partially provided with protrusions 39 on its upper and lower surfaces. The fitting portion 38 connects the support piece 26 of the magazine body 2 and the magazine body 2.
It is fitted between a pair of auxiliary guide pieces 27 between the ceiling surface and the ceiling surface.

During this fitting, since the stopper 3 is made of rubber, the protruding ridges 39 are elastically deformed, thereby attaching the stopper 3 to the magazine body 2 so as not to fall off.

According to such an embodiment, the following effects can be obtained.

(1) The magazine of the present invention consists of a cylindrical stick-shaped magazine body that accommodates semiconductor laser devices in one row, and stoppers that are detachably attached to both ends of the magazine body. A certain semiconductor laser device can be continuously accommodated or carried out, and the effect of good loading/unloading workability can be obtained.

(2) The magazine of the present invention is a cylindrical stick-like magazine that accommodates semiconductor laser devices in one row, and
Since the structure is such that the semiconductor laser device is accommodated so as to have a specific directionality due to the specificity of the lead arrangement, it is possible to perform loading and unloading with directionality. In particular, with this magazine, clogging in the magazine body 2 of the semiconductor laser device 5 may occur due to dimensional variations in the spacing between pairs of leads during assembly of the semiconductor laser device 5 or variations (tolerance) in extrusion molding dimensions of the magazine body 2. In order to prevent
The semiconductor laser device 5 moves smoothly within the magazine main body 2 without becoming clogged.

(3) According to (2) above, the magazine of the present invention can load and unload products with directionality, and since the magazine body is an elongated cylindrical body, it is possible to select characteristics of semiconductor laser devices. Attached to the loading/unloading part of a special marking machine,
The effect is that loading and unloading of the semiconductor laser device can be automatically performed.

(4) The magazine of the present invention can be packed by accommodating the semiconductor laser devices sequentially from the end of the magazine body and then attaching a removable stopper to the end of the magazine body, making the packing work extremely easy and reducing the work time. This has the effect of being done.

(5) Since the magazine of the present invention has a cylindrical structure that accommodates semiconductor laser devices in a row, it can be made compact.

(6) The magazine of the present invention is configured so that the top surface of the cap of the semiconductor laser device does not come into contact with the ceiling surface of the magazine body, and is sealed with a stopper after being accommodated in the magazine body. This has the effect that the light transmitting window of the light transmitting window is not contaminated.

(7) Since the magazine of the present invention is made of a light-shielding and conductive material, it is possible to prevent deterioration of the semiconductor laser device due to light and damage caused by electrostatic discharge.

(8) Since the magazine body of the present invention is formed by extrusion molding using resin as a raw material, it is possible to achieve the effect of reducing manufacturing costs.

(9) According to (1) to (8) above, the present invention provides an inexpensive magazine that facilitates product packaging work, is compatible with automation, and allows stable movement of products without clogging. The synergistic effect of being able to do this is obtained.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, in the embodiment described above, the opening 35 was provided over the entire length of the magazine body 2, but the same effect as in the embodiment described above can be obtained even if the opening 35 is provided at both ends of the magazine body 2.

Furthermore, although the structure of the above embodiment is such that the products are accommodated in one row, a multi-row structure such as two rows or a multi-stage structure can further increase the storage capacity.

FIG. 6 is a sectional view showing a magazine body 2 according to another embodiment of the present invention. In this example, instead of the anti-rotation protrusion 46 in the previous embodiment, the rotary lead 48 is placed on the rotary lead 48 side so that the rotary lead 48 does not rotate about the fulcrum lead 47, that is, so that the stem 6 cannot rotate. A on the side wall 25
A stem guide portion 50 is provided at the tip of the support piece 26 which protrudes by a length. In this structure, in extrusion molding of the magazine body 2, the distance history of the stem guide portion 50 with respect to the tip of the supporting piece 26 which projects by a length A is defined. Furthermore, regarding the positional accuracy of the lead 13 with respect to the stem 6, emphasis is placed only on the positional accuracy of the lead 13 fixed by the insulator 14, that is, the fulcrum lead 47, and the spacing a between the leads is not considered. This prevents the stem 6 from rotating and prevents the lead 13 from clogging between the guide spaces 28. therefore,
This example also allows smooth loading and unloading of the semiconductor laser device 5.

FIG. 7 has a structure that combines the structures shown in FIGS. 6 and 2. That is, in this example, the rotation of the stem 6 is inhibited by the action of the rotation prevention protrusion 46 and the re-rotation prevention section of the stem guide section 50, thereby preventing the semiconductor laser device 5 moving within the magazine body 2 from clogging. It is something.

Furthermore, in the present invention, for a semiconductor laser device with a rectangular stem shape or a similar semiconductor laser device of a resin package type, the cross-sectional structure of the magazine body is adjusted to match the dimensions of these semiconductor laser devices. Of course, it is only necessary to select the shape and dimensions.

In the above explanation, the invention made by the present inventor was mainly applied to a magazine for housing a semiconductor laser device, which is the background field of application, but the invention is not limited thereto. The present invention can be similarly applied to a magazine for housing a diode device or a semiconductor laser device.

The present invention is applicable to at least a packaging technique for a product having a structure in which protrusions protrude from the package portion and the bottom of the package.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions among the inventions disclosed in this application is as follows.

The magazine of the present invention has a structure in which a semiconductor laser device can be housed with a specified direction inside the cylindrical magazine body, and also has a structure that can prevent rotation of the semiconductor laser device, thereby preventing lead clogging at the slit portion. Since the magazine is designed to prevent this, it becomes possible to automate the loading and unloading work of semiconductor laser devices into various devices using the magazine. Further, after the semiconductor laser device is housed in the magazine body, packaging is completed by simply fitting a stopper to the end of the magazine body, so that automation of the packaging work and reduction in packaging time can be achieved.

[Brief explanation of the drawing]

Fig. 1 is a front view showing a magazine according to an embodiment of the present invention, Fig. 2 is a partially enlarged perspective view, Fig. 3 is an enlarged sectional view, and Fig. 4 is a magazine main body with the upper part cut away. . 5 is a partially cutaway perspective view of a semiconductor laser device housed in the magazine of the present invention, and FIG. 6 is an enlarged sectional view showing a magazine according to another embodiment of the present invention. FIG. 7 is an enlarged sectional view showing a magazine according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Magazine, 2... Magazine body, 3... Stopper, 5... Semiconductor laser device (product), 6...
Stem, 7... Cap, 8... Heat sink, 9
...Submount, 10...Semiconductor laser element, 1
DESCRIPTION OF SYMBOLS 1... Laser light, 12... Light receiving element, 13... Lead, 14... Insulator, 15... Reference line, 16...
・Wire, 17...Glass plate, 18...Light transmission window,
19... V-shaped notch, 2o... Rectangular notch, 2
5...Side wall, 26...Support piece, 27...Auxiliary guide piece, 2nd...Guide space (slit), 29...
Auxiliary reference line, part, 36...transfer claw, joint part, 39...protrusion, protrusion, 47...fulcrum 9...rear lead, 5 30...flange, 35... Opening 37...clamp part, 38...fitting 45...bottom plate, 46...rotation prevention door, 48...rotation lead, 40...stem guide part. Figure Figure 46- Rotational spinning diagram

Claims (4)

[Claims] 1. A magazine that accommodates a can-package type product consisting of a plate-shaped stem, a cap attached to the main surface of the stem, and a plurality of leads attached to the back surface of the stem in a protruding state. consists of a cylindrical magazine body and stoppers that are detachably attached to both ends of the magazine body, and the magazine body includes a support piece that supports the back surface of the stem, and a support piece that faces the side of the main surface of the stem. an auxiliary guide piece that faces the main surface of the stem with a desired gap therebetween, and is configured such that the lead is located in a guide space between the pair of support pieces, and the plurality of leads and/or a magazine characterized in that it is provided with a rotation prevention part that prevents rotation of the stem. 2. 2. The magazine according to claim 1, wherein the guide space is provided at a position offset from the center of the cross section of the magazine so as to define the directionality of the product. 3. Between the top surface of the cap and the magazine ceiling surface,
2. The magazine according to claim 1, wherein a gap is provided at a height such that the top surface of the cap does not come into contact with the ceiling surface of the magazine even if the product moves to the maximum extent. 4. 2. The magazine according to claim 1, wherein an opening is provided in at least a portion of the side wall of the magazine along the product storage direction.