KR0185513B1 - Tray for semiconductor package - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging tray for a semiconductor package, and includes a plurality of pockets and has a rib for preventing shaking of the package in each pocket. In order to solve the problem that the rib is broken by the force of the package shaking when it is applied, and the defect such as the outer lead of the package is bent or unfolded, the four outer edges of the rib and the four corners of the pocket wall are integrated. By connecting to form a rib support bar, the ribs are supported by the rib support bar so that the ribs are not easily broken, even if the ribs are forced from the package, and the fracture of the ribs is prevented, thereby preventing damage to the external leads. It is a way to

Description

Packaging trays for semiconductor packages with rib support bars

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging tray for a semiconductor package, and more particularly, in a packaging tray for a semiconductor package formed of a plurality of pockets, ribs in each pocket are connected to a rib support bar. The present invention relates to a tray of a semiconductor package that can be prevented from failing a package outer lead due to cracking of ribs.

In order to mount individual semiconductor chips separated from a wafer state on a printed circuit board (PCB), a product that has completed an assembly process such as electrical connection and encapsulation is called a package. The finished semiconductor package as a product is mounted in a tray and shipped to the user. The reason for supplying the semiconductor package in the tray is to prevent the damage of the outer lead of the package, to provide the ease of automatic operation when the user mounts the package on the printed circuit board, and to leave it at room temperature for a long time. When the package is dehumidified at high temperature, it is put in an oven with a tray for high temperature curing. Therefore, the tray for satisfying the above requirements should not have any change in appearance shape or dimension at room temperature as well as at least 125 ° C. or higher, free of harmful gases such as harmful to human body, and should be light to handle.

As the material of such a tray, polyphenylene oxide (Polyphenylene Oxide), polyethylene sulfide (polyethylene sulfide), polyphenylene sulfide (Polyphenylene sulfide), or the like, or a heat-resistant resin having similar characteristics is used.

When the tray is shipped to the user, a plurality of trays are stacked and packed in a paper box or the like as a bundle, and each tray is composed of several pockets, and one package is mounted in each pocket. In order to prevent the flow of the package inside the pocket, a fixing wall called rib is formed between the package body and the outer lid to protrude from the bottom surface of the pocket. The rib is formed of a resin-based material such as a tray, and a package used for a tray having a pocket in which the rib is formed has a shape of an outer lead such as a quad flat package (QFP) and a small outline package (SOP). Limited to Gull-Wing) packages.

Hereinafter, a conventional tray having ribs will be described with reference to the drawings.

1 is a perspective view showing a packaging tray of a semiconductor package according to an embodiment of the prior art.

FIG. 2 is a plan view illustrating the pocket of the tray shown in FIG. 1. FIG.

FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. 2 showing the semiconductor package mounted on the tray pocket shown in FIG.

First, referring to FIG. 1, the semiconductor package packaging tray 100 includes a plurality of pockets 120. Herein, the pocket 120 is a place where one semiconductor package is mounted, and means a recessed shape in a square shape. Each pocket and pocket is distinguished as a pocket wall 110. In addition, ribs 112 are formed in each of the pockets 120, and the bottom surface of the inside of the pocket 120 is the first bottom surface 126 and the second bottom surface 128 based on the ribs 112. Divided.

2 is a plan view of one pocket 120. And the cross section is shown in FIG. 3 illustrates a shape in which the semiconductor package 300 is mounted inside the pocket 120. 2 and 3, the semiconductor package 300 has a hang-wing type in the shape of the external lead 310, and is formed from the bottom surface of the pocket 120 between the package body 320 and the external lead 310. The rib 122 protrudes to prevent the flow of the package 300. The heights of the first bottom surface 126 and the second bottom surface 128 separated by the ribs 122 are different from each other because the height of the outer lids is lower than that of the bottom surface of the package body 320 of the semiconductor package 300. Since the 310 is formed further down, the package 300 is mounted in the pocket 120 so that the external lead is not impacted. That is, the second bottom surface 128 inside the rib 122 is higher than the first bottom surface 126 between the pocket wall 110 and the rib 122.

However, in the conventional tray structure as described above, since the rib 122 is inserted into a narrow space between the package body 320 and the outer lead 310, its width is inevitably thin. That is, the width of the conventional rib 122 is only 0.1 to 0.5mm. In addition, as described above, since the material of the rib 122 is resin-based, the strength thereof is weak. Therefore, when the tray is handled by the user, the tray may be impacted or shaken due to careless handling, and thus, the rib 122 may be broken.

4 is a cross-sectional view illustrating an example of a defect occurring in a tray pocket according to the related art shown in FIG. 3.

Referring to FIG. 4, as mentioned above, the width of the ribs may be thin. However, since the semiconductor package 300 tends to be larger and larger, the external lead 310 is easily damaged even with a slight external impact. In particular, in the package 300 of 2828 mm, 3030 mm, 3232 mm, and 4040 mm types, it is difficult to cope with conventional ribs. Once the tray is shocked or vibrated from the outside, the package 300 is shaken from side to side, and one rib is broken by the force (A). Therefore, the package 300 is pushed to the pocket wall 110, and a failure occurs in which the external lead 310 is bent or a failure in which the external lead 310 is unfolded by the other rib (B).

Therefore, in order to solve the above problems, even if the package is shaken by an external impact, even if a force is applied to the rib of the tray pocket, the rib is supported by the rib support-bar, thereby preventing the ribs from being broken, and thus the package. An object of the present invention is to provide a packaging tray for a semiconductor package which can prevent external lead defects of the semiconductor package.

1 is a perspective view showing a tray for packaging a semiconductor package according to an embodiment of the prior art.

2 is a plan view of the pocket of the tray shown in FIG.

3 is a cross-sectional view taken along line 3-3 of FIG. 2 showing the semiconductor package mounted on the tray pocket shown in FIG.

4 is a cross-sectional view showing an example of a failure occurring in the tray pocket according to the prior art shown in FIG.

Fig. 5 is a plan view showing a tray pocket in which a rib support bar is formed according to the first embodiment of the present invention.

6 is a cross-sectional view taken along line 6-6 of FIG. 5 showing the semiconductor package mounted on the tray pocket shown in FIG.

FIG. 7 is a plan view showing a tray pocket having rib support bars according to a second embodiment of the present invention; FIG.

FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 7 showing the semiconductor package mounted on the tray pocket shown in FIG.

9 is a plan view showing a tray pocket in which a package support bar is formed according to a third embodiment of the present invention;

FIG. 10 is a cross-sectional view taken along line 10-10 of FIG. 9 showing the semiconductor package mounted on the tray pocket shown in FIG.

* Explanation of symbols for the main parts of the drawings

100: Tray 120, 220, 230, 240: Pocket

110, 210: Pocket Wall 122, 222, 232: Rib

224, 234: Rib Support-Bar

244: Package Support-Bar

126, 226, 236, 246: first bottom surface 128, 228, 238, 248: second bottom surface

300: semiconductor package 310: outer lead

320: package body

In order to achieve the above object, the present invention is composed of a plurality of pockets (pitted) in the shape of a square and a pocket wall for separating the pockets from each other, each tray is a packaging tray for a semiconductor package in which one semiconductor package is mounted In the tray, the plurality of pockets are inserted between two bottom surfaces having different heights from each other and a body and an external lead of the semiconductor package to protrude from the two bottom surface boundaries to fix the semiconductor package. And a rib support-bar formed by integrally connecting four corners of the rib and four corners of the rib to support the rib. Provided is a packaging tray for a semiconductor package.

In addition, in order to achieve the above object, the present invention comprises a plurality of pockets (pitted) in the shape of a square and a pocket wall for separating the pockets from each other, each of the pockets for packaging a semiconductor package for mounting a semiconductor package In the tray, the plurality of pockets have a second bottom surface formed flat in the center portion of the pocket for mounting the semiconductor package, and having a height lower than that of the second bottom surface, between the second bottom surface and the pocket wall. A package support-bar protrudingly formed on the first bottom surface integrally from the four corners of the pocket wall to the outside of the second bottom surface to secure the semiconductor package, It provides a packaging tray for a semiconductor package comprising a Package Support-Bar.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 5 is a plan view showing a tray pocket in which rib support bars are formed according to a first embodiment of the present invention. FIG.

FIG. 6 is a cross-sectional view taken along line 6-6 of FIG. 5 showing the semiconductor package mounted on the tray pocket shown in FIG.

5 and 6, each individual pocket 220 formed in the tray is divided by the pocket wall 210, as in the case of the prior art described above, and the interior thereof. The rib 222 includes a rib 222, a first bottom surface 226, and a second bottom surface 228. Detailed descriptions of the ribs 222, the first bottom surface 226, and the second bottom surface 228 have already been made when describing the prior art, and thus will be omitted herein.

However, as the rib 222 is very thin in width, while the semiconductor package 300 is gradually enlarged, breakage of the rib 222 occurs frequently. Therefore, the present embodiment is to form a support means for the ribs 222 in order to reduce such defects, to strengthen the strength to better withstand the external impact applied to the ribs 222.

More specifically, as a support means for the rib 222, a rib support-bar 224, which integrally connects four corners of the rib 222 and four corners of the pocket wall 210, is provided. Is formed. The reason why the rib support-bar 224 is formed at the corner is that the outer lead 310 of the semiconductor package 300 is absent. The rib 222 is then formed over all of the boundaries of the first bottom surface 226 and the second bottom surface 228, the height of which is lower than the height of the pocket wall 210. In addition, since the rib support-bar 224 is formed to have a width wider on the pocket wall 210 side than the width on the rib 222 side, the strength supporting the rib 222 may be maximized. The height of the rib support-bar 224 is equal to the height of the rib 222. In addition, the rib support-bar 224 is made of a resin-based material such as the rib 222 and the tray, and thus can be easily manufactured.

Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

7 is a plan view illustrating a tray pocket having rib support bars according to a second embodiment of the present invention.

FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 7 showing the semiconductor package mounted on the tray pocket shown in FIG.

7 and 8, the pocket 230 of this embodiment also includes a rib 232, a first bottom surface 236, and a second bottom surface 238. As a support means for the rib 232, a rib support-bar 234 is formed in which four outer edges of the rib 232 and four corners of the pocket wall 210 are integrally connected. In this case, the rib 232 is formed only at a part of the boundary line between the first bottom surface 236 and the second bottom surface 238, unlike the case of the first embodiment described above, and the height thereof is lower than the height of the pocket wall 210. . The rib support-bar 234 is formed to be wider on the pocket wall 210 side than on the rib 232 side, the height of which is equal to the height of the rib 232.

The rib 232 is formed only in a portion of the boundary between the two bottom surfaces, for example, only in four corner portions as shown in the drawing. That is, even if the rib 232 is formed only in part, the package 300 is fixed at four corners, and thus the length of the entire rib 232 is reduced compared to the prior art without losing the original rib 232 function. Since the defect of the rib 232 can be reduced in probability. For this reason, ribs were removed at all in the third embodiment described later.

9 is a plan view showing a tray pocket having rib support bars according to a third embodiment of the present invention.

10 is a cross-sectional view taken along line 10-10 of FIG. 9 illustrating a semiconductor package mounted on a tray pocket shown in FIG. 9.

9 and 10, the pocket 240 of the present embodiment has rib support-bars 244 formed at four corners of the pocket wall 210 as in the two embodiments described above, but no ribs are formed. not. That is, the rib support-bar 244 of this embodiment is in charge of fixing the semiconductor package 300 instead of the conventional rib. Therefore, in the present exemplary embodiment, since the rib support bar directly supports the semiconductor package 300, the rib support bar is referred to as a package support bar 244. The package support-bar 244 is integrally formed to protrude on the first bottom surface 246 from the four corners of the pocket wall 210 to the outside of the second bottom surface 248.

Therefore, according to the structure of the present invention as described above, when the tray is shocked from the outside and the package mounted therein is shaken, the rib is supported by the rib support-bar even if the rib is forced from the package, so that the rib is not easily broken. There is no advantage.

In addition, as described above, the fracture of the rib is prevented, so that the package is pushed to the pocket wall by the destruction of the rib, thereby preventing the defect such as bending or unfolding of the external lead of the package.

Claims (9)

A plurality of pockets in a semiconductor package packaging tray comprising a plurality of pockets recessed in a rectangular shape and a pocket wall for distinguishing the pockets from each other, wherein one semiconductor package is mounted in each pocket. Silver, two ribs each having a different height from each other, a rib (Rib) which is inserted between the body and the outer lead of the semiconductor package protruding from the two bottom surface boundary lines for fixing the semiconductor package, And a rib support-bar formed by integrally connecting four outer edges of the rib and four corners of the pocket wall to support the rib. The packaging tray according to claim 1, wherein the ribs are formed over all of the boundary lines of the two bottom surfaces. The packaging tray of claim 1, wherein the rib is formed only at a portion of a boundary between the two bottom surfaces. The packaging tray of claim 1, wherein the rib support bar is formed to have a width at a pocket wall side wider than a width at a rib side. The packaging tray of claim 1, wherein the height of the ribs is lower than the height of the pocket walls. 6. The packaging tray of claim 5, wherein the height of the rib support bar is equal to the height of the rib. 2. The pocket of claim 1, wherein two bottom surfaces of the pocket are formed with a first bottom surface formed flat between the ribs and the pocket wall, and a second bottom formed flat inside the ribs of the pocket center portion for mounting the semiconductor package. A packaging tray for a semiconductor package, characterized in that the surface. The packaging tray according to claim 7, wherein the height of the second bottom surface is higher than the height of the first bottom surface. A plurality of pockets in a semiconductor package packaging tray comprising a plurality of pockets recessed in a rectangular shape and a pocket wall for distinguishing the pockets from each other, wherein one semiconductor package is mounted in each pocket. A second bottom surface formed flat in the center portion of the pocket for mounting the semiconductor package, a first bottom surface lower in height than the second bottom surface and formed flat between the second bottom surface and the pocket wall, A package support bar configured to integrally protrude from the four corners of the pocket wall to the outer periphery of the second bottom surface to fix the semiconductor package on the first bottom surface. Tray for packaging semiconductor packages.