JPH02199909A - Crystal resonator - Google Patents
Crystal resonatorInfo
- Publication number
- JPH02199909A JPH02199909A JP1793689A JP1793689A JPH02199909A JP H02199909 A JPH02199909 A JP H02199909A JP 1793689 A JP1793689 A JP 1793689A JP 1793689 A JP1793689 A JP 1793689A JP H02199909 A JPH02199909 A JP H02199909A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- spacer
- seal member
- lead terminal
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 19
- 125000006850 spacer group Chemical group 0.000 claims abstract description 21
- 239000011521 glass Substances 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 239000003566 sealing material Substances 0.000 claims description 32
- 239000011810 insulating material Substances 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 17
- 125000003700 epoxy group Chemical group 0.000 abstract 2
- 239000012774 insulation material Substances 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000005394 sealing glass Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は民生機器の発振回路などに用いられる水晶振動
子とその水晶振動子を使って構成した電子機器に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a crystal resonator used in an oscillation circuit of consumer equipment, and an electronic device constructed using the crystal resonator.
従来の技術
近年の電子機器は小形化、薄形化が進みその回路部品は
表面実装タイプが主流を占めるよりになっている。水晶
振動子においても従来の金属キャンタイプに代わりセラ
ミックケースを用いて構成したフラットタイプの製品が
提案されている。BACKGROUND OF THE INVENTION In recent years, electronic devices have become smaller and thinner, and surface-mounted circuit components have become mainstream. Flat-type crystal resonators have also been proposed that are constructed using a ceramic case instead of the conventional metal-can type.
第４図及び第６図は従来のフラットタイプ水晶振動子の
構造を示す部分断面図である。第４図において２８はセ
ラミックカバー、２９はセラミックケース、２７はリー
ド端子、２４は振動片、３０は低融点ガラスである。ま
た第６図において３６はセラミックカバー、３６はセラ
ミックケース。4 and 6 are partial cross-sectional views showing the structure of a conventional flat type crystal resonator. In FIG. 4, 28 is a ceramic cover, 29 is a ceramic case, 27 is a lead terminal, 24 is a vibrating piece, and 30 is a low melting point glass. Further, in Fig. 6, 36 is a ceramic cover, and 36 is a ceramic case.
３４はメタライズ電極、３１は振動片、３７は封止材で
ある。34 is a metallized electrode, 31 is a vibrating piece, and 37 is a sealing material.
上記構成において第４図ではセラミックカバー２８にガ
ラスペーストを塗布し仮焼成した後、リード端子２７ｆ
ｔセラミツクカバー２８に仮止めし振動片２４をリード
端子２７の保持部に導電ペースト２６により接着硬化さ
せ、周波数を微調整してから、ガラスペーストを塗布し
仮焼成したセラミックケース２９全組み合わせてＮ２雰
囲気で加熱することで低融点ガラス３０により気密封止
し、水晶振動子を形成していた。また第５図ではセラミ
ックカバー３６に端子３４をメタライズし、通常振動片
３１を導電ペースト３３によシ直接セラミックカバー３
６に接着硬化させ、周波数を微調整してから封止材３７
を塗布したセラミックケース３６を組み合わせてＮ２雰
囲気で加熱することで封止材３７で気密封止し、水晶振
動子を形成していた。第５図の封止材３７にはエポキシ
系の樹脂接着剤がよく使われるが低融点ガラスを採用し
たものもある。なお３２は電極である。In the above configuration, in FIG. 4, after applying glass paste to the ceramic cover 28 and pre-firing, the lead terminal 27f is
t The ceramic case 29 is temporarily fixed to the ceramic cover 28, the vibrating piece 24 is bonded and hardened to the holding part of the lead terminal 27 with conductive paste 26, the frequency is finely adjusted, glass paste is applied, and the ceramic case 29 is pre-fired. By heating in an atmosphere, the glass was hermetically sealed with low melting point glass 30 to form a crystal resonator. In addition, in FIG. 5, the terminal 34 is metallized on the ceramic cover 36, and the vibrating element 31 is usually transferred directly to the ceramic cover 36 with a conductive paste 33.
6, and after finely adjusting the frequency, apply the sealing material 37.
A ceramic case 36 coated with the above was combined and heated in an N2 atmosphere to be hermetically sealed with a sealing material 37 to form a crystal resonator. Epoxy resin adhesive is often used as the sealing material 37 in FIG. 5, but low melting point glass is also sometimes used. Note that 32 is an electrode.
発明が解決しようとする課題
しかし、第４図のような低融点ガラス３０を用いて気密
封止した製品については次のような課題があった。第一
に、低融点ガラス３０で気密封止するときの作業温度は
４３０’Ｃ前後であるので、振動片２４を接着硬化させ
る導電ペースト２６が、封着時に樹脂分が熱分解するな
ど技術的に問題が多い。第二に、前述のように導電ペー
スト２６の樹脂分が熱分解するため、封着時のセラミッ
クケース２９内圧が高くなり、この結果低融点ガラス３
ｏを押し出してしまい、リード端子２７の端子強度や気
密性に悪影響を及ぼしていた。第三に、。Problems to be Solved by the Invention However, there are the following problems with products hermetically sealed using low melting point glass 30 as shown in FIG. First, since the working temperature when hermetically sealing with the low melting point glass 30 is around 430'C, the conductive paste 26 that adheres and hardens the vibrating element 24 has technical problems such as thermal decomposition of the resin during sealing. There are many problems. Second, as described above, the resin component of the conductive paste 26 is thermally decomposed, so the internal pressure of the ceramic case 29 increases during sealing, and as a result, the low melting point glass 3
The terminal strength and airtightness of the lead terminal 27 were adversely affected. Third,.
同じ封着時の温度によフ振動片２４の表裏に配した電極
２６が変質し易く、封着後の周波数の歩留まりに大きく
影響していた。また第６図に示す樹脂の封止材３７を用
いた製品では、リード端子を気密封止しようとしてもリ
ード端子と封止材３Ｔの間で気密性の信頼性を得ること
が非常に困難であるので、メタライズによる端子３４を
配しているが、この場合は導電ペーストにより直接セラ
ミックカバー３６に振動片３１を支持させるので、周波
数の安定度では一般の水晶振動子より劣るものになるの
であった。The electrodes 26 disposed on the front and back sides of the vibrating piece 24 tend to change in quality due to the same temperature during sealing, which greatly affects the frequency yield after sealing. Furthermore, in the product using the resin sealing material 37 shown in Fig. 6, it is extremely difficult to obtain reliable airtightness between the lead terminal and the sealing material 3T even if an attempt is made to hermetically seal the lead terminal. Therefore, a terminal 34 made of metallization is arranged, but in this case, the vibrating element 31 is directly supported by the ceramic cover 36 using conductive paste, so the frequency stability is inferior to that of a general crystal resonator. Ta.
そこで本発明は第４図のごとくリード端子を用いるもの
において、このリード端子や振動片の保持が適切に行わ
れるようにした水晶振動子を提供すること全目的とする
ものである。Therefore, an object of the present invention is to provide a crystal resonator that uses lead terminals as shown in FIG. 4, in which the lead terminals and the vibrating element can be properly held.
課題を解決するための手段
そして上記目的を達成するために本発明は、絶縁材から
成る第一のカバーと、この第一のカバー上に低融点ガラ
スよりなる第一の封止材を介して固定されるとともに、
中央部を開口したスペーサーと、このスペーサーの開口
部内に設けられた振動片と、この振動片に接続されると
ともに前記第一の封止材を介してスペーサー外に引き出
されたリード端子と、前記スペーサー上に樹脂接着剤よ
りなる第二の封止材を介して固定された第二のカバーと
から水晶振動子を構成するものである。Means for Solving the Problems and In order to achieve the above object, the present invention provides a first cover made of an insulating material, and a first sealing material made of low melting point glass on the first cover. Along with being fixed,
a spacer with an opening in the center; a vibrating piece provided in the opening of the spacer; a lead terminal connected to the vibrating piece and drawn out of the spacer via the first sealing material; A crystal resonator is constituted by a second cover fixed onto the spacer via a second sealing material made of a resin adhesive.
作用
上記構成により第一の封止材によりリード端子を大気中
で適切なハーメチックシールでき、その後振動片を保持
し、最後に第二のカバーを比較的作業温度が低い第二の
封止材により気密封止できるため一般的な導電ペースト
が使用でき封着時振動片の電極の変質もなくなる。Effect: With the above configuration, the lead terminals can be properly hermetically sealed in the atmosphere by the first sealing material, and then the vibrating piece is held, and finally the second cover is sealed by the second sealing material, which has a relatively low working temperature. Since it can be hermetically sealed, a general conductive paste can be used, and there is no deterioration of the electrodes of the vibrating element during sealing.
実施例
第１図は本発明の一実施例を示す部分断面図であり、１
は絶縁材からなる第一のカバー、２は絶縁材からなる第
二のカバー、３は絶縁材からなるスペーサー、６はリー
ド端子、８は振動片、７は導電ペースト、４は第一〇封
止材、６は第二の封止材である。Embodiment FIG. 1 is a partial sectional view showing an embodiment of the present invention.
1 is a first cover made of an insulating material, 2 is a second cover made of an insulating material, 3 is a spacer made of an insulating material, 6 is a lead terminal, 8 is a vibrating piece, 7 is a conductive paste, 4 is a first seal The sealing material 6 is a second sealing material.
本発明の一実施例では、第一の封止材４には低融点ガラ
ス、第二の封止材５には樹脂接着剤を用いている。まず
セラミックから成る中央部を開口したスペーサー３の縁
部に封着ガラスペーストを“塗布し、絶縁材から成る第
一のカバー１にも封着ガラスベース）ｌ塗布してそれぞ
れを仮焼成し、前記スペーサー３及びカバー１の間にリ
ード端子６を配して大気中で加熱することにより一体化
してベース部を形成する。次に振動片８をリード端子６
の保持部に一般的なエポキシ系の導電ペースト７により
保持すると共に電気的に導通せしめた後、第二のカバー
２をエポキシ系の樹脂接着剤よりなる第二の封止材５に
よフ前記スペーサー３上に封着し、水晶振動子を構成し
ている。In one embodiment of the present invention, the first sealing material 4 is a low melting point glass, and the second sealing material 5 is a resin adhesive. First, a sealing glass paste is applied to the edge of the spacer 3 made of ceramic with an open center, and the first cover 1 made of an insulating material is also applied with a sealing glass base), and each is pre-fired. A lead terminal 6 is disposed between the spacer 3 and the cover 1 and heated in the atmosphere to form an integral base part.Next, the vibrating piece 8 is attached to the lead terminal 6.
After holding the second cover 2 on the holding part with a general epoxy-based conductive paste 7 and making it electrically conductive, the second cover 2 is sealed with a second sealing material 5 made of an epoxy-based resin adhesive. It is sealed on the spacer 3 to constitute a crystal resonator.
上記の構成によって、リード端子６は予め封着ガラスベ
ースＩ−ｉ塗布し仮焼成した第一のカバー１及びスペー
サー３間の第一の封止材４によって大気雰囲気でハーメ
チックシールできる。またこの時、スペーサー３の上方
は開放されているため、気圧の差による第一の封止材４
のはみ出しもないので、気密性に対して優れた信頼性が
得られた。With the above structure, the lead terminals 6 can be hermetically sealed in the air by the first sealing material 4 between the first cover 1 and the spacer 3, which has been preliminarily applied to the sealing glass base I-i and pre-sintered. Also, at this time, since the upper part of the spacer 3 is open, the first sealing material 4 due to the difference in air pressure
Since there was no protrusion, excellent reliability regarding airtightness was obtained.
また振動片８の接着以後の工程には低融点ガラスで封着
するような高温下での作業がないので、導電ペースト７
は一般的なエポキシ系が使用できるようになり、さらに
振動片８の電極９の変質もなくなり気密封止前後の周波
数の変化も小さくできた。In addition, since the process after adhering the vibrating piece 8 does not involve work under high temperature such as sealing with low melting point glass, the conductive paste 7
It is now possible to use a general epoxy system, and furthermore, the deterioration of the electrode 9 of the vibrating element 8 is eliminated, and the change in frequency before and after hermetic sealing can be reduced.
第２図は本発明の他の一実施例を示す部分断面図であり
、１０．１１は金属材からなる第一、第二のカバー、１
２は絶縁材からなるスペーサー１６はリード端子、１７
は振動片、１６は導電ペースト、１３は低融点ガラスよ
シなる第一の封止材、１４は樹脂接着剤よりなる第二の
封止材である。FIG. 2 is a partial sectional view showing another embodiment of the present invention, and 10.11 is a first and second cover made of a metal material;
2 is a spacer made of insulating material 16 is a lead terminal, 17
16 is a vibrating piece, 16 is a conductive paste, 13 is a first sealing material made of low melting point glass, and 14 is a second sealing material made of resin adhesive.
本発明の第２図の実施例は、第一の実施例における第一
のカバー１および第二のカバー２を、絶縁性のセラミッ
クから金属材に代えたものである。In the embodiment of the present invention shown in FIG. 2, the first cover 1 and the second cover 2 in the first embodiment are made of metal instead of insulating ceramic.
つまり第一、第二のカバー１０．１１の材質を金属にす
ることにより製品の厚みをより薄くすることができると
共にコストダウンが図れる。In other words, by using metal as the material for the first and second covers 10.11, the thickness of the product can be made thinner and costs can be reduced.
また第一、第二の封止材の接着面積は広い方が気密性に
関して有利であるので、第３図のように少なくとも第二
のカバー１１をスペーサー１２より大きくすることによ
って封着時に第二のカバー１１が多少ずれても気密性の
信頼性を良くする・ことも考えられる。Furthermore, since it is advantageous for airtightness to have a larger adhesion area between the first and second sealants, by making at least the second cover 11 larger than the spacer 12 as shown in FIG. It is also possible to improve the reliability of airtightness even if the cover 11 is slightly shifted.
なお本発明では第二の封止材６，１４にはエポキシ系の
樹脂接着剤を使用したが耐湿性、接着強度が問題なけれ
ば他の樹脂接着剤も使用できる。In the present invention, an epoxy resin adhesive is used for the second sealing materials 6 and 14, but other resin adhesives may be used if moisture resistance and adhesive strength are not a problem.
また高融点半田など金属封止材も作業温度が３００℃前
後までであれば使用できる。Further, metal sealing materials such as high melting point solders can also be used as long as the working temperature is up to around 300°C.
さらに本発明の水晶振動子を使って構成した電子機器は
部品の実装密度を上げると共に実装コストを低減できる
。Furthermore, electronic devices configured using the crystal resonator of the present invention can increase the packaging density of components and reduce packaging costs.
発明の効果
上記の説明で明らかなように本発明の水晶振動子では低
融点ガラスよりなる第一の封止材でリード端子を大気中
でハーメチックシールできるため、気密性の信頼性が良
くなる。またその後振動片を保持し最後に第二のカバー
を比較的作業温度が低い第二の封止材により気密封止で
きるため、振動片保持用として一般的な導電ペーストが
使用できコストダウンが図れると共に、振動片の保持に
対する信頼性も良くなる。また第二の封止材はエポキシ
系の樹脂接着剤を用いると１２０℃から１８０℃程度で
硬化できるので、振動片の電極の変質もなくなり製品の
周波数偏差を小さくすることができる。Effects of the Invention As is clear from the above description, in the crystal resonator of the present invention, the lead terminals can be hermetically sealed in the atmosphere with the first sealing material made of low-melting point glass, thereby improving the reliability of airtightness. Furthermore, since the vibrating element can be held and finally the second cover can be hermetically sealed with a second sealing material that has a relatively low working temperature, a general conductive paste can be used to hold the vibrating element, reducing costs. At the same time, the reliability of holding the vibrating element also improves. Furthermore, if an epoxy-based resin adhesive is used as the second sealing material, it can be cured at a temperature of about 120° C. to 180° C., thereby eliminating deterioration of the electrodes of the vibrating element and making it possible to reduce the frequency deviation of the product.
第１図は本発明の一実施例における水晶振動子の構造を
示す部分断面図、第２図、第３図は本発明の他の実施例
を示す部分断面図、第４図、第６図は従来の水晶振動子
の構造を示す部分断面図である。
１・・・・・・第一のカバー１２・・・・・・第二のカ
バー、３・・・・・・スペーサー、４・・・・・・第一
の封止材、６・・・・・・第二の封止材、６・・・・・
・リード端子、７・・・・・・導電ペースト、８・・・
・・・振動片、９・・・・・・電極。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名／
°−＠ ／の汝バー
２−第２の方バー
３−ｍ−スイーブー
４− 窮ｊの封止材
Ｓ・−第２の封止材
ぶ・−リートｔ＠子
７− 導電ヘースト
８−扱動片
９− 翫丘
σ卒ごFIG. 1 is a partial cross-sectional view showing the structure of a crystal resonator in one embodiment of the present invention, FIGS. 2 and 3 are partial cross-sectional views showing other embodiments of the present invention, and FIGS. 4 and 6. is a partial cross-sectional view showing the structure of a conventional crystal resonator. DESCRIPTION OF SYMBOLS 1... First cover 12... Second cover, 3... Spacer, 4... First sealing material, 6... ...Second sealing material, 6...
・Lead terminal, 7... Conductive paste, 8...
... Vibration piece, 9... Electrode. Name of agent: Patent attorney Shigetaka Awano and 1 other person/
°-＠/'s bar 2-second bar 3-m-swee-boo 4-containing sealing material S・-second sealing material b・-leat t@ko 7-conductive heat 8-handling Moving piece 9 - Kankyu σ graduation
Claims (4)
ー上に低融点ガラスよりなる第一の封止材を介して固定
されるとともに、中央部が開口したスペーサーと、この
スペーサーの開口部内に設けられた振動片と、この振動
片に電気的に接続されるとともに、前記第一の封止材部
を介してスペーサー外に引き出されたリード端子と、前
記スペーサー上に樹脂接着剤よりなる第二の封止材を介
して固定した第二のカバーとから構成した水晶振動子。(1) A first cover made of an insulating material, a spacer fixed to the first cover via a first sealing material made of low melting point glass, and having an opening in the center; A vibrating piece provided in the opening, a lead terminal that is electrically connected to the vibrating piece and pulled out to the outside of the spacer through the first sealing material part, and a resin adhesive on the spacer. and a second cover fixed via a second sealing material made of.
少なくとも一つが金属材からなる特許請求の範囲第１項
記載の水晶振動子。(2) The crystal resonator according to claim 1, wherein at least one of the spacer, the first cover, and the second cover is made of a metal material.
した特許請求の範囲第１項または第２項記載の水晶振動
子。(3) The crystal resonator according to claim 1 or 2, wherein the second cover has a larger outer diameter than the spacer.
記載の水晶振動子を使って構成した電子機器。(4) An electronic device constructed using the crystal resonator according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1793689A JPH02199909A (en) | 1989-01-27 | 1989-01-27 | Crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1793689A JPH02199909A (en) | 1989-01-27 | 1989-01-27 | Crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02199909A true JPH02199909A (en) | 1990-08-08 |
Family
ID=11957665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1793689A Pending JPH02199909A (en) | 1989-01-27 | 1989-01-27 | Crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02199909A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999009647A1 (en) * | 1997-08-19 | 1999-02-25 | Miyota Co., Ltd. | Piezoelectric vibrator |
-
1989
- 1989-01-27 JP JP1793689A patent/JPH02199909A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999009647A1 (en) * | 1997-08-19 | 1999-02-25 | Miyota Co., Ltd. | Piezoelectric vibrator |
| GB2345397A (en) * | 1997-08-19 | 2000-07-05 | Citizen Watch Co Ltd | Piezoelectric vibrator |
| GB2345397B (en) * | 1997-08-19 | 2001-10-31 | Citizen Watch Co Ltd | Piezoelectric vibrator |
| US6396201B1 (en) | 1997-08-19 | 2002-05-28 | Miyota Co., Ltd. | Piezoelectric vibrator |
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