JPH0219977B2 - - Google Patents
Info
- Publication number
- JPH0219977B2 JPH0219977B2 JP57038081A JP3808182A JPH0219977B2 JP H0219977 B2 JPH0219977 B2 JP H0219977B2 JP 57038081 A JP57038081 A JP 57038081A JP 3808182 A JP3808182 A JP 3808182A JP H0219977 B2 JPH0219977 B2 JP H0219977B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrodes
- electrode
- holes
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H10W70/699—
-
- H10W90/724—
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57038081A JPS58155747A (ja) | 1982-03-12 | 1982-03-12 | Ic基板の製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57038081A JPS58155747A (ja) | 1982-03-12 | 1982-03-12 | Ic基板の製法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58155747A JPS58155747A (ja) | 1983-09-16 |
| JPH0219977B2 true JPH0219977B2 (enExample) | 1990-05-07 |
Family
ID=12515526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57038081A Granted JPS58155747A (ja) | 1982-03-12 | 1982-03-12 | Ic基板の製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58155747A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0517269Y2 (enExample) * | 1986-05-15 | 1993-05-10 | ||
| JPH01108798A (ja) * | 1987-10-21 | 1989-04-26 | Nec Corp | プリント配線板の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010564A (enExample) * | 1973-05-25 | 1975-02-03 |
-
1982
- 1982-03-12 JP JP57038081A patent/JPS58155747A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58155747A (ja) | 1983-09-16 |
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